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MCF54451CVM180

NXP Semiconductors

MCF54451CVM180 by NXP Semiconductors

NXP Semiconductors' MCF54451CVM180 microprocessor features 32-bit address and external data bus width, with a max clock frequency of 60 MHz. Ideal for industrial applications, it operates at temperatures ranging from -40 to 85 °C and offers low power mode for efficient performance.

Median Price

$24.750

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 436 parts In-Stock

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$19.750

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Verical

USA . 380 parts In-Stock

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$24.750

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$21.900

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$24.750

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$21.900

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Arrow

USA . 380 parts In-Stock

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$24.770

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$21.900

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380

$24.770

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$21.900

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Avnet

USA . 360 parts In-Stock

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360

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Digiode

USA . 1,876 parts In-Stock

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$18.762

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Nova Conductors

Japan . 10 parts In-Stock

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$24.152

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Vyrian

USA . 4,456 parts In-Stock

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Flip Electronics

USA . 1,577 parts In-Stock

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Anansix

USA . 560 parts In-Stock

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TME

Poland . 360 parts In-Stock

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$32.060

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Distributors (Availability)

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AZTECH Wire

Italy . 868 parts In-Stock

1+ parts

$8.296

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Ampacity Inc.

Singapore . 436 parts In-Stock

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$16.790

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One Stop Electronics

USA . 176 parts In-Stock

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$16.790

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Corphita

USA . 4,664 parts In-Stock

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$17.775

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$17.775

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Aranea Global

USA . 100 parts In-Stock

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$23.669

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$22.722

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$23.669

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Continental Prestige Electronics

USA . 2,970 parts In-Stock

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$24.152

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$23.669

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Vigor

Singapore . 3,999 parts In-Stock

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$28.800

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Microchip USA

USA . 2,137 parts In-Stock

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$52.795

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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UNI Independent Distributors

Spain . 4,211 parts In-Stock

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Perfect Parts

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Argo Parts USA

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Overview

Unleash the power of innovation with the MCF54451CVM180 by NXP Semiconductors. As a leader in semiconductor technology, NXP delivers top-quality microprocessors that are revolutionizing the industry. The MCF54451CVM180 is a game-changer, offering unparalleled performance and reliability for a wide range of applications. Experience seamless integration, enhanced efficiency, and cutting-edge features that will take your projects to the next level. Trust NXP Semiconductors to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides a lightweight and durable casing for the microprocessor, making it easy to handle and install.

Integrated Cache: YES

Having integrated cache on the microprocessor helps in improving performance by reducing access times to frequently used data, resulting in faster processing speeds.

Maximum Supply Voltage: 1.65 V

The maximum supply voltage of 1.65 V ensures stable and efficient power delivery to the microprocessor, enhancing its overall reliability and performance.

Address Bus Width: 32

A wider address bus width of 32 allows for larger memory addressing capabilities, enabling the microprocessor to handle more data and instructions simultaneously.

Package Shape: SQUARE

The square package shape offers a compact design, making it easy to integrate the microprocessor into various electronic devices without taking up too much space.

Bit Size: 32

With a bit size of 32, this microprocessor is capable of processing data in 32-bit chunks, providing better performance and efficiency compared to lower bit sizes.

Power Supplies (V): 1.5,1.8,2.5,3.3

The availability of multiple power supply options allows for flexibility in power management, catering to different voltage requirements of various systems.

No. of Terminals: 256

Having 256 terminals provides ample connectivity options for interfacing with external components and peripherals, enhancing the versatility and functionality of the microprocessor.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array, low profile package style offers a space-saving and efficient design, facilitating easy assembly and integration of the microprocessor in compact electronic devices.

Minimum Supply Voltage: 1.35 V

The minimum supply voltage of 1.35 V ensures efficient power consumption and reduced heat generation, contributing to energy efficiency and longer device lifespan.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even under demanding conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the microprocessor to function effectively in extreme cold environments, enhancing its versatility and usability.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term durability of the microprocessor.

Terminal Position: BOTTOM

Having the terminals positioned at the bottom allows for easier and more secure mounting of the microprocessor onto circuit boards, reducing the risk of damage during handling.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6 mm enables a slim profile for the microprocessor, making it suitable for applications where space is limited and height constraints are present.

Width: 17 mm

The compact width of 17 mm allows for easy integration of the microprocessor in various electronic systems, providing a versatile solution for different design requirements.

Boundary Scan: YES

The boundary scan feature enables efficient testing and debugging of the microprocessor during production and maintenance, ensuring high quality and reliability of the final product.

External Data Bus Width: 32

The 32-bit external data bus width enables fast data transfer between the microprocessor and external memory devices, enhancing overall system performance and responsiveness.

Maximum Clock Frequency: 60 MHz

The high maximum clock frequency of 60 MHz allows for fast processing speeds and efficient operation of the microprocessor, making it suitable for handling demanding computational tasks.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time allowed at peak reflow temperature of 260°C is 40 seconds, ensuring proper soldering and assembly of the microprocessor without causing damage due to overheating.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C is within standard reflow soldering temperatures, ensuring reliable and secure attachment of the microprocessor to circuit boards during assembly.

Length: 17 mm

The compact length of 17 mm allows for easy fitting of the microprocessor in tight spaces, providing flexibility in design and integration for various electronic applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade specification ensures that the microprocessor can operate reliably in harsh environmental conditions commonly found in industrial settings, making it a robust and durable choice.

Peripheral IC Type: MICROPROCESSOR

Being a microprocessor, this product is specifically designed for handling complex computing tasks and managing various system peripherals efficiently, making it ideal for high-performance applications.

Technology: CMOS

The CMOS technology used in this microprocessor offers low power consumption and high noise immunity, resulting in energy-efficient operation and reliable performance in diverse electronic systems.

Terminal Form: BALL

The ball terminal form provides secure and reliable connections for the microprocessor, ensuring stable operation and reducing the risk of signal interference or data loss.

Nominal Supply Voltage: 1.5 V

The nominal supply voltage of 1.5 V ensures stable and efficient power delivery to the microprocessor, maintaining consistent performance and preventing voltage fluctuations that may affect operation.

Terminal Pitch: 1 mm

The small terminal pitch of 1 mm allows for dense packaging of the microprocessor's terminals, maximizing connectivity within a limited space and enabling high-speed data transfer capabilities.

Format: FIXED POINT

The fixed-point format provides precise and accurate mathematical calculations and data processing, making the microprocessor suitable for applications that require high computational accuracy and reliability.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this microprocessor is resistant to moisture-related damage during storage and handling, ensuring long-term reliability and performance in various operating environments.

Speed: 180 rpm

With a high speed of 180 revolutions per minute, this microprocessor can quickly execute instructions and process data, leading to improved overall system performance and responsiveness.

Low Power Mode: YES

The low power mode feature allows the microprocessor to operate with reduced power consumption when idle or under light loads, increasing energy efficiency and prolonging battery life in portable devices.

Technical Specifications

Microprocessors MCF54451CVM180 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,1.8,2.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Speed:

180 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

Trade Compliance

MCF54451CVM180 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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