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MIMXRT1021DAG5A

NXP Semiconductors

MIMXRT1021DAG5A by NXP Semiconductors

NXP Semiconductors' MIMXRT1021DAG5A microprocessor features 32-bit architecture, 262144 RAM words, and 24 MHz clock frequency. Ideal for applications requiring low power mode, it offers 96 I/O lines and integrated ADC and PWM channels for versatile usage in various embedded systems.

Median Price

$7.885

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 7,900 parts In-Stock

1+ parts

-

100+ parts

$5.450

1k+ parts

$4.875

10k+ parts

$4.588

7,900

-

$5.450

$4.875

$4.588

Flip Electronics (Authorized)

USA . 767 parts In-Stock

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767

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DigiKey

USA . 47 parts In-Stock

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$10.320

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47

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$10.320

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Distributors (In-Stock)

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Digiode

USA . 4,519 parts In-Stock

1+ parts

$4.598

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4,519

$4.598

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Nova Conductors

Japan . 95 parts In-Stock

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$9.521

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95

$9.521

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Chip Stock

USA . 41,864 parts In-Stock

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Vyrian

USA . 7,700 parts In-Stock

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7,700

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Anansix

USA . 2,214 parts In-Stock

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DigiKey Marketplace

USA . 655 parts In-Stock

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655

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Flip Electronics

USA . 47 parts In-Stock

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47

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Distributors (Availability)

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Ampacity Inc.

Singapore . 4,303 parts In-Stock

1+ parts

$4.110

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4,303

$4.110

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Semicontronic

India . 4,300 parts In-Stock

1+ parts

$4.110

100+ parts

$4.007

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$3.987

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4,300

$4.110

$4.007

$3.987

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Corphita

USA . 1,760 parts In-Stock

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$4.356

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1,760

$4.356

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Continental Prestige Electronics

USA . 5,137 parts In-Stock

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$9.521

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$9.330

5,137

$9.521

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$9.330

Netroflash

USA . 50 parts In-Stock

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$9.521

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50

$9.521

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Corohmni

South Africa . 318 parts In-Stock

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$16.043

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318

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Microchip USA

USA . 2,337 parts In-Stock

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$27.880

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2,337

$27.880

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$41.822

100+ parts

$38.058

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$34.294

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1,000

$41.822

$38.058

$34.294

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Aztec Data Supply Inc.

USA . 4,684 parts In-Stock

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$54.250

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4,684

$54.250

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Modulus Dynamics

Lithuania . 2,135 parts In-Stock

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$77.862

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$77.862

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$77.862

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$77.862

$77.862

$77.862

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Futuretech Components

Singapore . 26,001 parts In-Stock

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Lixinc

USA . 14,919 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,351 parts In-Stock

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Robosynatics

Brazil . 3,608 parts In-Stock

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Lucentia Tech

USA . 3,608 parts In-Stock

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$25.662

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$25.139

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$25.139

3,608

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$25.139

$25.139

UNI Independent Distributors

Spain . 3,057 parts In-Stock

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Argo Parts USA

USA . 2,571 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Overview

Get ready to experience top-notch performance and reliability with the NXP Semiconductors MIMXRT1021DAG5A microprocessor. Designed for a wide range of applications, this powerful device offers integrated cache, advanced ADC channels, and low power modes for optimized efficiency. With NXP Semiconductors' reputation for quality and innovation, you can trust that you're getting a product that delivers exceptional value and benefits. Upgrade your projects with the MIMXRT1021DAG5A and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microprocessor suitable for a wide range of applications while keeping the overall weight of the product low.

Integrated Cache: YES

The integrated cache helps in improving the overall performance of the microprocessor by storing frequently accessed data closer to the processor, reducing access times and enhancing efficiency.

Maximum Supply Voltage: 1.3 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, making the microprocessor efficient and suitable for applications where power efficiency is a key factor.

On Chip Data RAM Width: 8

The wide on-chip data RAM width of 8 allows for faster data processing and improved multitasking capabilities, making the microprocessor ideal for performance-intensive applications.

Address Bus Width: 13

The wide address bus width of 13 enables the microprocessor to access a larger memory space, accommodating complex computational tasks and large datasets effectively.

Package Shape: SQUARE

The square package shape offers a compact form factor, saving space and making it ideal for compact designs and applications where size constraints are present.

Bit Size: 32

The 32-bit architecture allows the microprocessor to handle larger data chunks at once, improving efficiency and performance in processing tasks that require handling of extensive data.

No. of Terminals: 144

The high number of terminals allows for connectivity to various external components and peripherals, expanding the functionality and compatibility of the microprocessor with different systems.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style enhances thermal performance, promotes efficient heat dissipation, and enables compatibility with modern assembly technologies, making the microprocessor easy to integrate into different systems.

Minimum Supply Voltage: 1.25 V

The low minimum supply voltage ensures compatibility with a wide range of power sources while maintaining stable operation, increasing the versatility and reliability of the microprocessor.

Maximum Operating Temperature: 95 °C

The high maximum operating temperature range of 95°C enables the microprocessor to operate in harsh environments and under demanding conditions, ensuring reliable performance in various applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows the microprocessor to function in cold environments without compromising performance, making it suitable for a wide range of operating conditions.

Terminal Finish: TIN

The TIN terminal finish provides corrosion resistance and ensures reliable electrical connections, enhancing the overall durability and longevity of the microprocessor.

ADC Channels: YES

The presence of ADC channels allows the microprocessor to interface with analog sensors and devices, enabling accurate analog-to-digital conversions and expanding the range of applications where the microprocessor can be used.

DMA Channels: YES

The availability of DMA channels allows for efficient data transfer between peripherals and memory without processor intervention, improving performance and reducing the workload on the core processor.

Terminal Position: QUAD

The quad terminal position facilitates easy and secure mounting on the PCB, ensuring reliable connections and simplifying the assembly process during manufacturing.

Maximum Seated Height: 1.6 mm

The low maximum seated height enables the microprocessor to be used in slim or compact designs where space constraints are a concern, without compromising on functionality or performance.

RAM Words: 262144

The large RAM capacity of 262144 words allows for efficient data storage and processing, enabling the microprocessor to handle complex algorithms and software with ease.

Width: 20 mm

The compact width of 20 mm makes the microprocessor suitable for applications where space is limited, while also allowing for easy integration into different electronic devices and systems.

Boundary Scan: YES

The presence of boundary scan capability enables easy testing and debugging of the microprocessor during production and maintenance, reducing time and effort required for troubleshooting and ensuring product quality.

External Data Bus Width: 32

The wide external data bus width of 32 bits allows for faster data transfer between the microprocessor and external peripherals, enhancing overall system performance and efficiency.

Maximum Clock Frequency: 24 MHz

The high maximum clock frequency of 24 MHz ensures fast processing speeds and responsive performance, making the microprocessor suitable for applications requiring real-time data processing and high-speed computation.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds ensures that the microprocessor can withstand the soldering process during assembly without damage, ensuring reliable performance and longevity of the product.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for efficient soldering and assembly processes, ensuring secure connections and durability of the microprocessor in various manufacturing environments.

Length: 20 mm

The compact length of 20 mm allows for easy integration into small electronic devices and systems, while also providing flexibility in design and layout options for different applications.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC architecture of the microprocessor enables efficient instruction execution and performance, making it ideal for applications requiring high-speed computation and responsiveness.

Technology: CMOS

The CMOS technology used in the microprocessor provides low power consumption, high noise immunity, and reliable operation, making it suitable for battery-powered devices and energy-efficient applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy mounting and soldering on the PCB, ensuring secure connections and reliable electrical contact, while also simplifying the assembly process during manufacturing.

Maximum Supply Current: 90 mA

The low maximum supply current of 90 mA helps in reducing power consumption and heat generation, making the microprocessor energy-efficient and suitable for battery-operated devices or applications with limited power budgets.

No. of DMA Channels: 32

The high number of DMA channels enables efficient and simultaneous data transfers between peripherals and memory without processor intervention, improving overall system performance and multitasking capabilities.

No. of Serial I/Os: 14

The presence of 14 serial I/Os allows for easy communication with external devices and peripherals, expanding connectivity options and compatibility with a wide range of serial communication protocols.

PWM Channels: YES

The availability of PWM channels enables precise control of voltage and current levels, enabling efficient power management and motor control applications, making the microprocessor versatile and suitable for a variety of applications.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for compact and high-density mounting on the PCB, saving space and enabling complex designs with multiple components in a limited area.

Format: FLOATING POINT

The floating-point format allows for accurate and efficient handling of decimal numbers and complex mathematical operations, making the microprocessor suitable for applications requiring high precision and computational capabilities.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates that the microprocessor can withstand moderate exposure to moisture during storage and handling, ensuring reliability and performance in various operating conditions and environments.

Speed: 500 rpm

The high speed of 500 rpm enables fast data processing and computation, making the microprocessor suitable for applications requiring rapid response times and real-time data analysis.

Low Power Mode: YES

The low power mode allows the microprocessor to operate at reduced power consumption levels, prolonging battery life and enabling energy-efficient operation, making it ideal for portable devices and power-sensitive applications.

Technical Specifications

Microprocessors MIMXRT1021DAG5A attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

13

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

24 MHz

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of I/O Lines:

96

No. of Serial I/Os:

14

No. of Terminals:

144

On Chip Data RAM Width:

8

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

262144

Maximum Seated Height:

1.6 mm

Speed:

500 rpm

Maximum Supply Current:

90 mA

Maximum Supply Voltage:

1.3 V

Minimum Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

MIMXRT1021DAG5A Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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