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XAM6254ATCGGAALW

Texas Instruments

XAM6254ATCGGAALW by Texas Instruments

XAM6254ATCGGAALW by Texas Instruments is a microprocessor with integrated cache and a 64-bit size. It has a max clock frequency of 26 MHz and is suitable for applications requiring low power mode, such as embedded systems or IoT devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,384 parts In-Stock

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Digiode

USA . 1,938 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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One Stop Electronics

USA . 1,636 parts In-Stock

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$1.000

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1,636

$1.000

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AZTECH Wire

Italy . 250 parts In-Stock

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$12.964

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250

$12.964

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Ampacity Inc.

Singapore . 1,422 parts In-Stock

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$21.000

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$21.000

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Corohmni

South Africa . 187 parts In-Stock

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$23.950

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187

$23.950

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Parana Technologies

USA . 306 parts In-Stock

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$29.069

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$2,699.514

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$26.162

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306

$29.069

$2,699.514

$26.162

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DigiPath Technology Company

USA . 2,310 parts In-Stock

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$32.009

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$29.448

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$32.009

$29.448

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ChromeModa Solutions

Germany . 5,426 parts In-Stock

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$32.662

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$26.783

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$32.662

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IDEA Electronic Components Group

UK . 695 parts In-Stock

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$32.662

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$31.029

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$29.396

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695

$32.662

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$29.396

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Corphita

USA . 3,383 parts In-Stock

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Continental Prestige Electronics

USA . 1,662 parts In-Stock

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Argo Parts USA

USA . 1,073 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Discover the power of the XAM6254ATCGGAALW microprocessor by Texas Instruments. As a leader in the industry, Texas Instruments brings unrivaled quality and innovation to their products. With its integrated cache and surface mount capabilities, this microprocessor offers exceptional performance for a wide range of applications. Whether you're working on robotics, embedded systems, or IoT devices, the XAM6254ATCGGAALW delivers the speed and efficiency you need. Its compact size and low power mode make it perfect for space-constrained designs, while its high clock frequency ensures smooth operation. Unlock endless possibilities with the XAM6254ATCGGAALW and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This microprocessor's plastic/epoxy package body material provides excellent durability and protection, making it suitable for various applications.

Integrated Cache: YES

With an integrated cache, this microprocessor is capable of storing frequently accessed data and instructions, allowing for faster and more efficient processing.

Surface Mount: YES

The surface mount capability of this microprocessor simplifies the manufacturing and assembly process, making it easier to integrate into electronic devices and systems.

Maximum Supply Voltage: 0.895 V

The low maximum supply voltage requirement of this microprocessor reduces power consumption and enhances energy efficiency, making it an ideal choice for portable devices with limited power resources.

On Chip Data RAM Width: 8

The wide on-chip data RAM width of 8 bits allows for the simultaneous processing of multiple data sets, improving overall performance and multitasking capabilities.

Address Bus Width: 14

With a 14-bit address bus width, this microprocessor can access a large memory range, enabling the handling of complex calculations and data-intensive tasks.

Package Shape: SQUARE

The square package shape of this microprocessor simplifies the design and layout of circuit boards, maximizing space efficiency and enabling compact electronic device designs.

Bit Size: 64

The 64-bit architecture of this microprocessor allows for larger data processing and handling, facilitating advanced computational tasks and supporting complex software applications.

No. of Terminals: 425

With a high number of terminals, this microprocessor offers extensive connectivity options, enabling integration with various peripheral devices and expanding versatility in system design.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style, combined with a very thin profile and fine pitch, enhances electrical performance, reduces signal interference, and facilitates efficient heat dissipation.

Minimum Supply Voltage: 0.81 V

The low minimum supply voltage requirement ensures compatibility with various power sources and offers flexibility in power management, making this microprocessor suitable for a wide range of applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature threshold of 105°C enables reliable performance in demanding environments, ensuring stability and longevity for this microprocessor.

No. of External Interrupts: 1

The presence of an external interrupt allows the microprocessor to respond quickly to external events or signals, enhancing real-time processing capabilities and enabling rapid system reactions.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this microprocessor can withstand extreme cold environments, making it suitable for various applications in harsh climates.

Terminal Position: BOTTOM

The bottom terminal position simplifies the integration and assembly of this microprocessor into electronic devices, ensuring convenient and efficient connections with other components.

Maximum Seated Height: 0.89 mm

The low maximum seated height of 0.89 mm ensures a compact form factor and facilitates space-efficient designs, making this microprocessor suitable for slim and portable electronic devices.

RAM Words: 835584

With a large number of RAM words, this microprocessor offers ample memory capacity for storing and manipulating data, facilitating complex computations and supporting memory-intensive applications.

Width: 13 mm

The compact width of 13 mm allows for flexible placement and integration of this microprocessor in various electronic systems, contributing to space efficiency and compact designs.

Boundary Scan: YES

The inclusion of boundary scan capability allows for efficient testing, debugging, and fault diagnosis of this microprocessor, simplifying troubleshooting and reducing development time.

External Data Bus Width: 16

With a wide external data bus width of 16 bits, this microprocessor can transfer larger amounts of data between the processor and external devices, enhancing data throughput and improving performance.

Maximum Clock Frequency: 26 MHz

The high maximum clock frequency of 26 MHz enables quicker data processing and execution, resulting in faster overall system performance and improved responsiveness.

Length: 13 mm

The compact length of 13 mm facilitates space-efficient designs and flexible placement options, making this microprocessor suitable for compact electronic devices and systems.

Peripheral IC Type: MICROPROCESSOR, RISC

This microprocessor belongs to the RISC (Reduced Instruction Set Computing) architecture, offering simplified and streamlined instruction execution for efficient processing and improved performance.

Technology: CMOS

With CMOS (Complementary Metal-Oxide-Semiconductor) technology, this microprocessor provides a good balance between power consumption and speed, making it energy-efficient while maintaining high performance.

Terminal Form: BALL

The use of ball terminal form simplifies the soldering process during assembly, ensuring reliable electrical connections and facilitating ease of integration into electronic systems.

Nominal Supply Voltage: 0.85 V

The low nominal supply voltage requirement offers power efficiency and compatibility with various power sources, making this microprocessor suitable for battery-operated devices and energy-conscious applications.

No. of Serial I/Os: 9

With 9 serial I/Os, this microprocessor offers versatile connectivity options for exchanging data with external devices, expanding communication capabilities and supporting various system configurations.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm provides compatibility with fine-pitch circuit boards, contributing to space-efficient designs and facilitating precise connections in compact electronic systems.

Format: FIXED POINT

This microprocessor utilizes fixed-point format, offering efficient and accurate numerical calculations, making it well-suited for applications requiring precise mathematical computations.

Speed: 1400 rpm

The high speed capability of 1400 rpm enhances processing efficiency and enables rapid execution of instructions, improving system responsiveness and performance.

Low Power Mode: YES

With a low power mode option, this microprocessor enables power-saving operation, making it suitable for battery-powered devices and enhancing overall energy efficiency.

Technical Specifications

Microprocessors XAM6254ATCGGAALW attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

also available with 0.75V Nom suppl

Address Bus Width:

14

Bit Size:

64

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B425

Length:

13 mm

Low Power Mode:

YES

No. of External Interrupts:

1

No. of Serial I/Os:

9

No. of Terminals:

425

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA425,25X25,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Words:

835584

Maximum Seated Height:

.89 mm

Speed:

1400 rpm

Maximum Supply Voltage:

.895 V

Minimum Supply Voltage:

.81 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

13 mm

Peripheral IC Type:

Trade Compliance

XAM6254ATCGGAALW Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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