Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MCIMX6QP6AVT1AA by NXP Semiconductors is a 32-bit microprocessor with integrated cache and a max supply voltage of 1.5V. It is commonly used in automotive applications due to its temperature grade, low power mode, and boundary scan capability.
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PLASTIC/EPOXY - This microprocessor is housed in a plastic/epoxy package, providing durability and protection for the internal components, making it a reliable choice for various applications.
YES - With integrated cache, this microprocessor can quickly store and retrieve frequently used instructions and data, resulting in improved processing speed and efficiency.
YES - The surface mount feature allows for easy and convenient installation on circuit boards, making this microprocessor suitable for compact and space-saving designs.
1.5 V - The high maximum supply voltage ensures compatibility with various power sources, making this microprocessor versatile and suitable for a wide range of applications.
26 - With a 26-bit address bus width, this microprocessor is capable of addressing a large memory space, enabling complex tasks and handling large amounts of data.
SQUARE - The square package shape offers a compact and uniform form factor, ensuring easy integration into different electronic devices.
32 - With a 32-bit architecture, this microprocessor can process data and execute instructions in larger chunks, resulting in improved performance and efficiency.
624 - Having 624 terminals allows for a wide range of connections and extensive interfacing capabilities with other components, enhancing the versatility and flexibility of this microprocessor.
GRID ARRAY, FINE PITCH - The grid array fine pitch package style ensures precise and secure connections, minimizing signal loss and improving overall reliability of the microprocessor.
1.35 V - The low minimum supply voltage allows for energy-efficient operation, contributing to reduced power consumption and longer battery life in portable applications.
125 °C - With a high maximum operating temperature, this microprocessor can withstand demanding environments, making it suitable for industrial and automotive applications.
40 °C - The low minimum operating temperature enables reliable operation even in extreme cold conditions, ensuring the microprocessor's suitability for use in various environments.
TIN SILVER COPPER - The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance, enhancing the longevity and performance of this microprocessor.
BOTTOM - The terminal position at the bottom helps facilitate easy and efficient installation and connection of the microprocessor in electronic systems.
2.16 mm - With a low maximum seated height, this microprocessor can be used in slim and compact form factor devices, enabling sleek and space-saving designs.
21 mm - This microprocessor has a width of 21 mm, allowing for easy integration into various electronic systems and PCB layouts.
YES - The boundary scan feature enables comprehensive testing and debugging of the microprocessor, ensuring enhanced reliability and ease of troubleshooting.
64 - With a wide external data bus width of 64 bits, this microprocessor can efficiently transfer large amounts of data, enabling faster and more capable processing capabilities.
40 - The maximum time at peak reflow temperature of 40 seconds ensures proper soldering and assembly of the microprocessor, leading to reliable and stable performance.
260 - The peak reflow temperature of 260°C ensures effective soldering and overall reliability during the manufacturing process.
21 mm - With a length of 21 mm, this microprocessor can be easily accommodated in various electronic systems and PCB layouts.
AUTOMOTIVE - Designed for automotive applications, this microprocessor meets the stringent temperature requirements and reliability standards of the automotive industry.
MICROPROCESSOR, RISC - As a microprocessor with reduced instruction set computing (RISC) architecture, this product offers efficient and streamlined processing capabilities, making it ideal for high-performance computing tasks.
CMOS - Utilizing complementary metal-oxide-semiconductor (CMOS) technology, this microprocessor offers low power consumption and high-speed operation, making it suitable for a wide range of applications.
BALL - With a ball terminal form, this microprocessor enables reliable connections and efficient heat transfer, ensuring consistent and stable performance.
0.8 mm - The terminal pitch of 0.8 mm allows for compact and precise connections, contributing to improved signal integrity and overall system reliability.
FLOATING POINT - Supporting floating-point calculations, this microprocessor is capable of handling complex mathematical operations with higher accuracy, making it suitable for scientific and computational applications.
3 - With a moisture sensitivity level of 3, this microprocessor can withstand moderate exposure to moisture during manufacturing and assembly processes, ensuring reliability and durability.
1000 rpm - With a speed of 1000 revolutions per minute (rpm), this microprocessor offers fast and efficient processing capabilities, ideal for high-performance computing tasks.
YES - The low power mode feature allows for energy-efficient operation, reducing power consumption and prolonging battery life, making this microprocessor suitable for portable and battery-powered applications.
Microprocessors MCIMX6QP6AVT1AA attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Additional Features:
Address Bus Width:
Bit Size:
Boundary Scan:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
MCIMX6QP6AVT1AA Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A992.C
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Design/Specification - Manual Updates 14/Jul/2019 Mult Dev 26/May/2023
PCN Assembly/Origin - COO/Label 15-apr-2022
PCN Packaging - All Dev Label Update 15/Dec/2020 Mult Dev Pkg Seal 15/Dec/2020
PCN Other - Mult Device Des Update-New Subs 20/Sep/2017
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
LL4148
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; Maximum Non Repetitive Peak Forward Current: .5 A; No. of Elements: 1; Maximum Reverse Recovery Time: .004 us;
SS14
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MMBT2222ALT1G
Rochester Electronics
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .3 W; Maximum Collector Current (IC): .6 A;
BSS138
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Minimum DS Breakdown Voltage: 50 V; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
BSS138W-7-F
Multicomp Pro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
LM358N
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BAV99
Allegro MicroSystems
RECTIFIER DIODE; Terminal Position: END; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Good-ark Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 6 ohm; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
M39029/58-360
TE Connectivity
TE Connectivity's M39029/58-360 is a CRIMP terminal backshell for 22-28 AWG wires, rated at 5A. Ideal for male contacts in Mil-Spec applications, it offers a cross-section area of 0.34 mm2 and ensures secure connections in demanding environments.
BSS84-7-F
SPC TECHNOLOGY/ MULTICOMP
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Transistor Element Material: SILICON;
RC0805FR-0710RL
Yageo
Yageo's RC0805FR-0710RL is a 10 ohm SMT fixed resistor with 1% tolerance and 0.125 W power dissipation. With a temperature range of -55 to 155 °C, it suits applications requiring precise resistance values in compact surface mount designs.
2N2222A
Vpt Components
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Maximum Power Dissipation Ambient: .5 W;
LM7805CT
Silicon Group
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Package Body Material: PLASTIC/EPOXY; Maximum Load Regulation: .05 %;
STM32H743IIT6
STMicroelectronics
STM32H743IIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications due to its wide temperature range (-40°C to 85°C) and various connectivity options (CAN, I2C, UART, USB).
MBR0520LT1G
Onsemi
MBR0520LT1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, has a peak reflow temperature of 260°C, and a repetitive peak reverse voltage of 20V. This diode is ideal for applications requiring high-speed switching in compact electronic devices.
ULN2803ADW
Texas Instruments
ULN2803ADW by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85 °C and has a max supply voltage of 3 V. Ideal for applications requiring buffer or inverter-based peripheral drivers with sink current flow direction.
SMBJ18CA
Alpha & Omega Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Diode Element Material: SILICON; Technology: AVALANCHE; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V;
General Instrument
LM317TG
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Minimum Input-Output Voltage Differential: 3 V; Qualification Status: Not Qualified; No. of Functions: 1;
MCF54418CMJ250R
NXP Semiconductors
MICROPROCESSOR; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
ATSAMA5D225C-D1M-CUR
Microchip Technology
ATSAMA5D225C-D1M-CUR by Microchip Technology is a 16-bit microprocessor with integrated cache and 65536 RAM words. It operates at a max clock frequency of 24 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. With 51 DMA channels, this CMOS technology processor offers high-speed processing in a compact square package.
AM5K2E04XABD4
The Texas Instruments AM5K2E04XABD4 microprocessor features integrated cache, 64-bit external data bus width, and 16-bit address bus width. Ideal for applications requiring high-speed processing and low power consumption in a compact form factor.
MCF54416CMJ250
The NXP Semiconductors MCF54416CMJ250 is a 32-bit microprocessor with integrated cache and a max clock frequency of 100 MHz. It is commonly used in industrial applications due to its low power mode and temperature grade of INDUSTRIAL.
MPC8247CVRTIEA
Freescale Semiconductor
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;
P1010NSE5HHA
MICROPROCESSOR, RISC; No. of Terminals: 425; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: BGA425,23X23,32; Peak Reflow Temperature (C): 260; Surface Mount: YES;
MCIMX535DVP1C2
MCIMX535DVP1C2 by NXP Semiconductors is a 32-bit microprocessor with 147456 RAM words, 27 MHz clock frequency, and 529 terminals. It is ideal for applications requiring high-speed processing and low power consumption, such as embedded systems and IoT devices.
AM5706BCBDD
The Texas Instruments AM5706BCBDD microprocessor features 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for low power applications with a max clock frequency of 32 MHz. Suitable for use in various electronic devices requiring high-speed processing capabilities.
ADSP-21489BSWZ-4A
Analog Devices
Analog Devices' ADSP-21489BSWZ-4A microprocessor features 40-bit size, 24-bit address bus width, and 163840 RAM words. Ideal for industrial applications, it operates at up to 25 MHz clock frequency with a max supply voltage of 1.15 V. The package style includes flatpack and low profile options for versatile integration in various systems.
MCF54418CMJ250
The NXP Semiconductors MCF54418CMJ250 microprocessor features a 32-bit architecture, integrated cache, and operates at a max clock frequency of 100 MHz. Ideal for industrial applications requiring low power consumption, it supports multiple power supplies (1.2V, 1.8V, 3.3V) and has a temperature range of -40 to 85°C.
STM32MP157AAB3T
STM32MP157AAB3T by STMicroelectronics is a 32-bit microprocessor with integrated cache and 16mm width. It operates at a max clock frequency of 64MHz, suitable for industrial applications requiring low power mode and high-speed processing. With 48 DMA channels and boundary scan support, it offers versatile performance in compact square package.
CM8070104282327
Intel
MICROPROCESSOR;
MCF5272CVM66
The NXP Semiconductors MCF5272CVM66 microprocessor features a 32-bit architecture with integrated cache and operates at a max clock frequency of 66 MHz. It is designed for industrial applications requiring low power consumption, with a temperature range from -40 to 85°C. The package style is grid array, making it suitable for surface mount assembly in various electronic devices.
P1011NSN2DFB
The NXP Semiconductors P1011NSN2DFB microprocessor features a 32-bit architecture with integrated cache and 16-bit address bus width. It is designed for applications requiring high-speed processing, with a max supply voltage of 1.05 V and external data bus width of 32 bits. The package style is grid array, making it suitable for surface mount configurations in various electronic devices.
AM5706BCBDJAS
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER COPPER;
MCF5485CVR200
The NXP Semiconductors MCF5485CVR200 is a 32-bit microprocessor with integrated cache, operating at a max frequency of 66.67 MHz. It features low power mode and boundary scan capabilities, making it ideal for industrial applications requiring high-speed processing in a compact square package.
MPC880VR66
NXP Semiconductors' MPC880VR66 microprocessor features 32-bit address and external data bus width, with integrated cache and low power mode. Suitable for RISC applications, it operates at a speed of 66 rpm with a max supply voltage of 1.9 V.
AT91SAM9260B-CU-100
Microchip AT91SAM9260B-CU-100 is a 32-bit RISC microprocessor with 8-bit RAM, 32-bit external data bus, and 26-bit address bus. It operates at up to 50 MHz clock frequency for industrial applications. Featuring integrated cache and low power mode, it's suitable for various embedded systems requiring high-speed processing in a compact form factor.
AM3354BZCZA60
AM3354BZCZA60 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 16-bit external data bus width, and max clock frequency of 26 MHz. Ideal for industrial applications requiring low power mode, it features a terminal pitch of 0.8 mm and operates at temperatures ranging from -40 to 105 °C.
AM3352BZCZD60
AM3352BZCZD60 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 16-bit external data bus width, and max clock frequency of 26 MHz. Ideal for industrial applications requiring low power mode, it features a terminal pitch of 0.8 mm and operates at temperatures ranging from -40 to 90 °C.
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MCIMX537CVP8C2
MCIMX537CVP8C2 by NXP Semiconductors is a 32-bit microprocessor with 147456 RAM words, 27 MHz clock frequency, and 1.15 V max supply voltage. Ideal for automotive applications due to its RISC technology, floating-point format, and low power mode capabilities.
MCIMX537CVV8CR2
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE;
MCIMX537CVV8CR2 by NXP Semiconductors is a 32-bit microprocessor with integrated cache and 16-bit address bus width. Ideal for automotive applications, it operates at speeds up to 27 MHz with low power mode support. The package style is grid array, featuring a max supply voltage of 1.15 V and operating temperature range from -40 to 125 °C.
MCIMX537CVV8C
MCIMX537CVV8C by NXP Semiconductors is a microprocessor with 32-bit architecture, 26-bit address bus width, and integrated cache. Ideal for automotive applications, it features a max clock frequency of 27 MHz and low power mode support. With a package style of grid array and fine pitch, this processor offers compatibility with various bus interfaces like CAN, Ethernet, I2C, SPI, UART, and USB.
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;
MCIMX6S7CVM08AC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; JESD-609 Code: e1;
MCIMX6U7CVM08AC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; External Data Bus Width: 32;
MCIMX6S6AVM08AC
MCIMX6S6AVM08AC by NXP Semiconductors is a 64-bit microprocessor with 32-bit external data bus width, operating at a max clock frequency of 24 MHz. Ideal for automotive applications, it features low power mode and integrated cache, making it suitable for high-performance computing in compact spaces.
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6U5DVM10AC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B2240;
MCIMX6U5EVM10AC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE; Integrated Cache: YES;
MCIMX6L8DVN10AB
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 576; Package Code: TFBGA; Package Shape: SQUARE;
MCIMX6U8DVM10AC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE; Width: 21 mm;
MCIMX536AVV8CR2
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 529; Package Code: HBGA; Package Shape: SQUARE;
MCIMX535DVP2C2
MCIMX535DVP2C2 by NXP Semiconductors is a 32-bit microprocessor with 147456 RAM words and 27 MHz clock frequency. It features a CMOS technology, 529 terminals, and operates b/w -20 to 85 °C. Ideal for applications requiring high-speed processing in compact devices.
MCIMX6U5DVM10AB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
MCIMX6X1CVK08AB
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6QP6AVT1AB
MCIMX6QP6AVT1AB by NXP Semiconductors is a microprocessor with a max supply voltage of 1.5V and operating temperature range of -40 to 125°C. It is commonly used in automotive applications due to its CMOS technology and fine pitch grid array package style.
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