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MCIMX6S1AVM08AB

NXP Semiconductors

MCIMX6S1AVM08AB by NXP Semiconductors

MCIMX6S1AVM08AB by NXP Semiconductors is a 64-bit microprocessor with 32-bit external data bus width, operating at a max clock frequency of 24 MHz. Ideal for automotive applications, it features low power mode and integrated cache, with a temperature range from -40 to 125 °C.

Median Price

$41.970

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 101 parts In-Stock

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$41.970

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$33.070

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Flip Electronics (Authorized)

USA . 678 parts In-Stock

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Digiode

USA . 1,904 parts In-Stock

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$41.534

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$41.534

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Nova Conductors

Japan . 500 parts In-Stock

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$47.238

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Vyrian

USA . 2,712 parts In-Stock

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Anansix

USA . 367 parts In-Stock

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Flip Electronics

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Chip Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 474 parts In-Stock

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$10.909

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Ampacity Inc.

Singapore . 262 parts In-Stock

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$37.160

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Corphita

USA . 1,436 parts In-Stock

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$39.348

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Component Stockers USA

USA . 180 parts In-Stock

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$42.620

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$30.020

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Continental Prestige Electronics

USA . 3,851 parts In-Stock

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$47.238

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$46.293

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Netroflash

USA . 2,000 parts In-Stock

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Microchip USA

USA . 2,627 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,295 parts In-Stock

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UNI Independent Distributors

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Argo Parts USA

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Perfect Parts

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Kepictronics

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Overview

Unleash the power of innovation with the MCIMX6S1AVM08AB microprocessor from NXP Semiconductors. As a leader in cutting-edge technology, NXP delivers top-quality products that push boundaries and exceed expectations. Ideal for a wide range of applications, this microprocessor offers unparalleled value, seamless integration, and unmatched performance. Elevate your projects with the MCIMX6S1AVM08AB and experience the advantages of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the microprocessor from damage, making it a reliable choice.

Integrated Cache: YES

The integrated cache enhances the performance of the microprocessor by providing quick access to frequently used data, improving efficiency.

Surface Mount: YES

Being surface mountable allows for easy installation on a circuit board, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.5 V

With a high maximum supply voltage, this microprocessor can handle power fluctuations and operate reliably in various conditions.

Address Bus Width: 16

The wide address bus width allows for efficient data transfer and communication, enhancing the overall speed and performance of the microprocessor.

Package Shape: SQUARE

The square package shape makes this microprocessor easy to handle and install, ideal for compact electronic devices.

Bit Size: 64

A 64-bit size allows for handling large amounts of data and executing complex tasks, making this microprocessor suitable for demanding applications.

No. of Terminals: 624

The high number of terminals provides ample connectivity options, enabling the microprocessor to interface with multiple components effectively.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact design, making it suitable for use in space-constrained applications while ensuring reliable connectivity.

Minimum Supply Voltage: 1.275 V

With a low minimum supply voltage, this microprocessor can operate efficiently while conserving power, making it energy-efficient.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures that the microprocessor can function reliably even in harsh environmental conditions without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the microprocessor to withstand cold temperatures, making it suitable for use in a variety of environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and performance of the microprocessor.

Terminal Position: BOTTOM

With terminals positioned at the bottom, this microprocessor can be easily soldered onto a circuit board, simplifying the assembly process.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for a compact design, making this microprocessor suitable for slim electronic devices.

Width: 21 mm

A width of 21 mm offers a balance between compactness and ease of handling, making this microprocessor versatile for various applications.

Technical Specifications

Microprocessors MCIMX6S1AVM08AB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

Address Bus Width:

16

Bit Size:

64

Boundary Scan:

YES

Maximum Clock Frequency:

24 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Speed:

800 rpm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.275 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MCIMX6S1AVM08AB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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