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T2080NXN8P1B

NXP Semiconductors

T2080NXN8P1B by NXP Semiconductors

T2080NXN8P1B by NXP Semiconductors is a 64-bit microprocessor with integrated cache. It is surface mountable and has 896 terminals in a grid array package style. This industrial-grade processor operates at temperatures ranging from -40 to 105°C and is suitable for various applications requiring high-speed processing.

Median Price

$367.765

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 119 parts In-Stock

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$326.900

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$307.290

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$287.670

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$287.670

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DigiKey

USA . 119 parts In-Stock

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$408.630

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Flip Electronics (Authorized)

USA . 88 parts In-Stock

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Digiode

USA . 823 parts In-Stock

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$300.494

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823

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Nova Conductors

Japan . 100 parts In-Stock

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$313.144

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Vyrian

USA . 7,606 parts In-Stock

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Anansix

USA . 2,747 parts In-Stock

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AZTECH Wire

Italy . 272 parts In-Stock

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$16.477

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Corphita

USA . 3,303 parts In-Stock

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$284.679

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Continental Prestige Electronics

USA . 3,901 parts In-Stock

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$313.144

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$306.881

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Ampacity Inc.

Singapore . 79 parts In-Stock

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$585.170

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Microchip USA

USA . 2,806 parts In-Stock

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$650.655

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Argo Parts USA

USA . 472 parts In-Stock

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UNI Independent Distributors

Spain . 137 parts In-Stock

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Bastille Electronics

Australia . 52 parts In-Stock

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Perfect Parts

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Overview

Experience powerful performance and unmatched reliability with the T2080NXN8P1B microprocessor by NXP Semiconductors. Crafted with precision and expertise, this cutting-edge technology offers a multitude of benefits for a wide range of applications. With its integrated cache and 64-bit size, it delivers lightning-fast speeds and enhanced efficiency. Whether you're designing advanced industrial systems or pioneering groundbreaking innovations, this product's surface mount and grid array package shape ensure easy integration and optimal performance. Don't settle for anything less than excellence - unlock the endless possibilities with the T2080NXN8P1B by NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides excellent durability and protection, making this microprocessor suitable for demanding industrial applications.

Integrated Cache: YES

With integrated cache, this microprocessor offers enhanced performance by reducing memory access time, making it an ideal choice for high-speed computing tasks.

Surface Mount: YES

The surface mount capability of this microprocessor allows for easy and efficient mounting on printed circuit boards, enabling seamless integration into various electronic devices.

Package Shape: SQUARE

The square package shape offers efficient space utilization, making this microprocessor an optimal choice for compact system designs where real estate is at a premium.

Bit Size: 64

With a 64-bit architecture, this microprocessor allows for processing large amounts of data simultaneously, resulting in improved overall performance and efficiency.

No. of Terminals: 896

The large number of terminals ensures robust connectivity options, providing flexibility for various input and output configurations, making it highly adaptable for diverse applications.

Package Style (Meter): GRID ARRAY

The grid array package style enhances electrical performance and thermal dissipation, ensuring reliable operation even in demanding industrial environments.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature tolerance enables this microprocessor to withstand harsh conditions, making it suitable for applications that require extended operating durations.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this microprocessor to function reliably in environments with extremely cold conditions, expanding its usability in a wide range of scenarios.

Terminal Finish: TIN SILVER COPPER

The tin silver copper terminal finish provides excellent conductivity and corrosion resistance, ensuring optimal signal transfer and long-term reliability in demanding industrial settings.

Terminal Position: BOTTOM

The bottom terminal position allows for convenient and secure connectivity to the printed circuit board, facilitating ease of installation and maintenance.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature specification ensures proper soldering and assembly processes, contributing to the overall quality and reliability of the microprocessor.

Peak Reflow Temperature °C: 250

The high peak reflow temperature tolerance allows for effective soldering and assembly processes, ensuring robust mechanical connections and long-term operational stability.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this microprocessor is built to withstand challenging temperature fluctuations, making it a reliable choice for rugged environments.

Peripheral IC Type: MICROPROCESSOR, RISC

Featuring a microprocessor with Reduced Instruction Set Computing (RISC) architecture, this product delivers excellent performance, power efficiency, and compatibility for a wide range of applications.

Technology: CMOS

Built on Complementary Metal-Oxide-Semiconductor (CMOS) technology, this microprocessor offers low power consumption, high integration capability, and improved performance, making it an energy-efficient choice for various electronic devices.

Terminal Form: BALL

With a ball terminal form, this microprocessor ensures reliable and precise connections, especially in applications with high shock and vibration requirements.

Format: FIXED POINT

The fixed-point format of this microprocessor enables precise numerical calculations and efficient data representation, making it ideal for applications that require accurate and reliable number crunching capabilities.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this microprocessor can withstand moderate moisture exposure during the assembly process, ensuring long-term reliability in humid environments.

Speed: 1533 rpm

Operating at a speed of 1533 rpm, this microprocessor provides fast and efficient data processing capabilities, enabling quick execution of tasks, resulting in improved productivity and responsiveness.

Technical Specifications

Microprocessors T2080NXN8P1B attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Bit Size:

64

Boundary Scan:

NO

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B896

JESD-609 Code:

e1

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

896

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA896(UNSPEC)

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Speed:

1533 rpm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

T2080NXN8P1B Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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