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MCF5271CVM100

NXP Semiconductors

MCF5271CVM100 by NXP Semiconductors

The NXP Semiconductors MCF5271CVM100 microprocessor features a 32-bit architecture with integrated cache and operates at a max clock frequency of 75 MHz. Ideal for industrial applications, it has a low power mode and supports boundary scan testing for efficient debugging.

Median Price

$33.406

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

MCF5271CVM100 by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 995 parts In-Stock

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995

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DigiKey

USA . 901 parts In-Stock

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$31.000

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901

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$31.000

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Verical

USA . 846 parts In-Stock

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$35.812

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846

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$35.812

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Distributors (In-Stock)

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Nova Conductors

Japan . 150 parts In-Stock

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$27.768

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$27.768

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Chip Stock

USA . 3,300 parts In-Stock

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3,300

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TME

Poland . 1,260 parts In-Stock

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$35.757

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Flip Electronics

USA . 901 parts In-Stock

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901

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Anansix

USA . 843 parts In-Stock

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843

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Vyrian

USA . 584 parts In-Stock

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584

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Digiode

USA . 266 parts In-Stock

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266

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Velocity Electronics

USA . 52 parts In-Stock

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52

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Inventory MP

USA . 15 parts In-Stock

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Bristol Electronics

USA . 15 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 654 parts In-Stock

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$18.740

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$18.740

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Aranea Global

USA . 100 parts In-Stock

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$27.213

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$26.124

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100

$27.213

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$26.124

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Continental Prestige Electronics

USA . 2,565 parts In-Stock

1+ parts

$27.768

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$27.213

2,565

$27.768

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$27.213

Advanced Electronics

New Zealand . 870 parts In-Stock

1+ parts

$28.323

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$28.323

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$28.323

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870

$28.323

$28.323

$28.323

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Ampacity Inc.

Singapore . 643 parts In-Stock

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$41.720

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643

$41.720

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Semicontronic

India . 270 parts In-Stock

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$41.720

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$40.677

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$40.468

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270

$41.720

$40.677

$40.468

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Corohmni

South Africa . 175 parts In-Stock

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$61.367

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Microchip USA

USA . 1,003 parts In-Stock

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$63.765

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Aztec Data Supply Inc.

USA . 153 parts In-Stock

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$74.160

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153

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UNI Independent Distributors

Spain . 6,959 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,735 parts In-Stock

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Corphita

USA . 4,633 parts In-Stock

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Argo Parts USA

USA . 1,028 parts In-Stock

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Perfect Parts

USA . 706 parts In-Stock

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706

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Overview

Unlock the power of advanced technology with the MCF5271CVM100 by NXP Semiconductors. Designed to deliver superior performance and reliability, this microprocessor is perfect for a wide range of applications. With integrated cache, low power mode, and peripheral IC type, it offers unmatched value and benefits to customers looking for high-quality solutions. Trust in NXP's expertise and innovation to take your projects to the next level with the MCF5271CVM100.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, suitable for portable and rugged applications.

Integrated Cache: YES

Having integrated cache helps in improving performance by reducing access time to frequently used instructions and data.

Maximum Supply Voltage: 1.6 V

Operates efficiently within a safe voltage range, ensuring stability and reliability.

Address Bus Width: 24

A wider address bus allows for larger memory address space and more efficient data transfer.

Bit Size: 32

With a 32-bit architecture, the processor can handle larger chunks of data at once, improving overall performance.

No. of Terminals: 196

Higher number of terminals allow for greater connectivity options and integration with other components.

Minimum Operating Temperature: -40 °C

Operates reliably in extreme low temperature environments, making it suitable for various applications.

Maximum Clock Frequency: 75 MHz

Capable of high clock speeds, enabling fast data processing and overall improved performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the processor energy-efficient and reliable.

Technical Specifications

Microprocessors MCF5271CVM100 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

196

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Speed:

100 rpm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

15 mm

Peripheral IC Type:

Trade Compliance

MCF5271CVM100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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