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AM5728BABCX

Texas Instruments

AM5728BABCX by Texas Instruments

The Texas Instruments AM5728BABCX microprocessor features 32-bit external data bus width, 16-bit address bus width, and a max clock frequency of 38.4 MHz. Ideal for applications requiring high-speed processing such as embedded systems, industrial automation, and automotive electronics.

Median Price

$89.691

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 420 parts In-Stock

1+ parts

$65.602

100+ parts

$58.313

1k+ parts

$42.877

10k+ parts

-

420

$65.602

$58.313

$42.877

-

DigiKey

USA . 126 parts In-Stock

1+ parts

$113.780

100+ parts

$87.572

1k+ parts

-

10k+ parts

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126

$113.780

$87.572

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 95 parts In-Stock

1+ parts

$62.190

100+ parts

-

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-

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95

$62.190

-

-

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Digiode

USA . 386 parts In-Stock

1+ parts

$62.322

100+ parts

-

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-

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386

$62.322

-

-

-

Bristol Electronics

USA . 70 parts In-Stock

1+ parts

$72.900

100+ parts

$61.236

1k+ parts

-

10k+ parts

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70

$72.900

$61.236

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-

Vyrian

USA . 6,122 parts In-Stock

1+ parts

-

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6,122

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VNN

France . 2,029 parts In-Stock

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-

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2,029

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Chip Stock

USA . 1,005 parts In-Stock

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1,005

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 319 parts In-Stock

1+ parts

$7.780

100+ parts

-

1k+ parts

-

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319

$7.780

-

-

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Ampacity Inc.

Singapore . 313 parts In-Stock

1+ parts

$55.760

100+ parts

-

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-

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313

$55.760

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Corohmni

South Africa . 741 parts In-Stock

1+ parts

$56.691

100+ parts

-

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741

$56.691

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Continental Prestige Electronics

USA . 1,009 parts In-Stock

1+ parts

$57.007

100+ parts

-

1k+ parts

-

10k+ parts

$55.867

1,009

$57.007

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-

$55.867

Corphita

USA . 938 parts In-Stock

1+ parts

$59.042

100+ parts

-

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938

$59.042

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Netroflash

USA . 100 parts In-Stock

1+ parts

$62.190

100+ parts

$60.946

1k+ parts

-

10k+ parts

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100

$62.190

$60.946

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-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$63.434

100+ parts

$63.434

1k+ parts

$63.434

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-

2,000

$63.434

$63.434

$63.434

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Parana Technologies

USA . 1,983 parts In-Stock

1+ parts

$68.635

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1,983

$68.635

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DigiPath Technology Company

USA . 467 parts In-Stock

1+ parts

$75.576

100+ parts

-

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467

$75.576

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ChromeModa Solutions

Germany . 5,542 parts In-Stock

1+ parts

$77.118

100+ parts

$63.237

1k+ parts

-

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5,542

$77.118

$63.237

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IDEA Electronic Components Group

UK . 153 parts In-Stock

1+ parts

$77.118

100+ parts

$73.262

1k+ parts

$69.406

10k+ parts

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153

$77.118

$73.262

$69.406

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Semicontronic

India . 324 parts In-Stock

1+ parts

$121.360

100+ parts

$118.326

1k+ parts

$117.719

10k+ parts

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324

$121.360

$118.326

$117.719

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Lixinc

USA . 17,958 parts In-Stock

1+ parts

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17,958

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Argo Parts USA

USA . 2,459 parts In-Stock

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2,459

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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-

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iodParts Technologies Inc.

India . 300 parts In-Stock

1+ parts

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300

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Overview

Experience the power of innovation with the AM5728BABCX microprocessor from Texas Instruments. Manufactured with top-quality materials and cutting-edge technology, this product offers unparalleled performance and reliability. Ideal for a wide range of applications, this microprocessor delivers exceptional value and benefits to customers looking for high-speed processing capabilities. Unlock new possibilities with the AM5728BABCX and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microprocessors for its durability and reliability.

Maximum Supply Voltage: 1.2 V

Low supply voltage helps in reducing power consumption and heat generation.

No. of Terminals: 760

Having a high number of terminals allows for more connectivity options and functionality.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, this microprocessor can perform well even under intense usage.

Technology: CMOS

CMOS technology offers low power consumption and high switching speeds, making this microprocessor efficient.

Maximum Clock Frequency: 38.4 MHz

A high clock frequency means faster processing speeds, making this microprocessor suitable for applications requiring quick data processing.

Technical Specifications

Microprocessors AM5728BABCX attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA760,28X28,31

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.55 mm

Speed:

1500 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM5728BABCX Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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