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MIMXRT1051DVL6B

NXP Semiconductors

MIMXRT1051DVL6B by NXP Semiconductors

The NXP Semiconductors MIMXRT1051DVL6B microprocessor features 32-bit architecture, 24 MHz clock frequency, and 524288 RAM words. Ideal for applications requiring low power consumption and high-speed processing in a compact form factor. Suitable for use in IoT devices, wearables, and industrial automation systems.

Median Price

$6.520

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 240 parts In-Stock

1+ parts

$6.520

100+ parts

$5.810

1k+ parts

$5.710

10k+ parts

-

240

$6.520

$5.810

$5.710

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Arrow

USA . 198 parts In-Stock

1+ parts

$6.540

100+ parts

-

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198

$6.540

-

-

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Verical

USA . 3,360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.707

10k+ parts

$6.546

3,360

-

-

$6.707

$6.546

DigiKey

USA . 2,757 parts In-Stock

1+ parts

-

100+ parts

$5.560

1k+ parts

-

10k+ parts

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2,757

-

$5.560

-

-

Rochester

USA . 1,925 parts In-Stock

1+ parts

-

100+ parts

$5.210

1k+ parts

$4.660

10k+ parts

$4.380

1,925

-

$5.210

$4.660

$4.380

Flip Electronics (Authorized)

USA . 357 parts In-Stock

1+ parts

-

100+ parts

-

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357

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,688 parts In-Stock

1+ parts

$5.482

100+ parts

-

1k+ parts

-

10k+ parts

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1,688

$5.482

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-

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Nova Conductors

Japan . 18 parts In-Stock

1+ parts

$9.800

100+ parts

-

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18

$9.800

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Maritex

Poland . 257 parts In-Stock

1+ parts

$11.193

100+ parts

$7.770

1k+ parts

$6.893

10k+ parts

-

257

$11.193

$7.770

$6.893

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Vyrian

USA . 11,467 parts In-Stock

1+ parts

-

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11,467

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Chip Stock

USA . 4,500 parts In-Stock

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4,500

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Flip Electronics

USA . 2,757 parts In-Stock

1+ parts

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2,757

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-

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TME

Poland . 1,168 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$7.620

10k+ parts

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1,168

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-

$7.620

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Anansix

USA . 997 parts In-Stock

1+ parts

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997

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 609 parts In-Stock

1+ parts

$4.900

100+ parts

-

1k+ parts

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609

$4.900

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-

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Semicontronic

India . 600 parts In-Stock

1+ parts

$4.900

100+ parts

$4.778

1k+ parts

$4.753

10k+ parts

-

600

$4.900

$4.778

$4.753

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Corphita

USA . 584 parts In-Stock

1+ parts

$5.193

100+ parts

-

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584

$5.193

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Continental Prestige Electronics

USA . 5,707 parts In-Stock

1+ parts

$8.143

100+ parts

-

1k+ parts

-

10k+ parts

$7.980

5,707

$8.143

-

-

$7.980

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$9.604

100+ parts

-

1k+ parts

$9.220

10k+ parts

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2,000

$9.604

-

$9.220

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Corohmni

South Africa . 480 parts In-Stock

1+ parts

$9.806

100+ parts

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480

$9.806

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Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$10.100

100+ parts

$9.595

1k+ parts

$9.595

10k+ parts

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10

$10.100

$9.595

$9.595

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Microchip USA

USA . 1,681 parts In-Stock

1+ parts

$36.008

100+ parts

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1,681

$36.008

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Aztec Data Supply Inc.

USA . 1,955 parts In-Stock

1+ parts

$66.180

100+ parts

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1,955

$66.180

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Lixinc

USA . 14,688 parts In-Stock

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14,688

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UNI Independent Distributors

Spain . 4,317 parts In-Stock

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4,317

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Argo Parts USA

USA . 3,320 parts In-Stock

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3,320

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Overview

Unlock the power of cutting-edge technology with the NXP Semiconductors MIMXRT1051DVL6B microprocessor. As a leader in the industry, NXP Semiconductors delivers top-of-the-line quality and reliability in every product they create. Ideal for a wide range of applications, this microprocessor offers unparalleled value, benefits, and advantages to customers. Experience seamless performance, innovative features, and superior functionality with the MIMXRT1051DVL6B by NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials make the package durable and resistant to physical damage, ensuring the longevity of the microprocessor.

Integrated Cache: YES

Having integrated cache improves the performance of the microprocessor by reducing memory access time and increasing data retrieval speeds.

Maximum Supply Voltage: 1.3 V

Operating within a maximum supply voltage of 1.3V ensures stable and efficient performance while preventing damage from voltage spikes.

On Chip Data RAM Width: 8

Having a wide on-chip data RAM width of 8 enhances data processing capabilities, enabling faster execution of tasks.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, making it suitable for compact electronic devices.

Bit Size: 32

A 32-bit architecture provides a balance between performance and power efficiency, making it suitable for a wide range of applications.

No. of Terminals: 196

Having a large number of terminals enables connectivity to various external devices and peripherals, increasing the versatility of the microprocessor.

Technology: CMOS

CMOS technology offers a good balance between power consumption and processing speed, making the microprocessor energy-efficient and high-performing.

Maximum Clock Frequency: 24 MHz

With a maximum clock frequency of 24 MHz, the microprocessor can handle tasks at high speeds, ensuring smooth operation and quick response times.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor, it is optimized for efficient task execution, making it a good choice for applications requiring high performance and low power consumption.

Low Power Mode: YES

The low power mode feature helps in reducing power consumption during idle or low activity periods, enhancing energy efficiency and prolonging battery life.

Technical Specifications

Microprocessors MIMXRT1051DVL6B attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

24 MHz

External Data Bus Width:

0

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of Serial I/Os:

29

No. of Terminals:

196

On Chip Data RAM Width:

8

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA196,14X14,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

524288

Maximum Seated Height:

1.43 mm

Speed:

600 rpm

Maximum Supply Current:

105 mA

Maximum Supply Voltage:

1.3 V

Minimum Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MIMXRT1051DVL6B Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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