Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The NXP Semiconductors MPC8270CZQMIBA is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 266 MHz. It features an external data bus width of 64 bits and is suitable for applications requiring high-speed processing such as networking equipment and industrial automation systems.
Median Price
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Plastic/epoxy package material is durable and lightweight, making the product easy to handle and less prone to damage during transportation or installation.
Having integrated cache allows for faster access to frequently used data, improving overall performance and efficiency of the microprocessor.
Surface mount technology enables easy and efficient soldering of the microprocessor onto a PCB, saving space and simplifying the manufacturing process.
The maximum supply voltage of 1.6V allows for efficient power management and reduced energy consumption, making the microprocessor suitable for low-power devices.
Having a wide address bus width of 32 allows for efficient memory address handling, enabling the microprocessor to access a larger memory space and process data more effectively.
The square package shape helps in optimizing space on the PCB, allowing for a more compact and efficient design of the electronic device.
With a bit size of 32, the microprocessor can handle 32 bits of data at a time, offering enhanced processing power and improved performance for a wide range of applications.
Supporting multiple power supply voltages (1.5V and 3.3V) allows for greater flexibility in designing electronic systems that require varying power levels for different components.
Having a high number of terminals (516) provides ample connectivity options for interfacing with other components, peripherals, and external devices, enhancing the versatility of the microprocessor.
The grid array package style offers improved thermal performance and reliable electrical connections, making it a suitable choice for high-performance applications that require efficient heat dissipation and signal integrity.
The minimum supply voltage of 1.45V ensures stable operation of the microprocessor even under low power conditions, increasing the reliability and robustness of the electronic system.
The tin lead silver terminal finish provides excellent solderability and long-term reliability, ensuring secure connections between the microprocessor and the PCB for consistent performance over time.
Having the terminals positioned at the bottom facilitates easy PCB assembly and soldering, allowing for efficient integration of the microprocessor into the electronic system.
The low maximum seated height of 2.55mm enables a slimmer and more compact design of the electronic device, ideal for space-constrained applications.
With a width of 27mm, the microprocessor can fit into various electronic devices without taking up too much space, offering greater flexibility in product design.
Boundary scan capability allows for efficient testing and debugging of the microprocessor during the manufacturing process, ensuring higher product quality and reliability.
A wide external data bus width of 64 enables faster data transfer between the microprocessor and external devices, improving overall system performance and efficiency.
Operating at a maximum clock frequency of 266MHz, the microprocessor can deliver high-speed processing capabilities, making it suitable for demanding applications that require quick data processing.
The maximum time of 30 seconds at peak reflow temperature ensures reliable solder connections and prevents damage to the microprocessor during the assembly process, contributing to the longevity of the electronic device.
With a peak reflow temperature of 245°C, the microprocessor can withstand high-temperature soldering processes, ensuring robust and secure solder joints for long-term reliability.
The length of 27mm allows for a compact and space-efficient design of the electronic device, making it suitable for small form-factor applications where size and weight are critical factors.
Being a microprocessor with RISC architecture, the product offers efficient processing of instructions, reduced power consumption, and faster execution of tasks, making it well-suited for embedded systems and portable devices.
Utilizing CMOS technology allows for low power consumption, high noise immunity, and reliable operation over a wide range of operating conditions, making the microprocessor energy-efficient and durable.
The ball terminal form simplifies the soldering process and enhances the electrical connections between the microprocessor and the PCB, ensuring secure and reliable operation of the electronic system.
The nominal supply voltage of 1.5V provides a stable power source for the microprocessor, ensuring consistent performance and reliable operation of the electronic device.
With a terminal pitch of 1mm, the microprocessor offers precise and secure connections with the PCB, reducing the risk of signal interference or electrical faults, and improving overall system reliability.
Supporting floating-point operations, the microprocessor can handle complex calculations and mathematical tasks with high precision and efficiency, making it suitable for scientific and computational applications.
Having a moisture sensitivity level of 3 indicates that the microprocessor possesses moderate moisture resistance, ensuring reliable performance in varied environmental conditions and during handling and storage.
Operating at a speed of 66.67rpm, the microprocessor can execute instructions and process data at a rapid pace, enabling quick response times and efficient performance in demanding applications.
Microprocessors MPC8270CZQMIBA attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Address Bus Width:
Bit Size:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Speed:
Sub-Category:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
MPC8270CZQMIBA Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
LM358MX
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1N4148
Itt Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Lite-on Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Qualification: Not Qualified; Additional Features: LOW THRESHOLD; Minimum DS Breakdown Voltage: 60 V;
Kec
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Non Repetitive Peak Forward Current: 2 A; Config: SINGLE; Maximum Operating Temperature: 200 Cel;
2N2222A
NXP Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Operating Temperature: 150 Cel;
ULN2803A
Rochester Electronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Additional Features: LOGIC LEVEL COMPATIBLE; Qualification: Not Qualified;
LM358N
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Daco Semiconductor
M24308/2-1F
Bel Fuse
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Mixed Contacts: NO;
LL4148
Hy Electronic
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138BK,215
NXP Semiconductors' BSS138BK,215 is a N-CHANNEL FET with 0.36A max drain current and 0.42W power dissipation. Ideal for applications requiring single configuration and surface mount technology, such as enhancement mode operation in temperatures up to 150°C.
Central Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Transistor Application: SWITCHING; Transistor Element Material: SILICON;
1N4148WS
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358M
NE555D
Philips Semiconductors
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
M39029/56-351
TE Connectivity
TE Connectivity's M39029/56-351 is a CRIMP contact type backshell accessory with rated voltage of 115V. It operates b/w -65 to 175 °C, suitable for MIL-C-39029/56 connectors with wire gauge ranging from 28 to 22 AWG. Ideal for military applications requiring female contacts and copper alloy material.
1554216002
Molex
WIRE AND CABLE;
SS14
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Motorola
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified; Minimum Operating Temperature: -55 Cel;
BAV99
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
MCIMX6S6AVM08AB
Freescale Semiconductor
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE;
MPC8270CZQMIBA
AM3352BZCZT60
Texas Instruments
AM3352BZCZT60 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for automotive applications requiring low power mode and boundary scan capability. With a temperature range from -40 to 125 °C, it offers high performance in compact square package style.
MCF54418CMJ250
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
MPC8358ECZQAGDGA
NXP Semiconductors' MPC8358ECZQAGDGA microprocessor features 32-bit address and external data bus width, with a max clock frequency of 66.67 MHz. Ideal for applications requiring low power mode, it comes in a grid array package style with 668 terminals for easy surface mount installation.
STM32MP135CAE3
STMicroelectronics
STM32MP135CAE3 by STMicroelectronics is a 32-bit microprocessor with 172032 RAM words and 48 MHz clock frequency. It features 289 terminals, operates b/w -40 to 125 °C, and has low power mode for energy efficiency. Ideal for applications requiring high-speed processing in compact devices.
MCF5275LCVM166
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: BGA; Package Shape: SQUARE;
TMS320DM8147SCYE1
TMS320DM8147SCYE1 by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 30 MHz, suitable for low power mode applications. With 72 DMA channels, it is ideal for high-speed processing in various electronic devices.
LS1012ASE7KKB
LS1012ASE7KKB by NXP Semiconductors is a 64-bit microprocessor with integrated cache, operating at a max clock frequency of 25 MHz. It features an address bus width of 16 and external data bus width of 16, suitable for low power mode applications in various industries. With a compact square package style and boundary scan capability, it offers high performance in a small form factor.
FS32V234CKN1VUBR
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER; JESD-609 Code: e2; Moisture Sensitivity Level (MSL): 3;
MPC880ZP133
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Width: 25 mm;
FA80386EXTC33
Intel
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
P1021NSE2HFB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
STM32MP153CAB3
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
GCIXP1200GA
Intel GCIXP1200GA microprocessor features 32-bit address and data bus width, with a max clock frequency of 166 MHz. Suitable for commercial-grade applications, it operates b/w 0 to 70°C temperature range. Integrated cache and RISC technology enhance processing speed for various computing tasks.
ATSAMA5D26C-CU
Microchip Technology
Microchip's ATSAMA5D26C-CU is a 32-bit microprocessor with 131072 RAM words, 24 MHz clock frequency, and 1.25 V nominal voltage. Ideal for industrial applications, it features a RISC architecture, low power mode, and boundary scan capability.
AM3352BZCZD80
AM3352BZCZD80 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 16-bit external data bus width, and max clock frequency of 26 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.
MPC860ENVR66D4
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 32;
MIMXRT1052DVL6A
The NXP Semiconductors MIMXRT1052DVL6A microprocessor features 32-bit architecture, 24 MHz clock frequency, and 524288 RAM words. Ideal for applications requiring low power consumption, such as IoT devices and embedded systems. With integrated cache and boundary scan capabilities, it offers efficient processing for various projects.
STM32MP157CAD3
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
MPC8270CVRMIBA
The NXP Semiconductors MPC8270CVRMIBA is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 266 MHz. It features an external data bus width of 64 bits and is suitable for applications requiring high-speed processing in devices such as networking equipment and industrial control systems.
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;
MPC8308CVMAGDA
NXP Semiconductors' MPC8308CVMAGDA is a 32-bit microprocessor with integrated cache, operating at speeds up to 400 rpm. It features low power mode and boundary scan support, suitable for industrial applications. With a package style of grid array and fine pitch, it offers 473 terminals in a compact square shape.
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 473; Package Code: LFBGA; Package Shape: SQUARE;
MPC8270CVRMIBA,557
NXP Semiconductors' MPC8270CVRMIBA,557 microprocessor features 32-bit address bus width, 64-bit external data bus width, and a max clock frequency of 266 MHz. Ideal for applications requiring high-speed processing such as networking equipment and industrial automation systems.
MPC8308VMAGDA
The NXP Semiconductors MPC8308VMAGDA microprocessor features integrated cache, operates at a max clock frequency of 66.67 MHz, and supports low power mode. Ideal for applications requiring high-speed processing in a compact form factor with a square package shape and 473 terminals.
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 473; Package Code: LFBGA; Package Shape: SQUARE; Data EEPROM Size: 0;
MPC8314VRAGDA
MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 620; Package Code: HBGA; Package Shape: SQUARE;
The NXP Semiconductors MPC8314VRAGDA is a 32-bit microprocessor with integrated cache, operating at a max frequency of 66.67 MHz. It features low power mode and boundary scan capabilities, making it suitable for applications requiring high-speed processing in compact devices. With a package style of grid array and heat sink/slug, this processor is ideal for use in various embedded systems where space efficiency is crucial.
MPC8569EVTAUNLB
MPC8569EVTAUNLB by Freescale: 32-bit microprocessor with 64-bit data bus, 16-bit address bus, and integrated cache. Ideal for RISC applications requiring low power mode, operating at max clock frequency of 133 MHz. Features grid array package style suitable for surface mount assembly.
MPC8321ECVRADDCA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 0;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B516;
MPC8270VRMIBA
MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;
MPC8321VRADDCA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; Bit Size: 32;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
MPC8280CZUQLDA
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE;
MPC852TVR100A
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA256,16X16,50;
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