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XPC850DSLZT50BU

NXP Semiconductors

XPC850DSLZT50BU by NXP Semiconductors

NXP Semiconductors XPC850DSLZT50BU microprocessor features 32-bit architecture, 26-bit address bus width, and integrated cache. Ideal for applications requiring low power consumption, it operates at speeds up to 50 rpm with a supply voltage range of 3.135V to 3.465V.

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Digiode

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Vyrian

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Anansix

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MRC Electronics

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Component Sense

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Connect4Technologies Inc.

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ACDS - Activité Composants Distribution Service

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Semi Source

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Nova Conductors

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PC Components Company LLC

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Bristol Electronics

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ComSIT Distribution GmbH

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One Stop Electronics

USA . 1,389 parts In-Stock

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Microchip USA

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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Corohmni

South Africa . 7 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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UNI Independent Distributors

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Argo Parts USA

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Corphita

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Aranea Global

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Continental Prestige Electronics

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Metaverse IC Inc.

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Kepictronics

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ChipstoGo Electronic ltd

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Cyclops Electronics Ltd (Excess)

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Overview

Unleash the power of innovation with the XPC850DSLZT50BU by NXP Semiconductors. This cutting-edge microprocessor offers unparalleled performance and reliability, making it the top choice for a wide range of applications. From automotive to industrial automation, this versatile chip delivers exceptional speed and efficiency. With its advanced technology and high-quality design, the XPC850DSLZT50BU guarantees value and benefits that will take your projects to the next level. Trust NXP Semiconductors for quality you can rely on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and resistance to damage, making this product suitable for a wide range of applications.

Integrated Cache: YES

Integrated cache enhances the processing speed and efficiency of the microprocessor, improving overall performance.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on PCBs, making this microprocessor versatile and convenient to use.

Maximum Supply Voltage: 3.465 V

Higher maximum supply voltage provides flexibility in power management and compatibility with various systems and components.

Address Bus Width: 26

A wider address bus allows for more efficient data transfer and can handle larger memory capacities, optimizing overall system performance.

Package Shape: SQUARE

Square package shape allows for efficient use of space on PCBs and can facilitate easier cooling and heat dissipation.

Bit Size: 32

32-bit processing capability ensures compatibility with modern software and applications, delivering smooth and efficient performance.

No. of Terminals: 256

Higher number of terminals provide more connectivity options and capability for expansion, making this microprocessor versatile and adaptable.

Package Style (Meter): GRID ARRAY

Grid array package style offers better connectivity and reliability, ensuring stable performance in demanding applications.

Minimum Supply Voltage: 3.135 V

Lower minimum supply voltage helps in reducing power consumption and heat generation, enhancing energy efficiency and prolonging the lifespan of the microprocessor.

Maximum Operating Temperature: 95 °C

High maximum operating temperature tolerance ensures reliable performance in harsh environments and under heavy workloads, improving overall system durability.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for reliable performance even in cold conditions, making this microprocessor suitable for a wide range of environments.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy installation and secure connectivity, ensuring stable performance in various applications.

Maximum Seated Height: 2.35 mm

Low maximum seated height enables compact design and efficient use of space, making this microprocessor suitable for slim and space-constrained devices.

Width: 23 mm

Compact width allows for easy integration into different systems and devices, offering flexibility in design and application.

Boundary Scan: YES

Boundary scan feature allows for efficient testing and debugging of the microprocessor, ensuring reliable performance and easy maintenance.

External Data Bus Width: 32

Wider external data bus width enables faster data transfer and processing speeds, enhancing overall system performance and responsiveness.

Length: 23 mm

Compact length allows for efficient use of space on PCBs and in devices, enabling versatile and space-saving design options.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture offers superior performance and efficiency in processing tasks, making this microprocessor suitable for high-speed computing applications.

Technology: CMOS

CMOS technology provides low power consumption and high speed operation, ensuring efficient performance and longer battery life in portable devices.

Terminal Form: BALL

Ball terminal form facilitates reliable connectivity and soldering, ensuring stable performance and durability in various applications.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable performance, enhancing system stability and compatibility with different components.

Terminal Pitch: 1.27 mm

Compact terminal pitch allows for dense packing and efficient use of space on PCBs, enabling versatile design options and integration possibilities.

Format: FIXED POINT

Fixed-point format offers simplicity and efficiency in processing arithmetic operations, making this microprocessor suitable for a wide range of computational tasks.

Speed: 50 rpm

High processing speed of 50 rpm ensures fast and efficient operation, enabling quick response times and smooth performance in demanding applications.

Low Power Mode: YES

Low power mode feature allows for efficient energy saving and extended battery life, making this microprocessor suitable for mobile and battery-powered devices.

Technical Specifications

Microprocessors XPC850DSLZT50BU attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B256

Length:

23 mm

Low Power Mode:

YES

No. of Terminals:

256

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.35 mm

Speed:

50 rpm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

XPC850DSLZT50BU Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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