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XAM6526ACDXEAF

Texas Instruments

XAM6526ACDXEAF by Texas Instruments

XAM6526ACDXEAF by Texas Instruments is a Microprocessor with 16-bit External Data Bus, 28-bit Address Bus, and integrated cache. It operates at a max clock frequency of 27 MHz and is suitable for industrial applications requiring low power consumption. The package style is grid array with 784 terminals in a square shape, making it ideal for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,040 parts In-Stock

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5,040

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Digiode

USA . 158 parts In-Stock

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158

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 693 parts In-Stock

1+ parts

$5.424

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693

$5.424

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One Stop Electronics

USA . 835 parts In-Stock

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$32.000

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835

$32.000

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Parana Technologies

USA . 392 parts In-Stock

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$64.591

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392

$64.591

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DigiPath Technology Company

USA . 951 parts In-Stock

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$71.123

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951

$71.123

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IDEA Electronic Components Group

UK . 1,992 parts In-Stock

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$72.574

100+ parts

$68.945

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$65.317

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1,992

$72.574

$68.945

$65.317

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ChromeModa Solutions

Germany . 672 parts In-Stock

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$72.574

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$59.511

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672

$72.574

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Corphita

USA . 3,163 parts In-Stock

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Overview

Unleash the power of innovation with the XAM6526ACDXEAF microprocessor by Texas Instruments. Known for their high-quality products, Texas Instruments delivers cutting-edge technology that exceeds industry standards. This versatile microprocessor is perfect for a wide range of applications, offering unparalleled performance and reliability. Say goodbye to limitations and embrace endless possibilities with the XAM6526ACDXEAF. Elevate your projects to new heights and experience the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microprocessor, ensuring a longer lifespan.

Integrated Cache: YES

Integrated cache helps in faster data access and improves overall performance of the microprocessor.

Maximum Supply Voltage: 1.05 V

Operating at a maximum supply voltage of 1.05 V helps in reducing power consumption and heat generation.

Address Bus Width: 28

A wider address bus width of 28 allows for efficient communication between the microprocessor and memory, enhancing data transfer speed.

Package Shape: SQUARE

The square package shape allows for easy installation and compact integration into various electronic devices.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, this microprocessor can withstand high temperature environments without performance degradation.

External Data Bus Width: 16

Having a wider external data bus width of 16 facilitates faster data transfer between the microprocessor and external devices.

Technical Specifications

Microprocessors XAM6526ACDXEAF attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B784

Length:

23 mm

Low Power Mode:

YES

No. of Terminals:

784

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.63 mm

Speed:

1100 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

XAM6526ACDXEAF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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