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MPC8270CZQMIBA

NXP Semiconductors

MPC8270CZQMIBA by NXP Semiconductors

The NXP Semiconductors MPC8270CZQMIBA is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 266 MHz. It features an external data bus width of 64 bits and is suitable for applications requiring high-speed processing such as networking equipment and industrial automation systems.

Median Price

$146.420

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

MPC8270CZQMIBA by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 12 parts In-Stock

1+ parts

$127.940

100+ parts

$111.770

1k+ parts

-

10k+ parts

-

12

$127.940

$111.770

-

-

DigiKey

USA . 43 parts In-Stock

1+ parts

$146.420

100+ parts

$117.792

1k+ parts

-

10k+ parts

-

43

$146.420

$117.792

-

-

Mouser Electronics

USA . 33 parts In-Stock

1+ parts

$146.420

100+ parts

$112.870

1k+ parts

-

10k+ parts

-

33

$146.420

$112.870

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-

Chip1Stop

Japan . 80 parts In-Stock

1+ parts

$151.000

100+ parts

$115.000

1k+ parts

$103.000

10k+ parts

-

80

$151.000

$115.000

$103.000

-

Verical

USA . 80 parts In-Stock

1+ parts

$151.000

100+ parts

$115.000

1k+ parts

-

10k+ parts

-

80

$151.000

$115.000

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,000 parts In-Stock

1+ parts

$101.650

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$101.650

-

-

-

Nova Conductors

Japan . 65 parts In-Stock

1+ parts

$146.144

100+ parts

-

1k+ parts

-

10k+ parts

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65

$146.144

-

-

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Vyrian

USA . 3,031 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,031

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-

-

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Anansix

USA . 655 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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655

-

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Chip Stock

USA . 325 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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325

-

-

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Vectronix, Inc

USA . 27 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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27

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QIE Inc.

USA . 7 parts In-Stock

1+ parts

-

100+ parts

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7

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Flip Electronics

USA . 3 parts In-Stock

1+ parts

-

100+ parts

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3

-

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Q Components

USA . 1 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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1

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 310 parts In-Stock

1+ parts

$14.346

100+ parts

-

1k+ parts

-

10k+ parts

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310

$14.346

-

-

-

Aztec Data Supply Inc.

USA . 111 parts In-Stock

1+ parts

$20.220

100+ parts

-

1k+ parts

-

10k+ parts

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111

$20.220

-

-

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Vigor

Singapore . 300 parts In-Stock

1+ parts

$75.000

100+ parts

-

1k+ parts

-

10k+ parts

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300

$75.000

-

-

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Corphita

USA . 510 parts In-Stock

1+ parts

$96.300

100+ parts

-

1k+ parts

-

10k+ parts

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510

$96.300

-

-

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Ampacity Inc.

Singapore . 65 parts In-Stock

1+ parts

$96.900

100+ parts

-

1k+ parts

-

10k+ parts

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65

$96.900

-

-

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Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

$146.100

100+ parts

$138.795

1k+ parts

-

10k+ parts

$130.029

450

$146.100

$138.795

-

$130.029

Continental Prestige Electronics

USA . 3,484 parts In-Stock

1+ parts

$146.144

100+ parts

-

1k+ parts

-

10k+ parts

$143.221

3,484

$146.144

-

-

$143.221

Corohmni

South Africa . 277 parts In-Stock

1+ parts

$153.743

100+ parts

-

1k+ parts

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10k+ parts

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277

$153.743

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Semicontronic

India . 62 parts In-Stock

1+ parts

$210.900

100+ parts

$205.628

1k+ parts

$204.573

10k+ parts

-

62

$210.900

$205.628

$204.573

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Microchip USA

USA . 1,986 parts In-Stock

1+ parts

$217.770

100+ parts

-

1k+ parts

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10k+ parts

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1,986

$217.770

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Lixinc

USA . 13,679 parts In-Stock

1+ parts

-

100+ parts

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13,679

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Argo Parts USA

USA . 4,832 parts In-Stock

1+ parts

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4,832

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UNI Independent Distributors

Spain . 4,463 parts In-Stock

1+ parts

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4,463

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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2,000

-

-

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Glotronic Ltd.

UK . 1,800 parts In-Stock

1+ parts

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100+ parts

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1,800

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Perfect Parts

USA . 586 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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586

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Overview

Unleash the power of innovation with the MPC8270CZQMIBA by NXP Semiconductors. This cutting-edge microprocessor is designed to deliver exceptional performance and reliability, making it a top choice for a wide range of applications. From enhancing communication networks to powering industrial automation systems, this versatile component offers unmatched value and efficiency. Trust in NXP Semiconductors' reputation for quality and let the MPC8270CZQMIBA take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package material is durable and lightweight, making the product easy to handle and less prone to damage during transportation or installation.

Integrated Cache: YES

Having integrated cache allows for faster access to frequently used data, improving overall performance and efficiency of the microprocessor.

Surface Mount: YES

Surface mount technology enables easy and efficient soldering of the microprocessor onto a PCB, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.6 V

The maximum supply voltage of 1.6V allows for efficient power management and reduced energy consumption, making the microprocessor suitable for low-power devices.

Address Bus Width: 32

Having a wide address bus width of 32 allows for efficient memory address handling, enabling the microprocessor to access a larger memory space and process data more effectively.

Package Shape: SQUARE

The square package shape helps in optimizing space on the PCB, allowing for a more compact and efficient design of the electronic device.

Bit Size: 32

With a bit size of 32, the microprocessor can handle 32 bits of data at a time, offering enhanced processing power and improved performance for a wide range of applications.

Power Supplies (V): 1.5,3.3

Supporting multiple power supply voltages (1.5V and 3.3V) allows for greater flexibility in designing electronic systems that require varying power levels for different components.

No. of Terminals: 516

Having a high number of terminals (516) provides ample connectivity options for interfacing with other components, peripherals, and external devices, enhancing the versatility of the microprocessor.

Package Style (Meter): GRID ARRAY

The grid array package style offers improved thermal performance and reliable electrical connections, making it a suitable choice for high-performance applications that require efficient heat dissipation and signal integrity.

Minimum Supply Voltage: 1.45 V

The minimum supply voltage of 1.45V ensures stable operation of the microprocessor even under low power conditions, increasing the reliability and robustness of the electronic system.

Terminal Finish: TIN LEAD SILVER

The tin lead silver terminal finish provides excellent solderability and long-term reliability, ensuring secure connections between the microprocessor and the PCB for consistent performance over time.

Terminal Position: BOTTOM

Having the terminals positioned at the bottom facilitates easy PCB assembly and soldering, allowing for efficient integration of the microprocessor into the electronic system.

Maximum Seated Height: 2.55 mm

The low maximum seated height of 2.55mm enables a slimmer and more compact design of the electronic device, ideal for space-constrained applications.

Width: 27 mm

With a width of 27mm, the microprocessor can fit into various electronic devices without taking up too much space, offering greater flexibility in product design.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the microprocessor during the manufacturing process, ensuring higher product quality and reliability.

External Data Bus Width: 64

A wide external data bus width of 64 enables faster data transfer between the microprocessor and external devices, improving overall system performance and efficiency.

Maximum Clock Frequency: 266 MHz

Operating at a maximum clock frequency of 266MHz, the microprocessor can deliver high-speed processing capabilities, making it suitable for demanding applications that require quick data processing.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures reliable solder connections and prevents damage to the microprocessor during the assembly process, contributing to the longevity of the electronic device.

Peak Reflow Temperature °C: 245

With a peak reflow temperature of 245°C, the microprocessor can withstand high-temperature soldering processes, ensuring robust and secure solder joints for long-term reliability.

Length: 27 mm

The length of 27mm allows for a compact and space-efficient design of the electronic device, making it suitable for small form-factor applications where size and weight are critical factors.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a microprocessor with RISC architecture, the product offers efficient processing of instructions, reduced power consumption, and faster execution of tasks, making it well-suited for embedded systems and portable devices.

Technology: CMOS

Utilizing CMOS technology allows for low power consumption, high noise immunity, and reliable operation over a wide range of operating conditions, making the microprocessor energy-efficient and durable.

Terminal Form: BALL

The ball terminal form simplifies the soldering process and enhances the electrical connections between the microprocessor and the PCB, ensuring secure and reliable operation of the electronic system.

Nominal Supply Voltage: 1.5 V

The nominal supply voltage of 1.5V provides a stable power source for the microprocessor, ensuring consistent performance and reliable operation of the electronic device.

Terminal Pitch: 1 mm

With a terminal pitch of 1mm, the microprocessor offers precise and secure connections with the PCB, reducing the risk of signal interference or electrical faults, and improving overall system reliability.

Format: FLOATING POINT

Supporting floating-point operations, the microprocessor can handle complex calculations and mathematical tasks with high precision and efficiency, making it suitable for scientific and computational applications.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the microprocessor possesses moderate moisture resistance, ensuring reliable performance in varied environmental conditions and during handling and storage.

Speed: 66.67 rpm

Operating at a speed of 66.67rpm, the microprocessor can execute instructions and process data at a rapid pace, enabling quick response times and efficient performance in demanding applications.

Technical Specifications

Microprocessors MPC8270CZQMIBA attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

266 MHz

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B516

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

516

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA516,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.55 mm

Speed:

66.67 rpm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.45 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

27 mm

Peripheral IC Type:

Trade Compliance

MPC8270CZQMIBA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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