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MPC5123YVY400B

NXP Semiconductors

MPC5123YVY400B by NXP Semiconductors

NXP Semiconductors' MPC5123YVY400B microprocessor features 32-bit address and external data bus width, with a max clock frequency of 35 MHz. Ideal for industrial applications, this CMOS technology-based chip operates at temperatures ranging from -40 to 85 °C, offering low power mode and integrated cache for efficient performance.

Median Price

$102.803

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

MPC5123YVY400B by NXP Semiconductors
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 200 parts In-Stock

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Verical

USA . 40 parts In-Stock

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$102.803

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$95.766

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40

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$102.803

$95.766

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Distributors (In-Stock)

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Nova Conductors

Japan . 450 parts In-Stock

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$81.435

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Vyrian

USA . 3,652 parts In-Stock

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Digiode

USA . 2,149 parts In-Stock

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Anansix

USA . 257 parts In-Stock

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Flip Electronics

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Distributors (Availability)

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AZTECH Wire

Italy . 601 parts In-Stock

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$10.440

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One Stop Electronics

USA . 120 parts In-Stock

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$13.000

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Ampacity Inc.

Singapore . 72 parts In-Stock

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$22.000

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$22.000

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Semicontronic

India . 200 parts In-Stock

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$29.000

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$28.275

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$28.130

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$29.000

$28.275

$28.130

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Aztec Data Supply Inc.

USA . 219 parts In-Stock

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$66.050

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Continental Prestige Electronics

USA . 5,264 parts In-Stock

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$81.435

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$79.806

5,264

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Netroflash

USA . 2,000 parts In-Stock

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$81.435

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$79.806

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$81.435

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Modulus Dynamics

Lithuania . 3,531 parts In-Stock

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$83.852

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$83.852

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$83.852

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3,531

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$83.852

$83.852

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Corohmni

South Africa . 218 parts In-Stock

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Microchip USA

USA . 2,995 parts In-Stock

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UNI Independent Distributors

Spain . 8,371 parts In-Stock

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Argo Parts USA

USA . 3,904 parts In-Stock

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Authorized Procurement Solutions

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Corphita

USA . 810 parts In-Stock

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Perfect Parts

USA . 582 parts In-Stock

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iodParts Technologies Inc.

India . 150 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the MPC5123YVY400B by NXP Semiconductors. As a leader in the semiconductor industry, NXP delivers cutting-edge microprocessors that redefine efficiency and speed. Ideal for a wide range of applications, this product offers customers unmatched value with integrated cache, low power mode, and a maximum clock frequency of 35 MHz. Trust NXP to provide innovative solutions that elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the microprocessor, ensuring its durability and reliability.

Integrated Cache: YES

Having integrated cache helps improve the performance of the processor by reducing access time to frequently used data.

Maximum Supply Voltage: 1.47 V

The high maximum supply voltage allows for efficient power delivery to the processor, enabling it to operate at peak performance.

Address Bus Width: 32

A wider address bus width allows for faster data transfer and processing capabilities, enhancing the overall performance of the microprocessor.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the processor can withstand high levels of heat and continue to function reliably in various conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computing) microprocessor, it is designed for efficient and fast execution of instructions, making it ideal for high-performance applications.

Technology: CMOS

CMOS technology enables low power consumption, high speed, and compatibility with a wide range of devices, making this microprocessor energy-efficient and versatile.

Speed: 400 rpm

Having a speed of 400 rpm allows for quick and efficient processing of instructions, making this microprocessor suitable for demanding tasks and applications.

Low Power Mode: YES

The availability of a low power mode helps reduce energy consumption when the processor is not at peak performance, saving power and extending the device's battery life.

Technical Specifications

Microprocessors MPC5123YVY400B attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Boundary Scan:

YES

Maximum Clock Frequency:

35 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B516

JESD-609 Code:

e2

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

516

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.55 mm

Speed:

400 rpm

Maximum Supply Voltage:

1.47 V

Minimum Supply Voltage:

1.33 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

27 mm

Peripheral IC Type:

Trade Compliance

MPC5123YVY400B Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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