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T2080NXN8MQB

NXP Semiconductors

T2080NXN8MQB by NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 896; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

Median Price

$328.470

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1 parts In-Stock

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$328.470

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Distributors (In-Stock)

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Nova Conductors

Japan . 450 parts In-Stock

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$253.250

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450

$253.250

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Vyrian

USA . 5,814 parts In-Stock

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Anansix

USA . 2,230 parts In-Stock

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Digiode

USA . 308 parts In-Stock

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Flip Electronics

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Inventory MP

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Bristol Electronics

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Distributors (Availability)

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AZTECH Wire

Italy . 437 parts In-Stock

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$14.219

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One Stop Electronics

USA . 1,621 parts In-Stock

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$32.000

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Ampacity Inc.

Singapore . 341 parts In-Stock

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$32.000

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Continental Prestige Electronics

USA . 3,364 parts In-Stock

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$253.250

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$248.185

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Microchip USA

USA . 2,639 parts In-Stock

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$379.876

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Argo Parts USA

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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UNI Independent Distributors

Spain . 2,092 parts In-Stock

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Corphita

USA . 1,466 parts In-Stock

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Bastille Electronics

Australia . 236 parts In-Stock

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Technical Specifications

Microprocessors T2080NXN8MQB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Bit Size:

64

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B896

Length:

25 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

12

No. of Serial I/Os:

8

No. of Terminals:

896

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA896,30X30,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.61 mm

Speed:

1200 rpm

Maximum Supply Voltage:

1.055 V

Minimum Supply Voltage:

.995 V

Nominal Supply Voltage:

1.025 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

25 mm

Peripheral IC Type:

Trade Compliance

T2080NXN8MQB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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