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MCIMX6QP6AVT8AB

NXP Semiconductors

MCIMX6QP6AVT8AB by NXP Semiconductors

MCIMX6QP6AVT8AB by NXP Semiconductors is a MICROPROCESSOR with CMOS technology. It operates b/w -40 to 125 °C and has a max supply voltage of 1.5 V. Ideal for automotive applications due to its fine pitch GRID ARRAY package style.

Median Price

$122.226

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

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Mouser Electronics

USA . 60 parts In-Stock

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$118.760

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Verical

USA . 9,960 parts In-Stock

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Digiode

USA . 4,227 parts In-Stock

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Vyrian

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Anansix

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TME

Poland . 120 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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AZTECH Wire

Italy . 337 parts In-Stock

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$19.674

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,124 parts In-Stock

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Corohmni

South Africa . 267 parts In-Stock

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Semicontronic

India . 64 parts In-Stock

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$86.765

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$86.320

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Ampacity Inc.

Singapore . 88 parts In-Stock

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Corphita

USA . 2,421 parts In-Stock

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Microchip USA

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Lixinc

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Continental Prestige Electronics

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Argo Parts USA

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UNI Independent Distributors

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Bastille Electronics

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Overview

Experience unparalleled performance and reliability with the MCIMX6QP6AVT8AB microprocessor by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers cutting-edge technology and innovation. This microprocessor is perfect for automotive applications, offering efficient processing power and temperature resilience for optimal performance in any environment. Trust NXP Semiconductors to provide you with top-quality products that exceed your expectations. Experience the difference today with the MCIMX6QP6AVT8AB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to heat, making the microprocessor suitable for various operating conditions.

Surface Mount: YES

Easy installation and space-saving design for efficient placement on circuit boards.

Maximum Supply Voltage: 1.5 V

Allows for high performance with a safe upper limit for voltage, protecting the microprocessor from damage.

Package Shape: SQUARE

Compact shape that optimizes space utilization in electronic devices.

No. of Terminals: 624

High number of terminals for versatile connectivity options and integration with other electronic components.

Minimum Supply Voltage: 1.225 V

Provides flexibility in operation with a low minimum voltage requirement.

Maximum Operating Temperature: 125 °C

Ensures stable performance even in high-temperature environments.

Peripheral IC Type: MICROPROCESSOR, RISC

Utilizes Reduced Instruction Set Computing (RISC) architecture for efficient processing and improved performance.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology for low power consumption and high reliability.

Technical Specifications

Microprocessors MCIMX6QP6AVT8AB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.16 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.225 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MCIMX6QP6AVT8AB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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