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AM5729BABCXEA

Texas Instruments

AM5729BABCXEA by Texas Instruments

The Texas Instruments AM5729BABCXEA microprocessor features 32-bit external data bus width, 16-bit address bus width, and a max clock frequency of 32 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power mode capability.

Median Price

$107.190

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 308 parts In-Stock

1+ parts

$82.409

100+ parts

$79.931

1k+ parts

$61.962

10k+ parts

-

308

$82.409

$79.931

$61.962

-

Mouser Electronics

USA . 16 parts In-Stock

1+ parts

$131.970

100+ parts

$100.010

1k+ parts

-

10k+ parts

-

16

$131.970

$100.010

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,355 parts In-Stock

1+ parts

$78.289

100+ parts

-

1k+ parts

-

10k+ parts

-

2,355

$78.289

-

-

-

Vyrian

USA . 7,175 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,175

-

-

-

-

VNN

France . 3,119 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,119

-

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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300

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 244 parts In-Stock

1+ parts

$33.026

100+ parts

-

1k+ parts

-

10k+ parts

-

244

$33.026

-

-

-

Parana Technologies

USA . 1,248 parts In-Stock

1+ parts

$44.350

100+ parts

-

1k+ parts

-

10k+ parts

-

1,248

$44.350

-

-

-

DigiPath Technology Company

USA . 640 parts In-Stock

1+ parts

$48.834

100+ parts

$44.928

1k+ parts

-

10k+ parts

-

640

$48.834

$44.928

-

-

IDEA Electronic Components Group

UK . 1,496 parts In-Stock

1+ parts

$49.831

100+ parts

$47.339

1k+ parts

$44.848

10k+ parts

-

1,496

$49.831

$47.339

$44.848

-

ChromeModa Solutions

Germany . 1,417 parts In-Stock

1+ parts

$49.831

100+ parts

$40.861

1k+ parts

-

10k+ parts

-

1,417

$49.831

$40.861

-

-

Corphita

USA . 3,179 parts In-Stock

1+ parts

$74.168

100+ parts

-

1k+ parts

-

10k+ parts

-

3,179

$74.168

-

-

-

Microchip USA

USA . 1,379 parts In-Stock

1+ parts

$130.880

100+ parts

$128.600

1k+ parts

$127.460

10k+ parts

$126.330

1,379

$130.880

$128.600

$127.460

$126.330

Ampacity Inc.

Singapore . 202 parts In-Stock

1+ parts

$152.460

100+ parts

-

1k+ parts

-

10k+ parts

-

202

$152.460

-

-

-

Argo Parts USA

USA . 4,930 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,930

-

-

-

-

Continental Prestige Electronics

USA . 1,688 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,688

-

-

-

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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500

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-

-

-

Overview

Experience top-notch performance with the AM5729BABCXEA microprocessor from Texas Instruments. Known for their impeccable quality and cutting-edge technology, Texas Instruments brings you a versatile solution for a wide range of applications. Whether you're looking to enhance your industrial automation, automotive systems, or consumer electronics, this microprocessor offers unparalleled value, efficiency, and reliability. Elevate your projects with the AM5729BABCXEA and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving time and effort.

Maximum Supply Voltage: 1.2 V

A higher maximum supply voltage allows for flexibility in power requirements and compatibility with a range of systems.

Address Bus Width: 16

A wider address bus width enables efficient data flow and processing capabilities.

Package Shape: SQUARE

The square package shape optimizes space utilization on PCBs and facilitates easier integration into systems.

No. of Terminals: 760

A higher number of terminals allows for more connectivity options and versatility in system configurations.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style enables higher pin density and improved signal integrity.

Minimum Supply Voltage: 1.11 V

A low minimum supply voltage helps in reducing power consumption and optimizing energy efficiency.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this microprocessor can function in demanding industrial environments without overheating.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature allows for usage in extreme cold conditions without performance issues.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides superior conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: BOTTOM

The bottom terminal position simplifies the soldering process and enhances stability on the PCB.

Maximum Seated Height: 2.96 mm

The low seated height enables a compact design and reduces the overall profile of the microprocessor system.

Width: 23 mm

The standard width allows for easy integration into various system designs and layouts.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the microprocessor during development and production phases.

External Data Bus Width: 32

A wider external data bus width enhances data transfer speed and processing efficiency.

Maximum Clock Frequency: 32 MHz

The high maximum clock frequency allows for fast data processing and improved system performance.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time ensures proper soldering and assembly of the microprocessor on the PCB.

Peak Reflow Temperature °C: 250

The high peak reflow temperature tolerance ensures reliable solder joints and overall product durability.

Length: 23 mm

The standard length facilitates easy integration into various system designs and layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade enables reliable performance in rugged and harsh environments.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC architecture in the microprocessor enhances efficiency in data processing and execution of instructions.

Technology: CMOS

CMOS technology provides low power consumption, high speed, and reliable operation for the microprocessor.

Terminal Form: BALL

The ball terminal form ensures secure connections and facilitates easier mounting on the PCB.

Nominal Supply Voltage: 1.15 V

The specified nominal supply voltage ensures stable operation and compatibility with various power sources.

Terminal Pitch: 0.8 mm

The tight terminal pitch allows for higher pin density and improved signal integrity in the microprocessor.

Format: FIXED POINT

The fixed-point format simplifies mathematical computations and enhances precision in data processing.

Moisture Sensitivity Level (MSL): 3

The specified moisture sensitivity level ensures proper handling and storage of the microprocessor to prevent moisture-induced damage.

Speed: 1500 rpm

The specified speed performance indicates the potential processing capabilities and efficiency of the microprocessor in various applications.

Low Power Mode: YES

The low power mode capability allows for energy-efficient operation and extended battery life in portable devices.

Technical Specifications

Microprocessors AM5729BABCXEA attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA760,28X28,31

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.96 mm

Speed:

1500 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM5729BABCXEA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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