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MCIMX537CVV8CR2

NXP Semiconductors

MCIMX537CVV8CR2 by NXP Semiconductors

MCIMX537CVV8CR2 by NXP Semiconductors is a 32-bit microprocessor with integrated cache and 16-bit address bus width. Ideal for automotive applications, it operates at speeds up to 27 MHz with low power mode support. The package style is grid array, featuring a max supply voltage of 1.15 V and operating temperature range from -40 to 125 °C.

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1k+

MCIMX537CVV8CR2 by NXP Semiconductors
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Vyrian

USA . 969 parts In-Stock

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Component Sense

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Anansix

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Digiode

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Nova Conductors

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Semicontronic

India . 574 parts In-Stock

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$5.850

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$5.820

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Ampacity Inc.

Singapore . 533 parts In-Stock

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AZTECH Wire

Italy . 568 parts In-Stock

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One Stop Electronics

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Aztec Data Supply Inc.

USA . 955 parts In-Stock

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Advanced Electronics

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Corphita

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Argo Parts USA

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Overview

Discover the superior performance and reliability of the MCIMX537CVV8CR2 microprocessor by NXP Semiconductors. Built with cutting-edge technology, this product offers exceptional value and benefits for a wide range of applications. From automotive to industrial, this microprocessor delivers high-speed processing capabilities and low power consumption, ensuring optimal efficiency for your projects. Trust NXP Semiconductors to provide top-quality solutions that meet your demands and exceed your expectations. Elevate your designs with the MCIMX537CVV8CR2 and experience unparalleled results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microprocessor, making it suitable for various environments and applications.

Integrated Cache: YES

Having integrated cache helps in improving the performance of the microprocessor by reducing memory latency and increasing data access speeds.

Maximum Supply Voltage: 1.15 V

The maximum supply voltage of 1.15 V ensures efficient power consumption and reduces the risk of overheating.

Address Bus Width: 16

With a wider address bus width of 16, the microprocessor can handle larger amounts of memory, enabling it to process more data at a faster rate.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computing) microprocessor, it is designed for high efficiency and performance, making it an ideal choice for demanding applications.

Technology: CMOS

CMOS (Complementary Metal-Oxide-Semiconductor) technology offers low power consumption, high speed, and compatibility with a wide range of devices, making the microprocessor energy-efficient and versatile.

Technical Specifications

Microprocessors MCIMX537CVV8CR2 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e2

Length:

19 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

529

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.3

Qualification:

Not Qualified

Maximum Seated Height:

1.9 mm

Speed:

800 rpm

Sub-Category:

Graphics Processors

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Peripheral IC Type:

Trade Compliance

MCIMX537CVV8CR2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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