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XPC8240LZU200E

NXP Semiconductors

XPC8240LZU200E by NXP Semiconductors

NXP Semiconductors XPC8240LZU200E microprocessor features 32-bit address and data bus width, with a clock frequency of 66 MHz. Suitable for low power applications, it has integrated cache memory and supports boundary scan testing.

Median Price

$65.893

Lifecycle Status

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Overview

Discover the power and performance of the XPC8240LZU200E by NXP Semiconductors, a cutting-edge microprocessor that promises top-tier quality and reliability. Ideal for a wide range of applications, this product boasts integrated cache and low power mode, making it perfect for high-demand tasks. With NXP's stellar reputation for innovation and excellence in semiconductor technology, customers can trust that they are getting a product that delivers value, efficiency, and unmatched benefits. Upgrade your systems with the XPC8240LZU200E and experience a new level of speed and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Integrated Cache: YES

Having integrated cache helps in improving the processing speed and efficiency of the microprocessor.

Surface Mount: YES

Being surface mountable makes it easier to integrate the microprocessor onto circuit boards, saving space and enhancing reliability.

Maximum Supply Voltage: 2.625 V

This voltage rating allows for efficient power consumption while ensuring safe operation of the microprocessor.

Address Bus Width: 32

A wider address bus allows for larger memory addressability, enabling the microprocessor to handle more data effectively.

Package Shape: SQUARE

The square package shape facilitates uniform distribution of components, enhancing mechanical stability and ease of assembly.

Bit Size: 32

With a 32-bit architecture, the microprocessor can handle larger chunks of data and perform complex calculations with improved accuracy.

No. of Terminals: 352

Having a high number of terminals enables the microprocessor to connect with a wide range of external devices for versatile applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array package style with a low profile design allows for efficient thermal management and compact integration in electronic devices.

Minimum Supply Voltage: 2.375 V

Even with a low supply voltage, the microprocessor can maintain stable performance and energy efficiency.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliable operation even under demanding environmental conditions.

No. of External Interrupts: 5

Multiple external interrupts provide flexibility in handling real-time events and enhancing system responsiveness.

Minimum Operating Temperature: 0 °C

The ability to operate at 0°C ensures reliable performance in cold environments.

Terminal Position: BOTTOM

Bottom terminal position enables easy soldering and secure connection to PCBs for stable performance.

Maximum Seated Height: 1.65 mm

The low seated height allows for slim device designs and efficient heat dissipation.

Width: 35 mm

Compact width dimensions make it suitable for space-constrained applications while maintaining high performance.

Boundary Scan: YES

The boundary scan feature enables efficient testing and debugging of the microprocessor, reducing development time and costs.

External Data Bus Width: 64

A wide external data bus width enables high-speed communication with peripherals and improves overall system performance.

Maximum Clock Frequency: 66 MHz

With a high clock frequency, the microprocessor can process instructions quickly and deliver smooth performance.

Length: 35 mm

Compact length dimensions contribute to overall space-saving design and ease of integration.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC architecture of the microprocessor offers simplified instruction set and enhanced processing efficiency for various applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form allows for reliable connections and easier soldering during assembly, ensuring secure device operation.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage provides a balanced combination of power efficiency and performance for the microprocessor.

No. of DMA Channels: 2

Having dedicated DMA channels enhances data transfer efficiency and reduces CPU workload, improving overall system performance.

Terminal Pitch: 1.27 mm

The tight terminal pitch enables high-density mounting, saving space on PCBs and enabling compact device designs.

Format: FLOATING POINT

Support for floating-point format enhances mathematical precision and accuracy in computational tasks, making the microprocessor suitable for scientific and engineering applications.

Speed: 200 rpm

The high speed capability of 200 rpm ensures fast data processing and efficient performance in demanding applications.

Low Power Mode: YES

The low power mode feature allows the microprocessor to operate in an energy-efficient state, increasing battery life and reducing overall power consumption.

Technical Specifications

Microprocessors XPC8240LZU200E attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66 MHz

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B352

Length:

35 mm

Low Power Mode:

YES

No. of DMA Channels:

2

No. of External Interrupts:

5

No. of Terminals:

352

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA352,26X26,50

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Maximum Seated Height:

1.65 mm

Speed:

200 rpm

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Peripheral IC Type:

Trade Compliance

XPC8240LZU200E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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