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MPC5200CVR400

NXP Semiconductors

MPC5200CVR400 by NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: HBGA; Package Shape: SQUARE;

Median Price

$66.058

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 61 parts In-Stock

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$44.660

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61

$44.660

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Arrow

USA . 100 parts In-Stock

1+ parts

$61.917

100+ parts

$61.917

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$61.917

10k+ parts

$61.917

100

$61.917

$61.917

$61.917

$61.917

DigiKey

USA . 539 parts In-Stock

1+ parts

$95.640

100+ parts

$75.945

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-

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539

$95.640

$75.945

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Flip Electronics (Authorized)

USA . 118 parts In-Stock

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118

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Avnet

USA . 80 parts In-Stock

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80

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Rochester

USA . 12 parts In-Stock

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$70.200

1k+ parts

$62.810

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$59.110

12

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$62.810

$59.110

Distributors (In-Stock)

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Digiode

USA . 1,929 parts In-Stock

1+ parts

$41.971

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$41.971

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Vyrian

USA . 5,851 parts In-Stock

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Anansix

USA . 1,423 parts In-Stock

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Flip Electronics

USA . 853 parts In-Stock

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853

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Nova Conductors

Japan . 44 parts In-Stock

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Semtec, LLC

USA . 36 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 36 parts In-Stock

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ComSIT Distribution GmbH

Germany . 12 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 178 parts In-Stock

1+ parts

$37.550

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178

$37.550

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Semicontronic

India . 178 parts In-Stock

1+ parts

$37.550

100+ parts

$36.611

1k+ parts

$36.424

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$37.550

$36.611

$36.424

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Corphita

USA . 2,670 parts In-Stock

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$39.762

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$39.762

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Component Stockers USA

USA . 404 parts In-Stock

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$60.790

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$67.240

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404

$60.790

$67.240

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Corohmni

South Africa . 163 parts In-Stock

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$67.916

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163

$67.916

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Vigor

Singapore . 332 parts In-Stock

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$87.730

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332

$87.730

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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UNI Independent Distributors

Spain . 7,146 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,682 parts In-Stock

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Microchip USA

USA . 4,727 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Argo Parts USA

USA . 2,270 parts In-Stock

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Continental Prestige Electronics

USA . 1,650 parts In-Stock

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Perfect Parts

USA . 269 parts In-Stock

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Kepictronics

USA . 100 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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Technical Specifications

Microprocessors MPC5200CVR400 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

13

Boundary Scan:

YES

Maximum Clock Frequency:

35 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B272

JESD-609 Code:

e1

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

272

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Speed:

400 rpm

Maximum Supply Voltage:

1.58 V

Minimum Supply Voltage:

1.42 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

27 mm

Peripheral IC Type:

Trade Compliance

MPC5200CVR400 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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