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AM3354BZCZ30

Texas Instruments

AM3354BZCZ30 by Texas Instruments

AM3354BZCZ30 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for low power applications. With 64 DMA channels, it is ideal for use in devices requiring high-speed data processing.

Median Price

$14.614

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 14,763 parts In-Stock

1+ parts

$11.109

100+ parts

$9.703

1k+ parts

$6.692

10k+ parts

-

14,763

$11.109

$9.703

$6.692

-

Mouser Electronics

USA . 126 parts In-Stock

1+ parts

$18.120

100+ parts

$11.260

1k+ parts

$10.340

10k+ parts

-

126

$18.120

$11.260

$10.340

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 514 parts In-Stock

1+ parts

$10.554

100+ parts

-

1k+ parts

-

10k+ parts

-

514

$10.554

-

-

-

Nova Conductors

Japan . 85 parts In-Stock

1+ parts

$13.090

100+ parts

-

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-

10k+ parts

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85

$13.090

-

-

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Vyrian

USA . 7,522 parts In-Stock

1+ parts

-

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-

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7,522

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-

-

VNN

France . 602 parts In-Stock

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-

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-

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-

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602

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 7,421 parts In-Stock

1+ parts

$9.440

100+ parts

$9.204

1k+ parts

$9.157

10k+ parts

-

7,421

$9.440

$9.204

$9.157

-

Ampacity Inc.

Singapore . 7,057 parts In-Stock

1+ parts

$9.440

100+ parts

-

1k+ parts

-

10k+ parts

-

7,057

$9.440

-

-

-

Corphita

USA . 3,348 parts In-Stock

1+ parts

$9.998

100+ parts

-

1k+ parts

-

10k+ parts

-

3,348

$9.998

-

-

-

Continental Prestige Electronics

USA . 5,287 parts In-Stock

1+ parts

$13.090

100+ parts

-

1k+ parts

-

10k+ parts

$12.828

5,287

$13.090

-

-

$12.828

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$13.090

100+ parts

-

1k+ parts

$12.435

10k+ parts

$12.173

1,000

$13.090

-

$12.435

$12.173

Parana Technologies

USA . 929 parts In-Stock

1+ parts

$28.832

100+ parts

-

1k+ parts

$52.360

10k+ parts

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929

$28.832

-

$52.360

-

Microchip USA

USA . 1,353 parts In-Stock

1+ parts

$30.850

100+ parts

$30.410

1k+ parts

$30.190

10k+ parts

$29.970

1,353

$30.850

$30.410

$30.190

$29.970

ChromeModa Solutions

Germany . 5,282 parts In-Stock

1+ parts

$32.396

100+ parts

$26.565

1k+ parts

-

10k+ parts

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5,282

$32.396

$26.565

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-

IDEA Electronic Components Group

UK . 274 parts In-Stock

1+ parts

$32.396

100+ parts

$30.776

1k+ parts

$29.156

10k+ parts

-

274

$32.396

$30.776

$29.156

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Corohmni

South Africa . 777 parts In-Stock

1+ parts

$40.512

100+ parts

-

1k+ parts

-

10k+ parts

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777

$40.512

-

-

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Argo Parts USA

USA . 1,030 parts In-Stock

1+ parts

-

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1,030

-

-

-

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A-Z Elektronik GmbH

Germany . 882 parts In-Stock

1+ parts

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882

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-

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DigiPath Technology Company

USA . 302 parts In-Stock

1+ parts

-

100+ parts

$29.208

1k+ parts

-

10k+ parts

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302

-

$29.208

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-

Overview

Discover the power and reliability of the AM3354BZCZ30 by Texas Instruments, a top-quality microprocessor designed for a wide range of applications. With cutting-edge technology and innovative features, this product offers unparalleled performance and efficiency. Whether you're looking to boost the capabilities of your device or streamline your operations, the AM3354BZCZ30 is the perfect solution. Trust in Texas Instruments' expertise and experience to take your projects to the next level with this exceptional microprocessor. Elevate your performance, enhance your results, and unlock endless possibilities with the AM3354BZCZ30.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package material provides durability and protection for the microprocessor, ensuring a longer lifespan.

Integrated Cache: YES

Having integrated cache improves the performance of the microprocessor by reducing data access time, resulting in faster processing speeds.

Maximum Supply Voltage: 1.144 V

Operating within a maximum supply voltage of 1.144 V ensures efficient power consumption and extends the battery life of devices using this microprocessor.

Address Bus Width: 28

A wider address bus width of 28 allows for a larger memory address space, accommodating more data and improving overall processing capabilities.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature of 90°C, this microprocessor can handle demanding tasks without overheating, ensuring reliable performance under stress.

Peripheral IC Type: MICROPROCESSOR, RISC

Using a RISC (Reduced Instruction Set Computing) architecture enhances the efficiency of the microprocessor by simplifying instructions, leading to faster and more streamlined processing.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making this microprocessor energy efficient and capable of handling complex tasks effectively.

Technical Specifications

Microprocessors AM3354BZCZ30 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

300 rpm

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.144 V

Minimum Supply Voltage:

1.056 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3354BZCZ30 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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