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SAM9X60D1GT-I/4FB

Microchip Technology

SAM9X60D1GT-I/4FB by Microchip Technology

SAM9X60D1GT-I/4FB by Microchip is a microprocessor with 16 DMA channels, 50 MHz clock frequency, and 233 terminals. Ideal for industrial applications, it operates b/w -40 to 85 °C with low power mode and integrated cache for efficient processing. The package style is grid array with a rectangular shape and thin profile.

Median Price

$7.795

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 2,999 parts In-Stock

1+ parts

$7.630

100+ parts

$6.820

1k+ parts

$6.520

10k+ parts

$6.330

2,999

$7.630

$6.820

$6.520

$6.330

Mouser Electronics

USA . 985 parts In-Stock

1+ parts

$7.960

100+ parts

-

1k+ parts

-

10k+ parts

-

985

$7.960

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 5,000 parts In-Stock

1+ parts

$9.130

100+ parts

$8.280

1k+ parts

$7.570

10k+ parts

-

5,000

$9.130

$8.280

$7.570

-

Nova Conductors

Japan . 53 parts In-Stock

1+ parts

$15.160

100+ parts

-

1k+ parts

-

10k+ parts

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53

$15.160

-

-

-

Chip Stock

USA . 9,338 parts In-Stock

1+ parts

-

100+ parts

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9,338

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-

-

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Vyrian

USA . 1,092 parts In-Stock

1+ parts

-

100+ parts

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1,092

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,739 parts In-Stock

1+ parts

$9.660

100+ parts

-

1k+ parts

-

10k+ parts

-

1,739

$9.660

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-

-

Semicontronic

India . 898 parts In-Stock

1+ parts

$9.660

100+ parts

$9.418

1k+ parts

$9.370

10k+ parts

-

898

$9.660

$9.418

$9.370

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Continental Prestige Electronics

USA . 1,147 parts In-Stock

1+ parts

$15.160

100+ parts

-

1k+ parts

-

10k+ parts

$14.857

1,147

$15.160

-

-

$14.857

Component Stockers USA

USA . 23,082 parts In-Stock

1+ parts

$15.350

100+ parts

$12.740

1k+ parts

$11.720

10k+ parts

$11.160

23,082

$15.350

$12.740

$11.720

$11.160

Corohmni

South Africa . 74 parts In-Stock

1+ parts

$16.160

100+ parts

-

1k+ parts

-

10k+ parts

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74

$16.160

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-

-

Advanced Electronics

New Zealand . 43 parts In-Stock

1+ parts

$69.741

100+ parts

$66.254

1k+ parts

$66.254

10k+ parts

-

43

$69.741

$66.254

$66.254

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Aztec Data Supply Inc.

USA . 248 parts In-Stock

1+ parts

$71.740

100+ parts

-

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248

$71.740

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West Coast Incorporated

USA . 7,217 parts In-Stock

1+ parts

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100+ parts

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7,217

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Argo Parts USA

USA . 1,971 parts In-Stock

1+ parts

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100+ parts

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1,971

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Robosynatics

Brazil . 1,708 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,708

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Lucentia Tech

USA . 1,708 parts In-Stock

1+ parts

-

100+ parts

$10.610

1k+ parts

$10.610

10k+ parts

$10.610

1,708

-

$10.610

$10.610

$10.610

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,000

-

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Overview

Unleash the power of cutting-edge technology with the SAM9X60D1GT-I/4FB microprocessor by Microchip Technology. Built with precision and expertise, this versatile component offers seamless integration, superior performance, and unmatched reliability for a wide range of applications. Elevate your projects with ease and efficiency while enjoying the value and benefits that come with choosing a product from a trusted industry leader. Take your innovations to the next level with the SAM9X60D1GT-I/4FB - where quality meets excellence.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Durable and cost-effective material for long-lasting performance.

Integrated Cache:

YES - Provides faster access to frequently used data, improving overall speed.

Surface Mount:

YES - Easy installation and space-saving design for compact devices.

Maximum Supply Voltage:

1.9 V - Efficient power consumption with a safe voltage limit.

On Chip Data RAM Width:

8 - Allows for fast data processing and storage capabilities.

Address Bus Width:

6 - Supports a wide range of memory addresses for versatile applications.

Package Shape:

RECTANGULAR - Standard shape for compatibility with various mounting options.

No. of Terminals:

233 - Sufficient connections for versatile external device interactions.

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH - Optimal design for high-density mounting and improved signal transmission.

Minimum Supply Voltage:

1.7 V - Provides a lower power option without sacrificing performance.

Maximum Operating Temperature:

85 °C - Allows for reliable operation in various environmental conditions.

Minimum Operating Temperature:

40 °C - Ensures functionality even in extreme cold temperatures.

Terminal Finish:

TIN SILVER COPPER - Corrosion-resistant finish for enhanced durability.

Terminal Position:

BOTTOM - Facilitates easier circuit board layout and connections.

Maximum Seated Height:

1.2 mm - Low-profile design for space-constrained applications.

RAM Words:

69632 - Sufficient memory for storing and processing data efficiently.

Width:

14 mm - Compact size for easy integration into different devices.

Boundary Scan:

YES - Simplifies testing and debugging processes for improved reliability.

External Data Bus Width:

16 - Wide data bus for faster data transfer speeds.

Maximum Clock Frequency:

50 MHz - Supports high-speed operation for demanding applications.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures proper soldering during manufacturing.

Peak Reflow Temperature °C:

260 - Ideal temperature for reliable solder joints during assembly.

Length:

14 mm - Balanced dimensions for efficient use of board space.

Temperature Grade:

INDUSTRIAL - Suitable for rugged industrial environments.

Peripheral IC Type:

MICROPROCESSOR, RISC - Specialized design for efficient data processing tasks.

Technology:

CMOS - Low-power consumption technology for energy-efficient operation.

Terminal Form:

BALL - Enhances connectivity and reliability in circuit board assembly.

Nominal Supply Voltage:

1.8 V - Optimal voltage level for efficient performance.

No. of DMA Channels:

16 - Multiple channels for simultaneous data transfers and processing.

Terminal Pitch:

0.8 mm - Fine pitch for high-density mounting and connections.

Format:

FIXED POINT - Standard format for numerical calculations and data processing.

Moisture Sensitivity Level (MSL):

3 - Moderate sensitivity to moisture for indoor use.

Speed:

600 rpm - Supports fast processing speeds for responsive performance.

Low Power Mode:

YES - Energy-saving mode for extended battery life in portable devices.

Technical Specifications

Microprocessors SAM9X60D1GT-I/4FB attributes and parameters. Explore more Microprocessors devices from Microchip Technology

Specs

Additional Features:

1-Gbit DDR2--SDRAM AVAILABLE

Address Bus Width:

6

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

R-PBGA-B233

JESD-609 Code:

e1

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of Terminals:

233

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA233,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

69632

Maximum Seated Height:

1.2 mm

Speed:

600 rpm

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SAM9X60D1GT-I/4FB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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