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MPC8270VRMIBA

NXP Semiconductors

MPC8270VRMIBA by NXP Semiconductors

NXP Semiconductors' MPC8270VRMIBA microprocessor features 32-bit address and external data bus width, with a max clock frequency of 266 MHz. Ideal for commercial applications, it has integrated cache memory and operates at temperatures ranging from 0 to 70 °C.

Median Price

$86.750

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

MPC8270VRMIBA by NXP Semiconductors
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 30 parts In-Stock

1+ parts

$85.060

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30

$85.060

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Verical

USA . 30 parts In-Stock

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$85.060

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30

$85.060

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Chip1Stop

Japan . 30 parts In-Stock

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$88.440

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30

$88.440

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DigiKey

USA . 30 parts In-Stock

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$133.960

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$133.960

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Flip Electronics (Authorized)

USA . 713 parts In-Stock

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713

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Distributors (In-Stock)

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Digiode

USA . 2,365 parts In-Stock

1+ parts

$84.018

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$84.018

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Nova Conductors

Japan . 700 parts In-Stock

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$118.518

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700

$118.518

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Anansix

USA . 2,351 parts In-Stock

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2,351

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Vyrian

USA . 2,217 parts In-Stock

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Flip Electronics

USA . 681 parts In-Stock

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681

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Chip Stock

USA . 131 parts In-Stock

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Cyclops Electronics Ltd

UK . 5 parts In-Stock

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5

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NexGen Digital

USA . 1 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 557 parts In-Stock

1+ parts

$19.846

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557

$19.846

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Ampacity Inc.

Singapore . 166 parts In-Stock

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$75.170

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166

$75.170

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Semicontronic

India . 134 parts In-Stock

1+ parts

$75.170

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$73.291

1k+ parts

$72.915

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134

$75.170

$73.291

$72.915

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Corphita

USA . 3,815 parts In-Stock

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$79.596

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3,815

$79.596

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Aranea Global

USA . 2,000 parts In-Stock

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$116.147

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$111.501

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$116.147

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$111.501

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Continental Prestige Electronics

USA . 1,408 parts In-Stock

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$118.518

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$116.147

1,408

$118.518

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$116.147

Corohmni

South Africa . 20 parts In-Stock

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$125.535

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20

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Vigor

Singapore . 298 parts In-Stock

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$145.970

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Microchip USA

USA . 2,042 parts In-Stock

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$207.360

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Lixinc

USA . 18,940 parts In-Stock

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iodParts Technologies Inc.

India . 5,800 parts In-Stock

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Perfect Parts

USA . 5,600 parts In-Stock

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UNI Independent Distributors

Spain . 4,011 parts In-Stock

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Argo Parts USA

USA . 3,298 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Futuretech Components

Singapore . 680 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Authorized Procurement Solutions

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Speed Components Ltd (Excess)

Israel . 10 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the MPC8270VRMIBA microprocessor by NXP Semiconductors. This high-quality product offers unparalleled performance and reliability, making it ideal for a wide range of applications. From seamless multitasking to lightning-fast data processing, this microprocessor delivers exceptional value and efficiency to customers. Trust in NXP Semiconductors' expertise and innovation to take your projects to the next level with the MPC8270VRMIBA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the microprocessor lightweight and durable, making it easier to handle and less prone to damage during installation or transportation.

Integrated Cache: YES

Having an integrated cache improves the processing speed and efficiency of the microprocessor, which results in faster overall performance when handling various tasks.

Bit Size: 32

A 32-bit architecture allows the microprocessor to handle larger chunks of data at once, enhancing its processing capabilities and enabling it to run more advanced software applications smoothly.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this microprocessor can reliably function in a wide range of operating conditions without overheating, ensuring consistent performance.

Technology: CMOS

CMOS technology offers lower power consumption and improved performance compared to other technologies, making the microprocessor energy-efficient and suitable for battery-powered devices.

Technical Specifications

Microprocessors MPC8270VRMIBA attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

266 MHz

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B516

JESD-609 Code:

e2

Length:

27 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

516

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA516,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.55 mm

Speed:

66.67 rpm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.45 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

27 mm

Peripheral IC Type:

Trade Compliance

MPC8270VRMIBA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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