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AM3358BGCZA80EP

Texas Instruments

AM3358BGCZA80EP by Texas Instruments

AM3358BGCZA80EP by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus. Operating at speeds up to 800 rpm, it is ideal for industrial applications requiring low power mode and boundary scan capability. With a temperature range of -40 to 105 °C, this CMOS technology processor offers high performance in a grid array package.

Median Price

$80.616

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 330 parts In-Stock

1+ parts

$67.233

100+ parts

$65.211

1k+ parts

$50.551

10k+ parts

-

330

$67.233

$65.211

$50.551

-

Mouser Electronics

USA . 27 parts In-Stock

1+ parts

$94.000

100+ parts

$72.750

1k+ parts

-

10k+ parts

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27

$94.000

$72.750

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,964 parts In-Stock

1+ parts

$63.871

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3,964

$63.871

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$88.010

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-

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700

$88.010

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Vyrian

USA . 7,328 parts In-Stock

1+ parts

-

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7,328

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VNN

France . 15 parts In-Stock

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15

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Distributors (Availability)

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AZTECH Wire

Italy . 564 parts In-Stock

1+ parts

$11.634

100+ parts

-

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564

$11.634

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-

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Parana Technologies

USA . 853 parts In-Stock

1+ parts

$19.170

100+ parts

-

1k+ parts

$19.215

10k+ parts

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853

$19.170

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$19.215

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DigiPath Technology Company

USA . 1,273 parts In-Stock

1+ parts

$21.108

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1,273

$21.108

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ChromeModa Solutions

Germany . 2,106 parts In-Stock

1+ parts

$21.539

100+ parts

$17.662

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2,106

$21.539

$17.662

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IDEA Electronic Components Group

UK . 812 parts In-Stock

1+ parts

$21.539

100+ parts

$20.462

1k+ parts

$19.385

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812

$21.539

$20.462

$19.385

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Corphita

USA . 4,824 parts In-Stock

1+ parts

$60.510

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4,824

$60.510

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Continental Prestige Electronics

USA . 5,784 parts In-Stock

1+ parts

$88.010

100+ parts

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$86.250

5,784

$88.010

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$86.250

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$88.010

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1,000

$88.010

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Ampacity Inc.

Singapore . 117 parts In-Stock

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$124.380

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117

$124.380

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Microchip USA

USA . 1,314 parts In-Stock

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1,314

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Argo Parts USA

USA . 333 parts In-Stock

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333

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Overview

Unleash the power and efficiency of the AM3358BGCZA80EP by Texas Instruments, a top-tier manufacturer known for cutting-edge microprocessors. Perfect for a wide range of applications, this high-quality product offers unmatched performance and reliability. With integrated cache and low power mode, customers can expect seamless operation and energy efficiency. Say goodbye to technical glitches and hello to smooth functioning with this game-changing microprocessor. Upgrade your technology with Texas Instruments and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microprocessor suitable for a variety of applications without adding unnecessary weight.

Integrated Cache: YES

Having an integrated cache helps improve processing speed and efficiency by storing frequently accessed data closer to the processor.

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, saving space and making it easier for manufacturers to design and assemble products.

Maximum Supply Voltage: 1.144 V

Having a maximum supply voltage of 1.144 V ensures efficient power consumption and reduces the risk of overheating or damage to the microprocessor.

Address Bus Width: 28

A wider address bus allows for more memory and data access, improving overall performance and multitasking capabilities of the microprocessor.

Package Shape: SQUARE

The square package shape allows for efficient use of space on circuit boards and makes it easier to align and mount the microprocessor during assembly.

Bit Size: 32

A 32-bit architecture enables the microprocessor to handle larger chunks of data and perform more complex calculations, enhancing its overall computing capabilities.

No. of Terminals: 324

Having a high number of terminals enables the microprocessor to connect with other components and peripherals, expanding its functionality and versatility.

Package Style (Meter): GRID ARRAY

The grid array package style provides more contact points for secure connections, improving reliability and performance of the microprocessor.

Minimum Supply Voltage: 1.056 V

The minimum supply voltage of 1.056 V ensures stable operation and power efficiency, making the microprocessor suitable for a wide range of applications.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, this microprocessor can withstand intense processing tasks without overheating, ensuring reliable performance under demanding conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the microprocessor to function in cold environments, making it suitable for a variety of industrial and automotive applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides excellent conductivity and solderability, ensuring secure connections and reliable performance of the microprocessor.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computing) microprocessor allows for efficient and fast execution of instructions, enhancing the overall performance and speed of data processing.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the microprocessor energy-efficient and suitable for battery-powered devices or applications that require long battery life.

Terminal Form: BALL

Having a ball terminal form provides reliable connections and facilitates easy installation onto circuit boards, ensuring efficient operation and reducing the risk of connectivity issues.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage of 1.1 V ensures stable and efficient power delivery to the microprocessor, optimizing performance and ensuring reliable operation in various applications.

Format: FIXED POINT

Using a fixed-point format allows for precise and accurate numerical calculations, making the microprocessor suitable for applications that require high computational accuracy and reliability.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the microprocessor can withstand moderate exposure to moisture during manufacturing or operation, ensuring durability and reliability in various environments.

Speed: 800 rpm

Operating at a speed of 800 rpm, this microprocessor provides fast and efficient data processing, making it suitable for high-performance applications that require quick response times.

Low Power Mode: YES

Having a low power mode option allows the microprocessor to conserve energy and reduce power consumption when not operating at full capacity, making it an energy-efficient choice for battery-powered devices or applications that require power-saving features.

Technical Specifications

Microprocessors AM3358BGCZA80EP attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e0

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

324

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Speed:

800 rpm

Maximum Supply Voltage:

1.144 V

Minimum Supply Voltage:

1.056 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Peripheral IC Type:

Trade Compliance

AM3358BGCZA80EP Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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