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MCIMX537CVP8C2

NXP Semiconductors

MCIMX537CVP8C2 by NXP Semiconductors

MCIMX537CVP8C2 by NXP Semiconductors is a 32-bit microprocessor with 147456 RAM words, 27 MHz clock frequency, and 1.15 V max supply voltage. Ideal for automotive applications due to its RISC technology, floating-point format, and low power mode capabilities.

Median Price

$41.720

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 3,932 parts In-Stock

1+ parts

$35.310

100+ parts

-

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3,932

$35.310

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Arrow

USA . 3,932 parts In-Stock

1+ parts

$35.310

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-

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3,932

$35.310

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Chip1Stop

Japan . 380 parts In-Stock

1+ parts

$39.300

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-

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380

$39.300

-

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Mouser Electronics

USA . 95 parts In-Stock

1+ parts

$70.770

100+ parts

$51.290

1k+ parts

-

10k+ parts

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95

$70.770

$51.290

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-

DigiKey

USA . 24 parts In-Stock

1+ parts

$70.770

100+ parts

$52.588

1k+ parts

$51.286

10k+ parts

-

24

$70.770

$52.588

$51.286

-

Rochester

USA . 191 parts In-Stock

1+ parts

-

100+ parts

$44.140

1k+ parts

$39.490

10k+ parts

$37.170

191

-

$44.140

$39.490

$37.170

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 24 parts In-Stock

1+ parts

$49.714

100+ parts

-

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24

$49.714

-

-

-

Digiode

USA . 1,022 parts In-Stock

1+ parts

$53.865

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1,022

$53.865

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Vyrian

USA . 6,324 parts In-Stock

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6,324

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Chip Stock

USA . 1,025 parts In-Stock

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1,025

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Cyclops Electronics Ltd

UK . 420 parts In-Stock

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420

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NAC Semi

USA . 336 parts In-Stock

1+ parts

-

100+ parts

$59.360

1k+ parts

$55.400

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336

-

$59.360

$55.400

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Anansix

USA . 283 parts In-Stock

1+ parts

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283

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Flip Electronics

USA . 216 parts In-Stock

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216

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Sensible Micro Corp

USA . 14 parts In-Stock

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14

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 801 parts In-Stock

1+ parts

$19.033

100+ parts

-

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801

$19.033

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Modulus Dynamics

Lithuania . 550 parts In-Stock

1+ parts

$32.800

100+ parts

$32.800

1k+ parts

$32.800

10k+ parts

-

550

$32.800

$32.800

$32.800

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Ampacity Inc.

Singapore . 247 parts In-Stock

1+ parts

$35.390

100+ parts

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247

$35.390

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Semicontronic

India . 17 parts In-Stock

1+ parts

$35.390

100+ parts

$34.505

1k+ parts

$34.328

10k+ parts

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17

$35.390

$34.505

$34.328

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Aztec Data Supply Inc.

USA . 89 parts In-Stock

1+ parts

$37.980

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89

$37.980

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Corohmni

South Africa . 344 parts In-Stock

1+ parts

$40.477

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344

$40.477

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Continental Prestige Electronics

USA . 5,599 parts In-Stock

1+ parts

$46.664

100+ parts

-

1k+ parts

-

10k+ parts

$45.731

5,599

$46.664

-

-

$45.731

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$48.719

100+ parts

-

1k+ parts

$46.770

10k+ parts

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1,000

$48.719

-

$46.770

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Corphita

USA . 4,983 parts In-Stock

1+ parts

$51.030

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-

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4,983

$51.030

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$82.120

100+ parts

$78.014

1k+ parts

$78.014

10k+ parts

-

2,500

$82.120

$78.014

$78.014

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Microchip USA

USA . 2,760 parts In-Stock

1+ parts

$108.532

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2,760

$108.532

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Lixinc

USA . 12,215 parts In-Stock

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UNI Independent Distributors

Spain . 5,746 parts In-Stock

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Argo Parts USA

USA . 2,190 parts In-Stock

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2,190

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Robosynatics

Brazil . 717 parts In-Stock

1+ parts

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717

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Lucentia Tech

USA . 717 parts In-Stock

1+ parts

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100+ parts

$82.860

1k+ parts

$81.169

10k+ parts

$81.169

717

-

$82.860

$81.169

$81.169

Overview

Unleash the power of cutting-edge technology with the MCIMX537CVP8C2 by NXP Semiconductors. This top-of-the-line microprocessor offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. With a focus on quality and innovation, NXP Semiconductors has crafted a product that delivers exceptional value to customers. Whether you're looking to enhance your automotive system or boost the capabilities of your embedded device, the MCIMX537CVP8C2 is sure to exceed your expectations. Elevate your projects to new heights with this advanced microprocessor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes this microprocessor lightweight and cost-effective.

Integrated Cache: YES

With integrated cache, this microprocessor offers faster data access and improved system performance.

Surface Mount: YES

Being surface mount compatible makes this microprocessor easy to install and suitable for compact designs.

Maximum Supply Voltage: 1.15 V

The maximum supply voltage of 1.15 V ensures efficient power consumption and extends the lifespan of the microprocessor.

On Chip Data RAM Width: 8

The 8-bit on-chip data RAM width allows for efficient data processing and storage capabilities.

Address Bus Width: 26

With 26 bits of address bus width, this microprocessor can access a large memory space for enhanced multitasking capabilities.

Package Shape: SQUARE

The square package shape offers a compact design that is easy to integrate into various electronic devices.

Bit Size: 32

The 32-bit architecture of this microprocessor allows for high-speed processing and compatibility with modern software applications.

No. of Terminals: 529

The large number of terminals provides ample connectivity options for peripherals, enhancing the versatility of the microprocessor.

Package Style: GRID ARRAY, FINE PITCH

The grid array, fine pitch package style offers a reliable connection and improved signal integrity for optimal performance.

Minimum Supply Voltage: 1.05 V

The minimum supply voltage of 1.05 V ensures stable operation and prevents overvoltage damage to the microprocessor.

Technical Specifications

Microprocessors MCIMX537CVP8C2 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B529

Length:

19 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of Serial I/Os:

52

No. of Terminals:

529

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

147456

Maximum Seated Height:

1.85 mm

Speed:

800 rpm

Maximum Supply Current:

800 mA

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Peripheral IC Type:

Trade Compliance

MCIMX537CVP8C2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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