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MCIMX6QP6AVT1AA

NXP Semiconductors

MCIMX6QP6AVT1AA by NXP Semiconductors

MCIMX6QP6AVT1AA by NXP Semiconductors is a 32-bit microprocessor with integrated cache and a max supply voltage of 1.5V. It is commonly used in automotive applications due to its temperature grade, low power mode, and boundary scan capability.

Median Price

$165.840

Lifecycle Status

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13

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1k+

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Verical

USA . 70 parts In-Stock

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$99.957

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Mouser Electronics

USA . 120 parts In-Stock

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$165.840

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$117.190

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DigiKey

USA . 120 parts In-Stock

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$165.860

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$129.632

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EBV Elektronik

Germany . 2,520 parts In-Stock

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Digiode

USA . 3,769 parts In-Stock

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$119.348

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Flip Electronics

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Vyrian

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Anansix

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Chip Stock

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Nova Conductors

Japan . 78 parts In-Stock

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Cyclops Electronics Ltd

UK . 10 parts In-Stock

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Classic Components Corporation

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SPM Sales

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AZTECH Wire

Italy . 614 parts In-Stock

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$5.398

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Corohmni

South Africa . 1,054 parts In-Stock

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$22.030

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Aztec Data Supply Inc.

USA . 301 parts In-Stock

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$52.330

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$80.217

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$76.207

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$76.207

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Semicontronic

India . 195 parts In-Stock

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$106.790

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$104.120

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$103.586

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$103.586

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Ampacity Inc.

Singapore . 74 parts In-Stock

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$106.790

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Corphita

USA . 2,629 parts In-Stock

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Microchip USA

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Lixinc

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iodParts Technologies Inc.

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Perfect Parts

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Argo Parts USA

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Futuretech Components

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Continental Prestige Electronics

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Authorized Procurement Solutions

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Bastille Electronics

Australia . 120 parts In-Stock

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Overview

Discover the power and reliability of the MCIMX6QP6AVT1AA microprocessor by NXP Semiconductors. As a leader in semiconductor manufacturing, NXP Semiconductors delivers exceptional quality and innovation. This versatile component is perfect for automotive applications, offering a wide range of benefits. With its integrated cache and low power mode, it provides efficient performance without compromising on speed. Its compact size and surface mount capability make it easy to incorporate into any design. Trust NXP Semiconductors to provide you with the cutting-edge technology you need for your next project.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This microprocessor is housed in a plastic/epoxy package, providing durability and protection for the internal components, making it a reliable choice for various applications.

Integrated Cache

YES - With integrated cache, this microprocessor can quickly store and retrieve frequently used instructions and data, resulting in improved processing speed and efficiency.

Surface Mount

YES - The surface mount feature allows for easy and convenient installation on circuit boards, making this microprocessor suitable for compact and space-saving designs.

Maximum Supply Voltage

1.5 V - The high maximum supply voltage ensures compatibility with various power sources, making this microprocessor versatile and suitable for a wide range of applications.

Address Bus Width

26 - With a 26-bit address bus width, this microprocessor is capable of addressing a large memory space, enabling complex tasks and handling large amounts of data.

Package Shape

SQUARE - The square package shape offers a compact and uniform form factor, ensuring easy integration into different electronic devices.

Bit Size

32 - With a 32-bit architecture, this microprocessor can process data and execute instructions in larger chunks, resulting in improved performance and efficiency.

No. of Terminals

624 - Having 624 terminals allows for a wide range of connections and extensive interfacing capabilities with other components, enhancing the versatility and flexibility of this microprocessor.

Package Style (Meter)

GRID ARRAY, FINE PITCH - The grid array fine pitch package style ensures precise and secure connections, minimizing signal loss and improving overall reliability of the microprocessor.

Minimum Supply Voltage

1.35 V - The low minimum supply voltage allows for energy-efficient operation, contributing to reduced power consumption and longer battery life in portable applications.

Maximum Operating Temperature

125 °C - With a high maximum operating temperature, this microprocessor can withstand demanding environments, making it suitable for industrial and automotive applications.

Minimum Operating Temperature

40 °C - The low minimum operating temperature enables reliable operation even in extreme cold conditions, ensuring the microprocessor's suitability for use in various environments.

Terminal Finish

TIN SILVER COPPER - The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance, enhancing the longevity and performance of this microprocessor.

Terminal Position

BOTTOM - The terminal position at the bottom helps facilitate easy and efficient installation and connection of the microprocessor in electronic systems.

Maximum Seated Height

2.16 mm - With a low maximum seated height, this microprocessor can be used in slim and compact form factor devices, enabling sleek and space-saving designs.

Width

21 mm - This microprocessor has a width of 21 mm, allowing for easy integration into various electronic systems and PCB layouts.

Boundary Scan

YES - The boundary scan feature enables comprehensive testing and debugging of the microprocessor, ensuring enhanced reliability and ease of troubleshooting.

External Data Bus Width

64 - With a wide external data bus width of 64 bits, this microprocessor can efficiently transfer large amounts of data, enabling faster and more capable processing capabilities.

Maximum Time At Peak Reflow Temperature (s)

40 - The maximum time at peak reflow temperature of 40 seconds ensures proper soldering and assembly of the microprocessor, leading to reliable and stable performance.

Peak Reflow Temperature °C

260 - The peak reflow temperature of 260°C ensures effective soldering and overall reliability during the manufacturing process.

Length

21 mm - With a length of 21 mm, this microprocessor can be easily accommodated in various electronic systems and PCB layouts.

Temperature Grade

AUTOMOTIVE - Designed for automotive applications, this microprocessor meets the stringent temperature requirements and reliability standards of the automotive industry.

Peripheral IC Type

MICROPROCESSOR, RISC - As a microprocessor with reduced instruction set computing (RISC) architecture, this product offers efficient and streamlined processing capabilities, making it ideal for high-performance computing tasks.

Technology

CMOS - Utilizing complementary metal-oxide-semiconductor (CMOS) technology, this microprocessor offers low power consumption and high-speed operation, making it suitable for a wide range of applications.

Terminal Form

BALL - With a ball terminal form, this microprocessor enables reliable connections and efficient heat transfer, ensuring consistent and stable performance.

Terminal Pitch

0.8 mm - The terminal pitch of 0.8 mm allows for compact and precise connections, contributing to improved signal integrity and overall system reliability.

Format

FLOATING POINT - Supporting floating-point calculations, this microprocessor is capable of handling complex mathematical operations with higher accuracy, making it suitable for scientific and computational applications.

Moisture Sensitivity Level (MSL)

3 - With a moisture sensitivity level of 3, this microprocessor can withstand moderate exposure to moisture during manufacturing and assembly processes, ensuring reliability and durability.

Speed

1000 rpm - With a speed of 1000 revolutions per minute (rpm), this microprocessor offers fast and efficient processing capabilities, ideal for high-performance computing tasks.

Low Power Mode

YES - The low power mode feature allows for energy-efficient operation, reducing power consumption and prolonging battery life, making this microprocessor suitable for portable and battery-powered applications.

Technical Specifications

Microprocessors MCIMX6QP6AVT1AA attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.16 mm

Speed:

1000 rpm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MCIMX6QP6AVT1AA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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