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IBM25PPC750FX-GB1022T

Ibm Microelectronics

IBM25PPC750FX-GB1022T by Ibm Microelectronics

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 292; Package Code: BGA; Package Shape: SQUARE; Package Body Material: CERAMIC, METAL-SEALED COFIRED;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Technical Specifications

Microprocessors IBM25PPC750FX-GB1022T attributes and parameters. Explore more Microprocessors devices from Ibm Microelectronics

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-CBGA-B292

Length:

21.02 mm

Low Power Mode:

YES

No. of Terminals:

292

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

BGA

Package Equivalence Code:

BGA292,20X20,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

1.45,1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

3.087 mm

Speed:

733 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.45 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

21.02 mm

Peripheral IC Type:

Trade Compliance

IBM25PPC750FX-GB1022T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Ibm Microelectronics

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