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MCF5475ZP266

NXP Semiconductors

MCF5475ZP266 by NXP Semiconductors

NXP Semiconductors' MCF5475ZP266 microprocessor features 32-bit address and external data bus width, operates at a max clock frequency of 66.66 MHz. Ideal for commercial applications requiring low power mode, this RISC-based processor has integrated cache and supports boundary scan technology.

Median Price

$86.816

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 70 parts In-Stock

1+ parts

-

100+ parts

$77.170

1k+ parts

$69.050

10k+ parts

$64.980

70

-

$77.170

$69.050

$64.980

Verical

USA . 70 parts In-Stock

1+ parts

-

100+ parts

$96.463

1k+ parts

$86.313

10k+ parts

$81.225

70

-

$96.463

$86.313

$81.225

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,451 parts In-Stock

1+ parts

$67.868

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3,451

$67.868

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Nova Conductors

Japan . 98 parts In-Stock

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$68.742

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98

$68.742

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Vyrian

USA . 2,116 parts In-Stock

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Anansix

USA . 327 parts In-Stock

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Flip Electronics

USA . 25 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 723 parts In-Stock

1+ parts

$13.051

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723

$13.051

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Vigor

Singapore . 1,847 parts In-Stock

1+ parts

$49.780

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1,847

$49.780

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One Stop Electronics

USA . 70 parts In-Stock

1+ parts

$60.720

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70

$60.720

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Ampacity Inc.

Singapore . 70 parts In-Stock

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$60.720

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$60.720

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Corphita

USA . 1,206 parts In-Stock

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$64.296

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$64.296

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Continental Prestige Electronics

USA . 6,204 parts In-Stock

1+ parts

$68.742

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10k+ parts

$67.367

6,204

$68.742

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$67.367

Microchip USA

USA . 8,131 parts In-Stock

1+ parts

$158.107

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$158.107

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UNI Independent Distributors

Spain . 7,810 parts In-Stock

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Argo Parts USA

USA . 2,105 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$67.367

1k+ parts

$65.305

10k+ parts

$63.930

1,000

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$67.367

$65.305

$63.930

Formix International (Excess)

India . 85 parts In-Stock

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Overview

Unleash unparalleled performance with the MCF5475ZP266 by NXP Semiconductors, a top-tier microprocessor that sets the standard in the industry. Crafted with precision and expertise, this powerhouse delivers seamless integration, enhanced efficiency, and unmatched reliability. Whether powering gaming consoles, automotive systems, or industrial machinery, this cutting-edge technology guarantees top-notch performance every time. Elevate your projects to new heights with the MCF5475ZP266 and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the microprocessor, making it a cost-effective choice.

Integrated Cache: YES

The integrated cache enhances the performance and speed of the microprocessor, making it ideal for high-demand applications.

Surface Mount: YES

Being surface mountable allows for easy installation and compact design, making it suitable for space-constrained environments.

Maximum Supply Voltage: 1.58 V

With a high maximum supply voltage, this microprocessor can handle power fluctuations without compromising performance.

Address Bus Width: 32

A wider address bus width enables the microprocessor to access larger amounts of memory, improving overall efficiency.

Package Shape: SQUARE

The square package shape allows for efficient layout and space utilization in circuit designs.

Bit Size: 32

A 32-bit architecture provides higher processing speeds and improved multitasking capabilities, making this microprocessor a powerful choice.

No. of Terminals: 388

The large number of terminals provides connectivity options for various peripherals, enhancing the versatility of this microprocessor.

Package Style (Meter): GRID ARRAY

The grid array package style offers high density and reliability, making it suitable for demanding applications.

Minimum Supply Voltage: 1.43 V

With a low minimum supply voltage, this microprocessor is energy-efficient and can operate effectively in low-power settings.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for operation in cold environments without compromising performance.

Terminal Finish: NICKEL GOLD

The nickel gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure connections in PCB layouts, enhancing the overall durability of the microprocessor.

Maximum Seated Height: 2.55 mm

The low maximum seated height allows for slim and compact device designs using this microprocessor.

Technical Specifications

Microprocessors MCF5475ZP266 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.66 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B388

JESD-609 Code:

e4

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

388

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.55 mm

Speed:

266.66 rpm

Maximum Supply Voltage:

1.58 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

27 mm

Peripheral IC Type:

Trade Compliance

MCF5475ZP266 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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