Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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IBM25PPC750FX-GB0133T by Ibm Microelectronics is a 32-bit RISC microprocessor with integrated cache and 64-bit external data bus. Operating at a max clock frequency of 200 MHz, it features low power mode and boundary scan for efficient performance in various applications requiring high-speed processing.
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Provides excellent thermal conductivity and durability, ensuring efficient heat dissipation and long-term reliability.
Having integrated cache helps in improving the overall performance of the microprocessor by reducing memory access time.
Ease of installation and compact design for space-saving in electronic devices.
Operates efficiently within specified voltage range for stable and reliable performance.
Enhances the data processing capability and memory addressing capacity of the microprocessor.
Optimal design for efficient utilization of space within electronic devices.
Suitable for handling 32-bit data processing tasks efficiently.
Provides flexibility in power supply options for different performance requirements and energy efficiency.
Sufficient terminals for connectivity and data transfer within the microprocessor and with external components.
Enables secure physical connection and efficient heat dissipation for optimal performance.
Allows for operation at lower voltage levels for power efficiency and reduced heat generation.
Facilitates easy integration into electronic circuits and ensures secure connections.
Low profile design suitable for compact electronic devices without compromising performance.
Compact dimensions for space-saving installation in various electronic applications.
Allows for efficient testing and debugging of the microprocessor during development and production phases.
Increased data bus width for faster data transfer rates and improved system performance.
Capable of high-speed processing for demanding computational tasks and applications.
Symmetrical design for uniform heat distribution and effective thermal management.
RISC architecture offers efficient and streamlined instruction execution for better performance.
CMOS technology provides low power consumption and high noise immunity for reliable operation.
Ball terminals ensure reliable and secure connections for stable performance in electronic circuits.
Optimal voltage level for consistent and efficient operation of the microprocessor.
Close terminal pitch for compact layout and efficient signal transmission.
Supports floating-point arithmetic operations for handling complex mathematical computations.
Capable of fast processing speeds for quick execution of tasks and improved system responsiveness.
Enables power-saving mode for energy-efficient operation and extended battery life in mobile devices.
Microprocessors IBM25PPC750FX-GB0133T attributes and parameters. Explore more Microprocessors devices from Ibm Microelectronics
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IBM25PPC750FX-GB0133T Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
This site can’t be reached
LM358N
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Motorola
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Collector-Base Capacitance: 8 pF;
Dc Components
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Config: SINGLE; No. of Phases: 1; No. of Elements: 1;
BAV99
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Bytesonic Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Weitron Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb);
Continental Device India
2N7002
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Moisture Sensitivity Level (MSL): 1; Maximum Operating Temperature: 150 Cel;
Temic Semiconductors
Transpro Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; JESD-609 Code: e0; Terminal Finish: Tin/Lead (Sn/Pb); Nominal Breakdown Voltage: 21.1 V; Maximum Clamping Voltage: 29.2 V;
LL4148
Rectron
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99-7-F
Multicomp Pro
LAN8720A-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
Changzhou Galaxy Century Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Bkc Semiconductors
SPC TECHNOLOGY/ MULTICOMP
Itt Semiconductor
NC7WZ07P6X
Onsemi
The Onsemi NC7WZ07P6X is a logic gate with 2 functions, featuring a propagation delay of 4.8 ns at 1.8V supply voltage. With open-drain output characteristics, it operates in industrial temperatures from -40 to 85°C. Ideal for applications requiring fast signal processing and low power consumption in compact designs.
MPC860ENVR66D4
Freescale Semiconductor
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 32;
STM32MP151CAD3
STMicroelectronics
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
P1021NXE2FFB
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE;
MCF54453VP266
NXP Semiconductors
MICROPROCESSOR; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;
DM3730CBPA
Texas Instruments
DM3730CBPA by Texas Instruments is a 32-bit microprocessor with integrated cache and a max clock frequency of 54 MHz. It is commonly used in industrial applications due to its low power mode, wide temperature range (-40 to 105 °C), and high number of DMA channels (128).
AV8063801116903SR0T5
Intel
Intel AV8063801116903SR0T5 is a 64-bit microprocessor with integrated cache, CMOS technology, and speed of 3200 rpm. It features a grid array package style with 1023 terminals for surface mount applications. Ideal for high-performance computing and server applications.
STM32MP157CAC3T
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
MPC8270VVUPEA
The NXP Semiconductors MPC8270VVUPEA microprocessor features a 32-bit address bus width, 64-bit external data bus width, and max clock frequency of 100 MHz. Ideal for commercial applications requiring high-speed processing capabilities in a compact package with boundary scan support.
FS32V234CKN1VUBR
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER; JESD-609 Code: e2; Moisture Sensitivity Level (MSL): 3;
MCIMX6U6AVM08AC
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE;
ADSP-BF609BBCZ-5X
Analog Devices
Analog Devices' ADSP-BF609BBCZ-5X microprocessor features integrated cache, 16-bit external data bus width, and operates at a speed of 500 rpm. Ideal for industrial applications requiring low power mode and fixed-point format processing.
MCIMX6S1AVM08AB
MCIMX6S1AVM08AB by NXP Semiconductors is a 64-bit microprocessor with 32-bit external data bus width, operating at a max clock frequency of 24 MHz. Ideal for automotive applications, it features low power mode and integrated cache, with a temperature range from -40 to 125 °C.
STM32MP157FAD1
MICROPROCESSOR, RISC;
AM3356BZCZA80
AM3356BZCZA80 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 28-bit address bus width, and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz and is suitable for industrial applications requiring low power mode and boundary scan capabilities.
STM32MP135AAE3
STM32MP135AAE3 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 172032 RAM words. It features an address bus width of 26, external data bus width of 16, and operates at a max clock frequency of 48 MHz. Ideal for low power applications requiring high-speed processing capabilities.
STM32MP157AAC3
STM32MP157AAC3 by STMicroelectronics is a 32-bit microprocessor with 64MHz clock frequency, 1.25V max supply voltage, and 48 DMA channels. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power mode support.
MIMXRT1015CAF4B
The NXP Semiconductors MIMXRT1015CAF4B microprocessor features a 32-bit architecture with integrated cache and 131072 RAM words. It operates at speeds up to 24 MHz, suitable for industrial applications requiring low power consumption. With 32 DMA channels and 6 serial I/Os, it offers versatile connectivity options in a compact square package.
P4080NSE7PNC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 133.3 MHz;
SAM9X60D1GT-I/4FB
Microchip Technology
SAM9X60D1GT-I/4FB by Microchip is a microprocessor with 16 DMA channels, 50 MHz clock frequency, and 233 terminals. Ideal for industrial applications, it operates b/w -40 to 85 °C with low power mode and integrated cache for efficient processing. The package style is grid array with a rectangular shape and thin profile.
AM5706BCBDDEA
The Texas Instruments AM5706BCBDDEA microprocessor features a 32-bit external data bus, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at a max clock frequency of 38.4 MHz with low power mode support. The package style is grid array with 538 terminals in a square shape.
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IBM25PPC970MP7TR25AFT
Ibm Microelectronics
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 2.65 V;
IBM25PPC750FX-GR1033T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-CBGA-B292;
IBM25PPC750FX-GB0113T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Low Power Mode: YES;
IBM25PPC750FX-GB0132T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
IBM25PPC750FX-GB0512T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Width: 21.02 mm;
IBM25PPC750FX-GB0513T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.45 V;
IBM25PPC750FX-GB0522T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.4 V;
IBM25PPC750FX-GB0523T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;
IBM25PPC750FX-GB0532T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Integrated Cache: YES;
IBM25PPC750FX-GB0533T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Bit Size: 32;
IBM25PPC750FX-GB1012T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 200 MHz;
IBM25PPC750FX-GB1022T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Package Body Material: CERAMIC, METAL-SEALED COFIRED;
IBM25PPC750FX-GB1032T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
IBM25PPC750FX-GB1033T
IBM25PPC750FX-GB2512T
IBM25PPC750FX-GB2513T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
IBM25PPC750FX-GB2522T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Format: FLOATING POINT;
IBM25PPC750FX-GB2523T
IBM25PPC750FX-GB2532T
IBM25PPC750FX-GB2533T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.5 V;
Supply Digital Components
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