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XAM6527ACDXEAF

Texas Instruments

XAM6527ACDXEAF by Texas Instruments

XAM6527ACDXEAF by Texas Instruments is a Microprocessor with 16-bit External Data Bus, 28-bit Address Bus, and integrated cache. It operates at a max clock frequency of 27 MHz and is suitable for industrial applications requiring low power consumption. The package style is Grid Array with 784 terminals in a square shape.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 3,317 parts In-Stock

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Digiode

USA . 688 parts In-Stock

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AZTECH Wire

Italy . 248 parts In-Stock

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$10.294

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One Stop Electronics

USA . 991 parts In-Stock

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$15.000

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991

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Parana Technologies

USA . 581 parts In-Stock

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$58.501

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$5,432.750

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$52.651

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581

$58.501

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DigiPath Technology Company

USA . 282 parts In-Stock

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$64.417

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282

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ChromeModa Solutions

Germany . 5,000 parts In-Stock

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$65.732

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$53.900

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$65.732

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IDEA Electronic Components Group

UK . 1,536 parts In-Stock

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$65.732

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$62.445

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$59.159

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Corphita

USA . 2,383 parts In-Stock

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Overview

Experience the power and efficiency of the XAM6527ACDXEAF by Texas Instruments. Crafted with precision and reliability, this microprocessor offers seamless performance for a wide range of applications. Whether you're looking to enhance your industrial processes or streamline your computing systems, this innovative product delivers unmatched value and benefits. Trust in Texas Instruments to provide cutting-edge technology that maximizes productivity and efficiency. Elevate your projects with the XAM6527ACDXEAF and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reduces the risk of damage during handling and assembly.

Integrated Cache: YES

Integrated cache improves processing speed by storing frequently accessed data for quick retrieval.

Surface Mount: YES

Surface mount capability makes it easier to integrate the microprocessor onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.05 V

Operates efficiently at a relatively low maximum supply voltage, reducing power consumption.

Address Bus Width: 28

Wide address bus width allows for efficient handling of memory addresses for improved performance.

Package Shape: SQUARE

Square package shape allows for a more compact design, ideal for space-constrained applications.

No. of Terminals: 784

Higher number of terminals provide more connections for enhanced functionality and versatility.

Minimum Supply Voltage: 0.95 V

Can operate at low voltages, enabling power efficiency and reduced heat generation.

Maximum Operating Temperature: 105 °C

Can withstand high operating temperatures, suitable for industrial environments with varying conditions.

Minimum Operating Temperature: -40 °C

Can operate in very cold temperatures, making it suitable for a wide range of environments.

Terminal Position: BOTTOM

Bottom terminal position allows for easier PCB layout and integration, improving overall design flexibility.

Maximum Seated Height: 1.63 mm

Low profile design with maximum seated height allows for compact system designs and efficient use of space.

Width: 23 mm

Compact width size enables easy integration into various hardware designs and form factors.

Boundary Scan: YES

Boundary scan feature aids in testing and debugging during production, ensuring quality and reliability.

External Data Bus Width: 16

Sufficient external data bus width for data transfer, enabling efficient communication with other components.

Maximum Clock Frequency: 27 MHz

Capable of high clock frequencies for fast processing and performance, suitable for demanding applications.

Length: 23 mm

Compact length size allows for flexibility in system design and integration.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges and environments, ensuring reliable operation in harsh conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture in a microprocessor provides efficient processing power for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with modern circuit designs.

Terminal Form: BALL

Ball terminal form allows for reliable connections and easy soldering during assembly.

Nominal Supply Voltage: 1 V

Nominal supply voltage ensures stable and efficient operation of the microprocessor.

Terminal Pitch: 0.8 mm

Fine terminal pitch provides precise connections and allows for compact PCB layout designs.

Format: FIXED POINT

Fixed point format is suitable for general-purpose computing tasks, making this microprocessor versatile for various applications.

Speed: 1100 rpm

Operates at a fast speed of 1100 rpm, providing quick processing for demanding tasks.

Low Power Mode: YES

Low power mode option offers energy efficiency and extended battery life for mobile devices or power-sensitive applications.

Technical Specifications

Microprocessors XAM6527ACDXEAF attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B784

Length:

23 mm

Low Power Mode:

YES

No. of Terminals:

784

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.63 mm

Speed:

1100 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

XAM6527ACDXEAF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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