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MIMXRT1021DAG5B

NXP Semiconductors

MIMXRT1021DAG5B by NXP Semiconductors

NXP Semiconductors' MIMXRT1021DAG5B microprocessor features 32-bit architecture, 24 MHz clock frequency, and 262144 RAM words. Ideal for low power applications with a max supply voltage of 1.3V, it offers integrated cache and 32 DMA channels for efficient data processing.

Median Price

$5.830

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 25 parts In-Stock

1+ parts

$5.830

100+ parts

$5.630

1k+ parts

$4.940

10k+ parts

-

25

$5.830

$5.630

$4.940

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Arrow

USA . 106 parts In-Stock

1+ parts

$6.118

100+ parts

$4.868

1k+ parts

$4.428

10k+ parts

-

106

$6.118

$4.868

$4.428

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Mouser Electronics

USA . 55 parts In-Stock

1+ parts

$9.380

100+ parts

$6.790

1k+ parts

$5.140

10k+ parts

$5.040

55

$9.380

$6.790

$5.140

$5.040

Verical

USA . 12,240 parts In-Stock

1+ parts

-

100+ parts

-

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$5.119

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12,240

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-

$5.119

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Rochester

USA . 6,431 parts In-Stock

1+ parts

-

100+ parts

$4.360

1k+ parts

$3.900

10k+ parts

$3.670

6,431

-

$4.360

$3.900

$3.670

Flip Electronics (Authorized)

USA . 1,320 parts In-Stock

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1,320

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Avnet

USA . 540 parts In-Stock

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540

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Distributors (In-Stock)

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Digiode

USA . 3,742 parts In-Stock

1+ parts

$4.598

100+ parts

-

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3,742

$4.598

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$9.598

100+ parts

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200

$9.598

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Chip Stock

USA . 23,500 parts In-Stock

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23,500

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Vyrian

USA . 8,193 parts In-Stock

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8,193

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TME

Poland . 6,660 parts In-Stock

1+ parts

-

100+ parts

$7.528

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6,660

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$7.528

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Flip Electronics

USA . 4,850 parts In-Stock

1+ parts

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4,850

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Anansix

USA . 688 parts In-Stock

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688

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IBS Electronics

USA . 300 parts In-Stock

1+ parts

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100+ parts

$6.241

1k+ parts

$6.129

10k+ parts

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300

-

$6.241

$6.129

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,637 parts In-Stock

1+ parts

$3.750

100+ parts

$3.656

1k+ parts

$3.638

10k+ parts

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1,637

$3.750

$3.656

$3.638

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Corphita

USA . 1,396 parts In-Stock

1+ parts

$4.356

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1,396

$4.356

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Ampacity Inc.

Singapore . 857 parts In-Stock

1+ parts

$8.950

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857

$8.950

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Netroflash

USA . 500 parts In-Stock

1+ parts

$9.598

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500

$9.598

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Continental Prestige Electronics

USA . 106 parts In-Stock

1+ parts

$9.598

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$9.406

106

$9.598

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-

$9.406

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$20.332

100+ parts

$19.316

1k+ parts

$19.316

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2,500

$20.332

$19.316

$19.316

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Microchip USA

USA . 2,437 parts In-Stock

1+ parts

$26.867

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2,437

$26.867

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Aztec Data Supply Inc.

USA . 4,368 parts In-Stock

1+ parts

$51.670

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4,368

$51.670

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Corohmni

South Africa . 582 parts In-Stock

1+ parts

$81.124

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582

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Lixinc

USA . 17,938 parts In-Stock

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UNI Independent Distributors

Spain . 5,994 parts In-Stock

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Argo Parts USA

USA . 3,797 parts In-Stock

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Robosynatics

Brazil . 900 parts In-Stock

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900

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Lucentia Tech

USA . 900 parts In-Stock

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$4.676

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$4.676

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$4.676

900

-

$4.676

$4.676

$4.676

Epart123

USA . 600 parts In-Stock

1+ parts

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$18.500

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600

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$18.500

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Overview

Unlock the potential of your next project with the MIMXRT1021DAG5B microprocessor by NXP Semiconductors. Built with precision and expertise, this powerful chip offers integrated cache, low power mode, and a wide range of applications in various industries. From IoT devices to automotive systems, this product delivers exceptional performance and reliability. Experience seamless operation and enhanced efficiency with the MIMXRT1021DAG5B, setting new standards in microprocessor technology. Elevate your designs with NXP Semiconductors' cutting-edge innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/epoxy material ensures durability and resistance to heat, making the product long-lasting and reliable.

Integrated Cache: YES

Integrated cache improves processing speed and reduces latency, enhancing overall performance.

Maximum Supply Voltage: 1.3 V

Operates efficiently at a low supply voltage, reducing power consumption and heat generation.

On Chip Data RAM Width: 8

The wide data RAM width allows for efficient data processing and multitasking capabilities.

Package Shape: SQUARE

Square package shape provides a compact design, saving space and facilitating easy integration into systems.

Bit Size: 32

32-bit architecture enables handling of larger data sets and enhances computational capabilities.

No. of Terminals: 144

Higher number of terminals allow for more connectivity options and interface functionalities.

Maximum Operating Temperature: 95 °C

Capable of operating at high temperatures without performance degradation, ensuring reliability in various environments.

RAM Words: 262144

Large RAM capacity enhances data processing capabilities and supports complex applications.

Boundary Scan: YES

Boundary scan feature facilitates testing and debugging, ensuring efficient maintenance and troubleshooting.

External Data Bus Width: 32

Wide external data bus width enhances data transfer speeds and overall system performance.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture with peripheral IC type enhances computational efficiency and performance for various applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making it energy-efficient and reliable.

Maximum Supply Current: 90 mA

Low supply current requirement ensures energy efficiency and reduces operating costs.

Speed: 500 rpm

High speed operation at 500 rpm enables quick data processing and efficient performance.

Low Power Mode: YES

Low power mode option allows for energy-saving operation, extending battery life and reducing power consumption.

Technical Specifications

Microprocessors MIMXRT1021DAG5B attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

13

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

24 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of Serial I/Os:

14

No. of Terminals:

144

On Chip Data RAM Width:

8

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

262144

Maximum Seated Height:

1.6 mm

Speed:

500 rpm

Maximum Supply Current:

90 mA

Maximum Supply Voltage:

1.3 V

Minimum Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

MIMXRT1021DAG5B Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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