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MIMXRT1051DVJ6B

NXP Semiconductors

MIMXRT1051DVJ6B by NXP Semiconductors

NXP Semiconductors' MIMXRT1051DVJ6B is a 32-bit microprocessor with integrated cache, 524288 RAM words, and 29 serial I/Os. Ideal for low power applications, it operates at up to 24 MHz clock frequency and features boundary scan technology. With a package style of grid array, this CMOS processor is suitable for various embedded systems requiring high-speed data processing.

Median Price

$9.720

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 314 parts In-Stock

1+ parts

$5.740

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314

$5.740

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Arrow

USA . 4,670 parts In-Stock

1+ parts

$6.749

100+ parts

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4,670

$6.749

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Mouser Electronics

USA . 312 parts In-Stock

1+ parts

$9.500

100+ parts

$6.960

1k+ parts

$6.740

10k+ parts

$6.640

312

$9.500

$6.960

$6.740

$6.640

Newark

USA . 92 parts In-Stock

1+ parts

$9.720

100+ parts

$7.070

1k+ parts

$6.840

10k+ parts

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92

$9.720

$7.070

$6.840

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Farnell

UK . 120 parts In-Stock

1+ parts

$9.820

100+ parts

$6.790

1k+ parts

$6.650

10k+ parts

-

120

$9.820

$6.790

$6.650

-

DigiKey

USA . 162 parts In-Stock

1+ parts

$10.990

100+ parts

$7.988

1k+ parts

$6.793

10k+ parts

$6.642

162

$10.990

$7.988

$6.793

$6.642

Element14

Singapore . 120 parts In-Stock

1+ parts

$16.600

100+ parts

$12.140

1k+ parts

$11.900

10k+ parts

-

120

$16.600

$12.140

$11.900

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Verical

USA . 4,490 parts In-Stock

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4,490

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Flip Electronics (Authorized)

USA . 151 parts In-Stock

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151

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Distributors (In-Stock)

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Digiode

USA . 246 parts In-Stock

1+ parts

$4.921

100+ parts

-

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246

$4.921

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Nova Conductors

Japan . 60 parts In-Stock

1+ parts

$10.188

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60

$10.188

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Flip Electronics

USA . 18,106 parts In-Stock

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Vyrian

USA . 5,842 parts In-Stock

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Anansix

USA . 2,397 parts In-Stock

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2,397

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TME

Poland . 472 parts In-Stock

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$4.080

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472

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$4.080

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,115 parts In-Stock

1+ parts

$4.220

100+ parts

$4.114

1k+ parts

$4.093

10k+ parts

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1,115

$4.220

$4.114

$4.093

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Ampacity Inc.

Singapore . 438 parts In-Stock

1+ parts

$4.310

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438

$4.310

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Corphita

USA . 1,786 parts In-Stock

1+ parts

$4.662

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1,786

$4.662

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Continental Prestige Electronics

USA . 246 parts In-Stock

1+ parts

$7.690

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246

$7.690

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$10.188

100+ parts

$9.984

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2,000

$10.188

$9.984

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Modulus Dynamics

Lithuania . 26 parts In-Stock

1+ parts

$11.229

100+ parts

$11.117

1k+ parts

$10.780

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26

$11.229

$11.117

$10.780

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Microchip USA

USA . 1,569 parts In-Stock

1+ parts

$39.592

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1,569

$39.592

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Corohmni

South Africa . 343 parts In-Stock

1+ parts

$64.117

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343

$64.117

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$73.203

100+ parts

$69.543

1k+ parts

$69.543

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5,000

$73.203

$69.543

$69.543

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Aztec Data Supply Inc.

USA . 2,697 parts In-Stock

1+ parts

$75.580

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2,697

$75.580

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UNI Independent Distributors

Spain . 5,938 parts In-Stock

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Argo Parts USA

USA . 4,701 parts In-Stock

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4,701

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Robosynatics

Brazil . 900 parts In-Stock

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900

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Lucentia Tech

USA . 900 parts In-Stock

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$7.360

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$7.360

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$7.360

900

-

$7.360

$7.360

$7.360

Overview

Unlock the potential of your projects with the MIMXRT1051DVJ6B by NXP Semiconductors, a cutting-edge microprocessor designed for high-performance applications. With its advanced technology and integrated cache, this versatile component offers seamless functionality and reliable operation. Perfect for a wide range of applications, from IoT devices to industrial automation, the MIMXRT1051DVJ6B ensures superior performance and efficiency. Trust NXP Semiconductors for top-quality products that deliver unmatched value and innovation to customers worldwide. Elevate your designs with the MIMXRT1051DVJ6B and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good thermal and electrical insulation, ensuring reliable performance and durability of the microprocessor.

Integrated Cache: YES

Having integrated cache reduces memory access time and improves overall system performance.

Maximum Supply Voltage: 1.3 V

Operating at a relatively low voltage helps in reducing power consumption and heat generation, making it energy-efficient.

On Chip Data RAM Width: 8

The wider data RAM width allows for faster data transfer and processing, enhancing the speed and efficiency of the microprocessor.

Package Shape: SQUARE

A square package shape provides better thermal dissipation and makes the microprocessor easier to install on PCBs.

Bit Size: 32

A 32-bit architecture allows the microprocessor to handle larger chunks of data and perform complex calculations more efficiently.

No. of Terminals: 196

Having a higher number of terminals enables better connectivity and integration with other components in the system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high density mounting, which is ideal for compact electronic devices and applications with limited space.

Minimum Supply Voltage: 1.25 V

Even at lower voltages, this microprocessor can deliver reliable performance, making it suitable for low-power applications.

Maximum Operating Temperature: 95 °C

Operating at a high temperature range ensures the microprocessor can handle demanding tasks and environments without overheating.

Minimum Operating Temperature: 0 °C

Being able to function at low temperatures makes this microprocessor suitable for a variety of operating environments and conditions.

Terminal Finish: TIN SILVER

This finish provides good electrical conductivity, corrosion resistance, and ensures reliable connections, enhancing the overall quality and longevity of the microprocessor.

Terminal Position: BOTTOM

The bottom terminal positioning makes the microprocessor easier to mount and connect to other components, simplifying the installation process.

Maximum Seated Height: 1.52 mm

A low seated height allows for a compact design, making it suitable for slim electronic devices and applications with space constraints.

RAM Words: 524288

With a large RAM capacity, this microprocessor can handle and store significant amounts of data, improving its multitasking and processing capabilities.

Width: 12 mm

Being relatively small in width, this microprocessor can be easily integrated into various electronic devices and systems without taking up much space.

Boundary Scan: YES

Having boundary scan capability allows for easier testing and debugging of the microprocessor during production and maintenance, ensuring better reliability and quality control.

Maximum Clock Frequency: 24 MHz

Operating at a high clock frequency enables fast data processing and execution of instructions, making the microprocessor suitable for high-performance applications.

Maximum Time At Peak Reflow Temperature (s): 40

Being able to withstand peak reflow temperatures for a long duration ensures the microprocessor's reliability and durability during the manufacturing process.

Peak Reflow Temperature °C: 260

Withstanding high reflow temperatures makes this microprocessor suitable for surface mount assembly techniques, ensuring secure and robust connections.

Length: 12 mm

Having a compact length allows for easy integration and mounting of the microprocessor in electronic devices and systems with limited space.

Peripheral IC Type: MICROPROCESSOR, RISC

A RISC architecture offers simplified and efficient instruction set, enhancing the microprocessor's performance and speed in processing tasks.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable in various applications.

Terminal Form: BALL

Having ball terminals simplifies the soldering process and ensures reliable connections, contributing to the overall quality and durability of the microprocessor.

Maximum Supply Current: 105 mA

Operating at a relatively low supply current indicates energy efficiency and helps in minimizing power consumption, making the microprocessor suitable for battery-powered devices.

No. of DMA Channels: 32

Having a higher number of DMA channels enables efficient data transfer and processing, enhancing the overall performance and speed of the microprocessor.

No. of Serial I/Os: 29

A sufficient number of serial I/Os allow for connectivity with external devices and peripherals, expanding the capabilities and versatility of the microprocessor.

Terminal Pitch: 0.8 mm

A fine terminal pitch facilitates high-density mounting and ensures reliable connections, making the microprocessor suitable for compact and portable electronic devices.

Format: FLOATING-POINT

Using floating-point format enables precise and efficient numeric calculations, enhancing the microprocessor's performance in handling complex mathematical operations.

Moisture Sensitivity Level (MSL): 3

Having MSL level 3 indicates that the microprocessor is robust against moisture exposure during handling and storage, ensuring its reliability and performance.

Speed: 600 rpm

Operating at a high speed of 600 rpm allows for fast data processing and execution, making the microprocessor suitable for real-time applications and high-performance tasks.

Low Power Mode: YES

Having a low power mode option enhances energy efficiency and extends battery life, making the microprocessor suitable for portable and battery-powered devices.

Technical Specifications

Microprocessors MIMXRT1051DVJ6B attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

24 MHz

External Data Bus Width:

0

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e2

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of Serial I/Os:

29

No. of Terminals:

196

On Chip Data RAM Width:

8

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA196,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

524288

Maximum Seated Height:

1.52 mm

Speed:

600 rpm

Maximum Supply Current:

105 mA

Maximum Supply Voltage:

1.3 V

Minimum Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

12 mm

Peripheral IC Type:

Trade Compliance

MIMXRT1051DVJ6B Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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