Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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IBM25PPC750FX-GB0133T by Ibm Microelectronics is a 32-bit RISC microprocessor with integrated cache and 64-bit external data bus. Operating at a max clock frequency of 200 MHz, it features low power mode and boundary scan for efficient performance in various applications requiring high-speed processing.
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Provides excellent thermal conductivity and durability, ensuring efficient heat dissipation and long-term reliability.
Having integrated cache helps in improving the overall performance of the microprocessor by reducing memory access time.
Ease of installation and compact design for space-saving in electronic devices.
Operates efficiently within specified voltage range for stable and reliable performance.
Enhances the data processing capability and memory addressing capacity of the microprocessor.
Optimal design for efficient utilization of space within electronic devices.
Suitable for handling 32-bit data processing tasks efficiently.
Provides flexibility in power supply options for different performance requirements and energy efficiency.
Sufficient terminals for connectivity and data transfer within the microprocessor and with external components.
Enables secure physical connection and efficient heat dissipation for optimal performance.
Allows for operation at lower voltage levels for power efficiency and reduced heat generation.
Facilitates easy integration into electronic circuits and ensures secure connections.
Low profile design suitable for compact electronic devices without compromising performance.
Compact dimensions for space-saving installation in various electronic applications.
Allows for efficient testing and debugging of the microprocessor during development and production phases.
Increased data bus width for faster data transfer rates and improved system performance.
Capable of high-speed processing for demanding computational tasks and applications.
Symmetrical design for uniform heat distribution and effective thermal management.
RISC architecture offers efficient and streamlined instruction execution for better performance.
CMOS technology provides low power consumption and high noise immunity for reliable operation.
Ball terminals ensure reliable and secure connections for stable performance in electronic circuits.
Optimal voltage level for consistent and efficient operation of the microprocessor.
Close terminal pitch for compact layout and efficient signal transmission.
Supports floating-point arithmetic operations for handling complex mathematical computations.
Capable of fast processing speeds for quick execution of tasks and improved system responsiveness.
Enables power-saving mode for energy-efficient operation and extended battery life in mobile devices.
Microprocessors IBM25PPC750FX-GB0133T attributes and parameters. Explore more Microprocessors devices from Ibm Microelectronics
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JESD-30 Code:
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IBM25PPC750FX-GB0133T Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
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2N2222A
STMicroelectronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
2N7002
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Moisture Sensitivity Level (MSL): 1; Maximum Operating Temperature: 150 Cel;
BAV99
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Rectron
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M24308/2-1F
Bel Fuse
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Mixed Contacts: NO;
M85049/85-08W02
TE Connectivity
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Material: ALUMINUM ALLOY;
SMBJ18CA
Weitron Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Fairchild Semiconductor
M39029/58-360
Carlisle Interconnect Technologies
GENERAL CONN ACCESSORY; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; Maximum Operating Temperature: 200 Cel; MIL-Connector Accessory: CONTACT; Terminal Type: CRIMP; MIL Conformity: YES;
EPCS4SI8N
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
LM317T
Sgs-ates Componenti Electronici S P A
Other Regulators; No. of Terminals: 3; JESD-609 Code: e0; Terminal Position: SINGLE; Adjustability: ADJUSTABLE; Maximum Load Regulation (%): 1.5 %;
Glenair
CONNECTOR ACCESSORY; Contact Gender: MALE; Material: COPPER ALLOY; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT; MIL Conformity: YES;
LL4148
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Semtech
Calogic
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): NOT SPECIFIED; Terminal Position: DUAL;
Plessey Semiconductors Discrete Components Div
SS14
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Sangdest Microelectronics (Nanjing)
FDN5618P
Onsemi
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
STM32MP135CAE3
STM32MP135CAE3 by STMicroelectronics is a 32-bit microprocessor with 172032 RAM words and 48 MHz clock frequency. It features 289 terminals, operates b/w -40 to 125 °C, and has low power mode for energy efficiency. Ideal for applications requiring high-speed processing in compact devices.
OSD3358-512M-IND
Octavo Systems
OSD3358-512M-IND by Octavo Systems is a microprocessor with 8-bit RAM and 28-bit address bus. It features a grid array package, operates in industrial temperature range (-40 to 85 °C), and has a supply voltage of 1.1V. Ideal for applications requiring high-speed processing in compact spaces.
P1010NXE5DFA
Freescale Semiconductor
MICROPROCESSOR, RISC; No. of Terminals: 425; Power Supplies (V): 1; Nominal Supply Voltage: 1 V; Maximum Time At Peak Reflow Temperature (s): 40; Bit Size: 32;
MPC8347ECZQAGDB
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 620; Package Code: BGA; Package Shape: SQUARE;
MPC8270CZUQLDA
NXP Semiconductors
The NXP Semiconductors MPC8270CZUQLDA microprocessor features a 32-bit address bus width, 64-bit external data bus width, and max clock frequency of 83.33 MHz. It is commonly used in applications requiring high-speed processing and integrated cache memory for improved performance.
STM32MP131CAE3
STM32MP131CAE3 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 8-bit on-chip data RAM. It operates at a max clock frequency of 48 MHz, suitable for low power applications in various industries like IoT, automotive, and consumer electronics. With a wide address bus width of 26 bits and external data bus width of 16 bits, it offers high performance in a compact square package shape.
MCIMX6X1AVK08AB
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Technology: CMOS; Terminal Finish: TIN SILVER COPPER;
MIMXRT1062DVJ6A
MICROCONTROLLER, RISC; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; JESD-609 Code: e2;
SAM9X60D5M-I/4FB
Microchip Technology
SAM9X60D5M-I/4FB by Microchip Technology is a microprocessor with 16 DMA channels, 50 MHz clock frequency, and 1.8V nominal voltage. Ideal for industrial applications requiring low power mode, it features a CMOS technology, 233 terminals in a grid array package style, and operates b/w -40 to 85 °C temperature range.
MCF54452CVP200
MICROPROCESSOR; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
MIMXRT533SFFOC
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
SAM9X60T-V/DWB
SAM9X60T-V/DWB by Microchip Technology is a 32-bit microprocessor with integrated cache and 32-bit external data bus width. It operates at a max clock frequency of 48 MHz, suitable for industrial applications requiring low power mode and high-speed processing. With 16 DMA channels, this RISC-based processor offers efficient data transfer capabilities in a compact square package shape.
MPC8343VRADDB
NXP Semiconductors' MPC8343VRADDB microprocessor features 32-bit address and external data bus width, with integrated cache. Operating at a max clock frequency of 66 MHz, it supports low power mode and has a max supply voltage of 1.26 V. Ideal for applications requiring high-speed processing in compact spaces like networking equipment and embedded systems.
P1011NXN2HFB
P1011NXN2HFB by NXP Semiconductors is a 32-bit RISC microprocessor with integrated cache, 16-bit address bus width, and 32-bit external data bus width. It is suitable for applications requiring high-speed processing and features like boundary scan, 4 DMA channels, and a max supply voltage of 1.05V.
P1010NXE5HFA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;
AM3352BZCZT60
Texas Instruments
AM3352BZCZT60 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for automotive applications requiring low power mode and boundary scan capability. With a temperature range from -40 to 125 °C, it offers high performance in compact square package style.
ATSAMA5D36A-CNR
The Microchip Technology ATSAMA5D36A-CNR microprocessor features 32-bit architecture, 131072 RAM words, and a max clock frequency of 48 MHz. Ideal for industrial applications requiring high-speed processing and low power consumption. With 39 DMA channels and 10 serial I/Os, it offers versatile connectivity options in a compact square package.
DRA829VMTGBALFR
DRA829VMTGBALFR by Texas Instruments is a 64-bit microprocessor with integrated cache and 32-bit external data bus width. It operates at a max clock frequency of 27 MHz, making it suitable for high-speed computing applications. With low power mode and boundary scan capabilities, this CMOS technology-based processor offers efficient performance in various industrial settings.
MCIMX537CVV8C
MCIMX537CVV8C by NXP Semiconductors is a microprocessor with 32-bit architecture, 26-bit address bus width, and integrated cache. Ideal for automotive applications, it features a max clock frequency of 27 MHz and low power mode support. With a package style of grid array and fine pitch, this processor offers compatibility with various bus interfaces like CAN, Ethernet, I2C, SPI, UART, and USB.
SPC5125YVN400
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
IBM25PPC970MP7TR25AFT
Ibm Microelectronics
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 2.65 V;
IBM25PPC750FX-GR1033T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-CBGA-B292;
IBM25PPC750FX-GB0113T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Low Power Mode: YES;
IBM25PPC750FX-GB0132T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
IBM25PPC750FX-GB0512T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Width: 21.02 mm;
IBM25PPC750FX-GB0513T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.45 V;
IBM25PPC750FX-GB0522T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.4 V;
IBM25PPC750FX-GB0523T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;
IBM25PPC750FX-GB0532T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Integrated Cache: YES;
IBM25PPC750FX-GB0533T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Bit Size: 32;
IBM25PPC750FX-GB1012T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 200 MHz;
IBM25PPC750FX-GB1022T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Package Body Material: CERAMIC, METAL-SEALED COFIRED;
IBM25PPC750FX-GB1032T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
IBM25PPC750FX-GB1033T
IBM25PPC750FX-GB2512T
IBM25PPC750FX-GB2513T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
IBM25PPC750FX-GB2522T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Format: FLOATING POINT;
IBM25PPC750FX-GB2523T
IBM25PPC750FX-GB2532T
IBM25PPC750FX-GB2533T
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.5 V;
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