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SPC5125YVN400

NXP Semiconductors

SPC5125YVN400 by NXP Semiconductors

NXP Semiconductors' SPC5125YVN400 is a 32-bit microprocessor with power supplies of 1.4V and 3.3V, suitable for industrial applications. Featuring a grid array package style with 324 terminals, it operates b/w -40°C to 85°C and has a peak reflow temperature of 260°C. This RISC-based processor is designed for high-speed performance at 400 rpm in automotive electronics and other industrial settings.

Median Price

$28.190

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

SPC5125YVN400 by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 90 parts In-Stock

1+ parts

$27.310

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90

$27.310

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Arrow

USA . 90 parts In-Stock

1+ parts

$28.190

100+ parts

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1k+ parts

$27.910

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90

$28.190

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$27.910

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Verical

USA . 90 parts In-Stock

1+ parts

$28.190

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$27.910

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90

$28.190

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$27.910

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Distributors (In-Stock)

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Digiode

USA . 2,997 parts In-Stock

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$25.944

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2,997

$25.944

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Vyrian

USA . 3,075 parts In-Stock

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3,075

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Anansix

USA . 2,740 parts In-Stock

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2,740

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Flip Electronics

USA . 1,808 parts In-Stock

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1,808

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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AZTECH Wire

Italy . 260 parts In-Stock

1+ parts

$5.955

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260

$5.955

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Aztec Data Supply Inc.

USA . 106 parts In-Stock

1+ parts

$22.114

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106

$22.114

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One Stop Electronics

USA . 90 parts In-Stock

1+ parts

$23.210

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90

$23.210

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Ampacity Inc.

Singapore . 90 parts In-Stock

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$23.210

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90

$23.210

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Corphita

USA . 997 parts In-Stock

1+ parts

$24.579

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997

$24.579

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Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

$29.182

100+ parts

$26.847

1k+ parts

$25.156

10k+ parts

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300

$29.182

$26.847

$25.156

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Corohmni

South Africa . 1,041 parts In-Stock

1+ parts

$44.976

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1,041

$44.976

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Microchip USA

USA . 2,842 parts In-Stock

1+ parts

$75.026

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2,842

$75.026

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Lixinc

USA . 15,060 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,555 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Continental Prestige Electronics

USA . 2,111 parts In-Stock

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2,111

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Argo Parts USA

USA . 2,031 parts In-Stock

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UNI Independent Distributors

Spain . 1,557 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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500

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Overview

Enhance your electronics projects with the SPC5125YVN400 by NXP Semiconductors, a top-quality microprocessor designed for exceptional performance. With a reputation for reliability and innovation, NXP Semiconductors delivers cutting-edge solutions that meet the demands of today's technology landscape. This powerful microprocessor is ideal for a wide range of applications, offering customers value, efficiency, and versatility. Upgrade your designs with the SPC5125YVN400 and experience the advantages of superior craftsmanship and advanced capabilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body provides durability and protection for the microprocessor, ensuring a longer lifespan for the product.

Surface Mount: YES

Being surface mountable makes the microprocessor easy to install on circuit boards, saving time and effort during assembly.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures that the microprocessor meets automotive-grade standards for reliability, making it suitable for use in automotive applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, making it ideal for compact electronic devices.

Bit Size: 32

The 32-bit size of the microprocessor allows for efficient processing of data and instructions, making it suitable for high-speed computing tasks.

Power Supplies (V): 1.4, 3.3

The availability of multiple power supply options (1.4V and 3.3V) allows flexibility in designing and optimizing power consumption for different applications.

No. of Terminals: 324

The high number of terminals provides connectivity options for interfacing with external components, enhancing the microprocessor's functionality.

Package Style (Meter): GRID ARRAY

The grid array package style offers a compact footprint and efficient thermal performance, making it suitable for applications with space and cooling constraints.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in challenging environmental conditions, increasing the microprocessor's versatility.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the microprocessor to function in cold environments without compromising performance.

Terminal Finish: TIN SILVER

The tin silver terminal finish offers corrosion resistance and good electrical conductivity, ensuring reliable connections for the microprocessor.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC architecture of the microprocessor provides efficient processing of instructions, leading to improved performance and power efficiency.

Terminal Form: BALL

The ball terminal form facilitates easy soldering onto the circuit board, enabling quick and reliable installation of the microprocessor.

Terminal Pitch: 1 mm

The 1mm terminal pitch allows for high-density mounting of the microprocessor on the circuit board, saving valuable space in electronic devices.

Moisture Sensitivity Level (MSL): 3

The MSL 3 designation indicates that the microprocessor has a moderate sensitivity to moisture, making it suitable for use in environments with controlled humidity levels.

Speed: 400 rpm

The high speed of 400 rpm enables the microprocessor to quickly and efficiently process data, making it ideal for demanding computing tasks.

Technical Specifications

Microprocessors SPC5125YVN400 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Bit Size:

32

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e2

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

324

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA324,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Speed:

400 rpm

Sub-Category:

Microprocessors

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Peripheral IC Type:

Trade Compliance

SPC5125YVN400 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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