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MIMXRT1064DVL6A

NXP Semiconductors

MIMXRT1064DVL6A by NXP Semiconductors

The NXP Semiconductors MIMXRT1064DVL6A is a 32-bit microprocessor with integrated cache and 8-bit on-chip data RAM. It is used in applications requiring low power mode, such as IoT devices and embedded systems.

Median Price

$8.876

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15,310 parts In-Stock

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-

100+ parts

$7.890

1k+ parts

$7.060

10k+ parts

$6.650

15,310

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$7.890

$7.060

$6.650

Verical

USA . 15,310 parts In-Stock

1+ parts

-

100+ parts

$9.863

1k+ parts

$8.825

10k+ parts

$8.313

15,310

-

$9.863

$8.825

$8.313

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,526 parts In-Stock

1+ parts

$8.341

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-

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4,526

$8.341

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Nova Conductors

Japan . 100 parts In-Stock

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$10.795

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100

$10.795

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Vyrian

USA . 2,318 parts In-Stock

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Anansix

USA . 1,654 parts In-Stock

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Cogito LLC

Ukraine . 1 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 14,972 parts In-Stock

1+ parts

$7.460

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14,972

$7.460

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Semicontronic

India . 14,927 parts In-Stock

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$7.460

100+ parts

$7.274

1k+ parts

$7.236

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14,927

$7.460

$7.274

$7.236

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Corphita

USA . 4,447 parts In-Stock

1+ parts

$7.902

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$7.902

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Continental Prestige Electronics

USA . 4,539 parts In-Stock

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$10.795

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$10.579

4,539

$10.795

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$10.579

AZTECH Wire

Italy . 684 parts In-Stock

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$15.690

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684

$15.690

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Microchip USA

USA . 1,948 parts In-Stock

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$35.103

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$35.103

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$40.043

100+ parts

$38.041

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$38.041

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5,000

$40.043

$38.041

$38.041

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Aztec Data Supply Inc.

USA . 4,105 parts In-Stock

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$84.650

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Corohmni

South Africa . 325 parts In-Stock

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$85.683

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325

$85.683

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Authorized Procurement Solutions

USA . 9,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,844 parts In-Stock

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Lixinc

USA . 5,436 parts In-Stock

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Futuretech Components

Singapore . 3,600 parts In-Stock

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Argo Parts USA

USA . 2,339 parts In-Stock

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UNI Independent Distributors

Spain . 1,992 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$10.579

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$10.255

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$10.039

1,000

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$10.039

Robosynatics

Brazil . 450 parts In-Stock

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Lucentia Tech

USA . 450 parts In-Stock

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$0.120

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$0.120

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$0.120

450

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$0.120

$0.120

$0.120

Emar International I/E

Canada . 222 parts In-Stock

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Overview

Discover the power of the MIMXRT1064DVL6A microprocessor by NXP Semiconductors. With its exceptional quality and advanced manufacturing capabilities, NXP continues to be a leader in the industry. This versatile device, belonging to the microprocessors category, offers a wide range of applications, making it perfect for your next project. From embedded systems to industrial automation, this product delivers value, benefits, and advantages that customers seek. Its integrated cache and low power mode ensure efficient performance, while its compact design and surface mount capability make it easy to integrate into any system. Experience the reliability and innovation of NXP Semiconductors with the MIMXRT1064DVL6A microprocessor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, ensuring reliability in various operating conditions.

Integrated Cache: YES

Having an integrated cache helps in improving the performance of the microprocessor by reducing access time to frequently used data.

Maximum Supply Voltage: 1.3 V

Operating within a maximum supply voltage of 1.3V ensures efficient power usage and prevents damage to the microprocessor.

On Chip Data RAM Width: 8

A wider on-chip data RAM width of 8 bits allows for faster data processing and can handle larger data sets efficiently.

Package Shape: SQUARE

The square package shape helps in easy integration and placement on circuit boards, optimizing space utilization.

Bit Size: 32

With a bit size of 32, the microprocessor can handle 32-bit data at a time, leading to faster processing speeds and improved performance.

No. of Terminals: 196

Having 196 terminals allows for increased connectivity options and integration with other components in the system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style of grid array, low profile, and fine pitch enables compact and efficient PCB layout, saving space and facilitating high-density designs.

Minimum Supply Voltage: 1.25 V

Operating at a minimum supply voltage of 1.25V ensures that the microprocessor can function reliably even in low power conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C allows for reliable operation even in environments where temperature fluctuations may occur.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C ensures that the microprocessor can start up and function in cold environments without any issues.

Terminal Position: BOTTOM

The bottom terminal position simplifies the installation and connection process, making it easier to integrate the microprocessor into the system.

Maximum Seated Height: 1.43 mm

With a maximum seated height of 1.43mm, the microprocessor can be accommodated in slim and compact designs, suitable for constrained spaces.

RAM Words: 1048576

A large number of RAM words allow for extensive data storage and processing capabilities, enabling the microprocessor to handle complex tasks efficiently.

Width: 10 mm

The compact width of 10mm makes the microprocessor suitable for applications with size constraints, providing flexibility in design.

Boundary Scan: YES

The presence of boundary scan capability helps in testing and debugging the microprocessor during production, ensuring reliable performance.

Maximum Clock Frequency: 24 MHz

Operating at a maximum clock frequency of 24MHz allows for high-speed data processing and computation, enhancing overall performance.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum time at peak reflow temperature of 40 seconds, the microprocessor can withstand reflow soldering processes without damage.

Peak Reflow Temperature °C: 260

The microprocessor's ability to withstand a peak reflow temperature of 260 °C ensures reliability during soldering and assembly processes.

Length: 10 mm

The compact length of 10mm contributes to space-saving and compact system designs, making the microprocessor suitable for various applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor allows for efficient and streamlined instruction execution, leading to improved performance and power efficiency.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable in operation.

Terminal Form: BALL

Having terminal forms as balls facilitates easy soldering and connection, enhancing the reliability and durability of the microprocessor in the system.

Maximum Supply Current: 110 mA

Operating within a maximum supply current of 110mA ensures efficient power usage and prevents overloading the microprocessor, contributing to longevity.

No. of DMA Channels: 32

Having 32 DMA channels allows for efficient data transfer and processing, enhancing the microprocessor’s performance in handling multiple tasks.

No. of Serial I/Os: 10

Having 10 serial I/Os provides versatility in communication and data transfer options, enabling connectivity with various devices and peripherals.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm enables high-density mounting and compact PCB designs, ideal for space-constrained applications.

Format: FLOATING-POINT

Utilizing a floating-point format allows for precise and efficient computation of decimal numbers, enhancing the microprocessor’s performance in complex calculations.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the microprocessor can withstand moderate exposure to moisture during handling and assembly processes.

Speed: 600 rpm

Operating at a speed of 600rpm allows for fast data processing and computation, improving the overall performance and responsiveness of the microprocessor.

Low Power Mode: YES

The ability to operate in a low power mode enhances energy efficiency and extends battery life, making the microprocessor suitable for portable devices and energy-conscious applications.

Technical Specifications

Microprocessors MIMXRT1064DVL6A attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

24 MHz

External Data Bus Width:

0

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B196

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of Serial I/Os:

10

No. of Terminals:

196

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA196,14X14,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

1048576

Maximum Seated Height:

1.43 mm

Speed:

600 rpm

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

1.3 V

Minimum Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MIMXRT1064DVL6A Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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