Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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NXP Semiconductors XPC8240LZU200E microprocessor features 32-bit address and data bus width, with a clock frequency of 66 MHz. Suitable for low power applications, it has integrated cache memory and supports boundary scan testing.
Median Price
$65.893
Lifecycle Status
Suppliers In-Stock
15
In-Stock Inventory
1k+
Freelance Electronics
1+ parts
100+ parts
-
1k+ parts
10k+ parts
Vyrian
Digiode
Anansix
Nova Conductors
J & M Industries LLC
Bristol Electronics
North Shore Components
Atlantic Semiconductor
Electronics Depot
Zilex Electronics Inc.
Semi Source
PC Components Company LLC
R&J Components
Velocity Electronics
One Stop Electronics
$4.000
Ampacity Inc.
$9.000
Corohmni
$29.155
Component Stockers USA
$99.990
UNI Independent Distributors
Argo Parts USA
Corphita
Continental Prestige Electronics
Perfect Parts
Aranea Global
Microchip USA
GreenTree Electronics
Authorized Procurement Solutions
Assy Fe
This material is lightweight and durable, making the product easy to handle and resistant to damage.
Having integrated cache helps in improving the processing speed and efficiency of the microprocessor.
Being surface mountable makes it easier to integrate the microprocessor onto circuit boards, saving space and enhancing reliability.
This voltage rating allows for efficient power consumption while ensuring safe operation of the microprocessor.
A wider address bus allows for larger memory addressability, enabling the microprocessor to handle more data effectively.
The square package shape facilitates uniform distribution of components, enhancing mechanical stability and ease of assembly.
With a 32-bit architecture, the microprocessor can handle larger chunks of data and perform complex calculations with improved accuracy.
Having a high number of terminals enables the microprocessor to connect with a wide range of external devices for versatile applications.
The grid array package style with a low profile design allows for efficient thermal management and compact integration in electronic devices.
Even with a low supply voltage, the microprocessor can maintain stable performance and energy efficiency.
The high maximum operating temperature ensures reliable operation even under demanding environmental conditions.
Multiple external interrupts provide flexibility in handling real-time events and enhancing system responsiveness.
The ability to operate at 0°C ensures reliable performance in cold environments.
Bottom terminal position enables easy soldering and secure connection to PCBs for stable performance.
The low seated height allows for slim device designs and efficient heat dissipation.
Compact width dimensions make it suitable for space-constrained applications while maintaining high performance.
The boundary scan feature enables efficient testing and debugging of the microprocessor, reducing development time and costs.
A wide external data bus width enables high-speed communication with peripherals and improves overall system performance.
With a high clock frequency, the microprocessor can process instructions quickly and deliver smooth performance.
Compact length dimensions contribute to overall space-saving design and ease of integration.
The RISC architecture of the microprocessor offers simplified instruction set and enhanced processing efficiency for various applications.
CMOS technology ensures low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.
Ball terminal form allows for reliable connections and easier soldering during assembly, ensuring secure device operation.
The nominal supply voltage provides a balanced combination of power efficiency and performance for the microprocessor.
Having dedicated DMA channels enhances data transfer efficiency and reduces CPU workload, improving overall system performance.
The tight terminal pitch enables high-density mounting, saving space on PCBs and enabling compact device designs.
Support for floating-point format enhances mathematical precision and accuracy in computational tasks, making the microprocessor suitable for scientific and engineering applications.
The high speed capability of 200 rpm ensures fast data processing and efficient performance in demanding applications.
The low power mode feature allows the microprocessor to operate in an energy-efficient state, increasing battery life and reducing overall power consumption.
Microprocessors XPC8240LZU200E attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Address Bus Width:
Bit Size:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
Length:
Low Power Mode:
No. of DMA Channels:
No. of External Interrupts:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
Peripheral IC Type:
XPC8240LZU200E Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
LM7805CT
Fairchild Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
CRG0805F10K
TE Connectivity
TE Connectivity's CRG0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in various electronic circuits due to its compact size and high temperature rating.
BSS138-TP
Micro Commercial Components
BSS138-TP by Micro Commercial Components is a N-channel small signal FET with a min DS breakdown voltage of 50V and max drain current of 0.22A. It is commonly used in applications requiring enhancement mode operation, such as power management and switching circuits.
LL4148
General Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
STM32H753ZIT6
STMicroelectronics
STM32H753ZIT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 20-Ch 16-Bit ADC and 2-Ch 12-Bit DAC channels. With a clock frequency of up to 48 MHz, it is ideal for industrial applications requiring CAN, Ethernet, and USB connectivity. This microcontroller operates b/w -40°C to +85°C temperature range.
SMBJ18CA
Rectron
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99WT1G
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Crimson Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM358AN
Signetics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Lite-on Semiconductor
Silicon Standard
M39029/56-351
Glenair
CONNECTOR ACCESSORY; Associated Backshell Military - Specifications: MIL-DTL-38999; Material: COPPER ALLOY; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: FEMALE; DIN Conformity: NO;
SS14
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Non Repetitive Peak Forward Current: 40 A; Technology: SCHOTTKY; No. of Elements: 1;
ATMEGA328P-AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE;
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Operating Temperature (TJ-Min): 0 Cel; Technology: BIPOLAR;
National Semiconductor
LM317T
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
IRLML6401TRPBF
Infineon Technologies
IRLML6401TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 12V DS Breakdown Voltage, 34A IDM, and 0.05ohm RDS(on). With a small outline package style, it operates in an ambient temperature range of -55 to 150 °C.
2N7002
Transys Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 60 V; Maximum Operating Temperature: 150 Cel;
MBRS340T3G
Onsemi
MBRS340T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 4A. It operates b/w -65°C to 150°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package. The diode's matte tin terminal finish and dual position make it ideal for surface mount PCB designs.
MCF54452VR266
Freescale Semiconductor
MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE;
MPC860TZQ80D4
NXP Semiconductors
The NXP Semiconductors MPC860TZQ80D4 is a 32-bit microprocessor with integrated cache and 3.3V power supply, suitable for applications requiring low power mode and boundary scan capability. With a max clock frequency of 50MHz, it is ideal for use in embedded systems that demand high-speed processing within a compact form factor.
MC7448VU800ND
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 360; Package Code: LGA; Package Shape: SQUARE;
MPC860TVR80D4
The NXP Semiconductors MPC860TVR80D4 is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 50 MHz. It features a low power mode and is suitable for applications requiring high-speed processing in compact devices. With a terminal pitch of 1.27 mm and boundary scan capability, it offers efficient performance in various electronic systems.
MCIMX6S7CVM08AB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; External Data Bus Width: 32;
MIMXRT1165XVM5A
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
STM32MP153DAA1
MICROPROCESSOR, RISC;
MPC8270ZQMIBA
MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;
AM3352BZCZA100
Texas Instruments
AM3352BZCZA100 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 64 DMA channels. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and fixed point format processing. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.8 mm.
CL8064701483802SR17L
Intel
Intel CL8064701483802SR17L microprocessor features 64-bit size, 1364 terminals in a grid array package style. With integrated cache and CMOS technology, it operates at a speed of 3400 rpm. Ideal for high-performance computing applications requiring advanced processing power.
STM32MP131CAE3
STM32MP131CAE3 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 8-bit on-chip data RAM. It operates at a max clock frequency of 48 MHz, suitable for low power applications in various industries like IoT, automotive, and consumer electronics. With a wide address bus width of 26 bits and external data bus width of 16 bits, it offers high performance in a compact square package shape.
MCF5251VM140
The NXP Semiconductors MCF5251VM140 microprocessor features a 32-bit architecture, 24-bit address bus width, and integrated cache. It is suitable for applications requiring a max clock frequency of 140 MHz, such as embedded systems and industrial automation. With a low profile grid array package style and ball terminal form, it offers reliable performance in commercial-grade environments.
ATSAMA5D35A-CNR
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;
P1010NXE5HFB
The NXP Semiconductors P1010NXE5HFB microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates b/w -40 to 105°C with a max supply voltage of 1.05V. This CMOS technology-based processor is designed for high-speed performance in various embedded systems.
MIMXRT1015CAF4B
The NXP Semiconductors MIMXRT1015CAF4B microprocessor features a 32-bit architecture with integrated cache and 131072 RAM words. It operates at speeds up to 24 MHz, suitable for industrial applications requiring low power consumption. With 32 DMA channels and 6 serial I/Os, it offers versatile connectivity options in a compact square package.
MC7448TVU1267ND
MC7448TVU1267ND by NXP Semiconductors is a microprocessor with integrated cache and a max clock frequency of 200 MHz. It has a low power mode and is suitable for applications requiring high processing speed, such as embedded systems and industrial automation.
STM32MP151FAC1
STM32MP135AAE3
STM32MP135AAE3 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 172032 RAM words. It features an address bus width of 26, external data bus width of 16, and operates at a max clock frequency of 48 MHz. Ideal for low power applications requiring high-speed processing capabilities.
STM32MP157CAA3
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
ATSAMA5D35A-CU
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XPC8240LZU200E
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Nominal Supply Voltage: 2.5 V;
Motorola
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XPC860SRZP50C1
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 3.465 V;
XPC850DSLZT50BU
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 50 MHz;
XPC823ZC75A
MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
XPC821ZP50
Microprocessors;
XPC823ZT25Z3
XPC823ZT50Z3
XPC823ZC66A
XPC801ZP40
XPC823ZC81A
XPC823ZT66A
XPC823ZT75A
XPC823CZT25Z3
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
XPC823EZT66B2
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Length: 23 mm;
XPC823CZT66B
XPC801ZP25
XPC8240LZU200LB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Surface Mount: YES;
Supply Digital Components
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