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MPC8343VRADDB

NXP Semiconductors

MPC8343VRADDB by NXP Semiconductors

NXP Semiconductors' MPC8343VRADDB microprocessor features 32-bit address and external data bus width, with integrated cache. Operating at a max clock frequency of 66 MHz, it supports low power mode and has a max supply voltage of 1.26 V. Ideal for applications requiring high-speed processing in compact spaces like networking equipment and embedded systems.

Median Price

$58.000

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

MPC8343VRADDB by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 20 parts In-Stock

1+ parts

$41.780

100+ parts

$40.940

1k+ parts

$40.110

10k+ parts

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20

$41.780

$40.940

$40.110

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Verical

USA . 936 parts In-Stock

1+ parts

-

100+ parts

$74.221

1k+ parts

$73.405

10k+ parts

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936

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$74.221

$73.405

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EBV Elektronik

Germany . 36 parts In-Stock

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36

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Distributors (In-Stock)

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Vyrian

USA . 4,415 parts In-Stock

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4,415

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Digiode

USA . 1,565 parts In-Stock

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1,565

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Anansix

USA . 693 parts In-Stock

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693

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Nova Conductors

Japan . 550 parts In-Stock

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550

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Electronics Depot

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 461 parts In-Stock

1+ parts

$6.000

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461

$6.000

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AZTECH Wire

Italy . 616 parts In-Stock

1+ parts

$7.279

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616

$7.279

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One Stop Electronics

USA . 1,520 parts In-Stock

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$11.000

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1,520

$11.000

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Semicontronic

India . 1,165 parts In-Stock

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$16.000

100+ parts

$15.600

1k+ parts

$15.520

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1,165

$16.000

$15.600

$15.520

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Vigor

Singapore . 246 parts In-Stock

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$50.530

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246

$50.530

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Corohmni

South Africa . 509 parts In-Stock

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$65.310

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509

$65.310

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Aztec Data Supply Inc.

USA . 4,789 parts In-Stock

1+ parts

$82.551

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4,789

$82.551

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Microchip USA

USA . 2,072 parts In-Stock

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$174.231

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2,072

$174.231

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A-Z Elektronik GmbH

Germany . 7,022 parts In-Stock

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7,022

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UNI Independent Distributors

Spain . 4,723 parts In-Stock

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4,723

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Continental Prestige Electronics

USA . 2,596 parts In-Stock

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2,596

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Argo Parts USA

USA . 1,466 parts In-Stock

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1,466

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Corphita

USA . 536 parts In-Stock

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536

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Aranea Global

USA . 500 parts In-Stock

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500

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Perfect Parts

USA . 40 parts In-Stock

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40

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Overview

Discover the cutting-edge performance and reliability of the MPC8343VRADDB microprocessor by NXP Semiconductors. With a focus on quality and innovation, NXP Semiconductors delivers top-of-the-line technology for a wide range of applications. This powerful microprocessor offers unparalleled value with its integrated cache and low power mode, making it ideal for high-speed computing tasks. Unlock your potential with the MPC8343VRADDB and experience the seamless efficiency and advanced capabilities that NXP Semiconductors is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microprocessor, making it suitable for various applications.

Integrated Cache: YES

Integrated cache improves the speed and performance of the microprocessor by reducing memory access times.

Maximum Supply Voltage: 1.26 V

Efficient power management with a relatively low maximum supply voltage.

Address Bus Width: 32

Wide address bus width allows for efficient communication and processing of data.

Bit Size: 32

32-bit architecture enables handling of large data sets and complex calculations.

Power Supplies (V): 1.2, 2.5, 3.3

Multiple power supply options provide flexibility in different use cases.

Package Style (Meter): GRID ARRAY

Grid array package style offers enhanced reliability and thermal performance.

Maximum Operating Temperature: 105 °C

Ability to operate at high temperatures ensures stability and performance in demanding conditions.

Minimum Operating Temperature: 0 °C

Wide temperature range supports operation in various environments.

Peripheral IC Type: MICROPROCESSOR

Designed specifically for microprocessor applications, ensuring optimal performance.

Technology: CMOS

CMOS technology provides low power consumption and high speed operation.

Technical Specifications

Microprocessors MPC8343VRADDB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 2.5V AND 3.3V SUPPLY

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B620

JESD-609 Code:

e2

Length:

29 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

620

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA620,28X28,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,2.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.46 mm

Speed:

266 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

29 mm

Peripheral IC Type:

Trade Compliance

MPC8343VRADDB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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