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XAM6234ATCGGAALW

Texas Instruments

XAM6234ATCGGAALW by Texas Instruments

XAM6234ATCGGAALW by Texas Instruments is a 64-bit microprocessor with 8-bit on-chip data RAM and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz, suitable for low power mode applications in various devices due to its CMOS technology and integrated cache feature. The package style is grid array with very thin profile, making it ideal for compact designs requiring high processing speeds.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 5,767 parts In-Stock

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Digiode

USA . 312 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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AZTECH Wire

Italy . 208 parts In-Stock

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$11.329

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One Stop Electronics

USA . 391 parts In-Stock

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Ampacity Inc.

Singapore . 430 parts In-Stock

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Semicontronic

India . 1,349 parts In-Stock

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Corohmni

South Africa . 18 parts In-Stock

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Parana Technologies

USA . 1,962 parts In-Stock

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ChromeModa Solutions

Germany . 4,402 parts In-Stock

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IDEA Electronic Components Group

UK . 541 parts In-Stock

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Corphita

USA . 3,786 parts In-Stock

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Continental Prestige Electronics

USA . 2,825 parts In-Stock

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Argo Parts USA

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DigiPath Technology Company

USA . 631 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the XAM6234ATCGGAALW by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their microprocessors. Perfect for a wide range of applications, this microprocessor boasts integrated cache, surface mount capability, and a maximum clock frequency of 26 MHz. With a compact package design and low power mode, this product offers unparalleled value and performance to customers seeking high-speed processing and efficient data handling. Elevate your projects with the XAM6234ATCGGAALW and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, making it a reliable choice for long-term use.

Integrated Cache: YES

Having an integrated cache improves the speed and efficiency of data processing, enhancing overall performance.

Maximum Clock Frequency: 26 MHz

A high maximum clock frequency allows for faster data processing and response times, making this microprocessor suitable for demanding tasks.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, making this microprocessor energy-efficient and reliable.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this microprocessor can withstand heat-intensive environments without compromising performance.

Technical Specifications

Microprocessors XAM6234ATCGGAALW attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

also available with 0.75V Nom suppl

Address Bus Width:

14

Bit Size:

64

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B425

Length:

13 mm

Low Power Mode:

YES

No. of External Interrupts:

1

No. of Serial I/Os:

9

No. of Terminals:

425

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA425,25X25,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Words:

835584

Maximum Seated Height:

.89 mm

Speed:

1400 rpm

Maximum Supply Voltage:

.895 V

Minimum Supply Voltage:

.81 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

Trade Compliance

XAM6234ATCGGAALW Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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