Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The NXP Semiconductors T4081NSE7TTB microprocessor features a 64-bit external data bus width, 16-bit address bus width, and a max clock frequency of 133.3 MHz. It is ideal for applications requiring high-speed processing and low power consumption, such as embedded systems and IoT devices.
Median Price
$1,111.813
Lifecycle Status
Suppliers In-Stock
8
In-Stock Inventory
1k+
Rochester
1+ parts
$889.450
100+ parts
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1k+ parts
$782.720
10k+ parts
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Verical
$1,045.100
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Mouser Electronics
$1,385.970
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$817.589
DigiKey Marketplace
$994.570
Vyrian
Anansix
Nova Conductors
AZTECH Wire
$15.142
Corohmni
$19.058
Aztec Data Supply Inc.
$53.913
Ampacity Inc.
$731.530
Corphita
$774.558
Microchip USA
$918.460
UNI Independent Distributors
Argo Parts USA
Aranea Global
Continental Prestige Electronics
The use of plastic/epoxy material in the package body makes this microprocessor lightweight and durable, ideal for portable devices.
The integrated cache enhances the processing speed and efficiency of this microprocessor, making it suitable for high-performance applications.
Being surface mountable allows for easy installation and replacement of the microprocessor on a printed circuit board, saving time and effort.
With a wide address bus width of 16, this microprocessor can handle complex memory addressing tasks efficiently.
The square package shape allows for easy integration in square or rectangular PCB layouts, optimizing space usage.
The large number of terminals provides ample connectivity options, making it versatile for various applications and peripherals.
The grid array package style, along with a heat sink/slug, ensures effective heat dissipation, keeping the microprocessor cool during operation.
The tin silver copper terminal finish offers excellent conductivity and corrosion resistance, ensuring reliable performance over time.
The low maximum seated height allows for compact device designs, making this microprocessor suitable for space-constrained applications.
The moderate width of 45 mm strikes a balance between compactness and connectivity, making it versatile for various PCB layouts.
The presence of boundary scan capability simplifies debugging and testing processes, enhancing the overall reliability of this microprocessor.
With a wide external data bus width of 64, this microprocessor can handle large data transfers efficiently, suitable for data-intensive applications.
The high maximum clock frequency of 133.3 MHz ensures fast data processing and real-time performance, making it ideal for time-sensitive tasks.
The short maximum time at peak reflow temperature of 30 seconds minimizes the risk of heat damage during assembly, ensuring reliable solder joints.
With a high peak reflow temperature of 250°C, this microprocessor can withstand elevated temperatures during the assembly process, ensuring robust soldering.
The moderate length of 45 mm offers a good balance between compactness and connectivity, making this microprocessor suitable for various form factors.
The RISC architecture of this microprocessor allows for efficient and streamlined data processing, ideal for high-performance computing tasks.
The CMOS technology used in this microprocessor offers low power consumption and high-speed operation, making it energy-efficient and reliable.
The ball terminal form ensures secure connections and simplifies the installation process, making it user-friendly and reliable.
The compact terminal pitch of 1 mm allows for high-density integration on a PCB, optimizing space usage and improving connectivity.
The fixed-point format simplifies arithmetic operations and enhances computational efficiency, making this microprocessor suitable for mathematical tasks.
With a moisture sensitivity level of 3, this microprocessor can withstand moderate exposure to moisture during handling and storage.
The operating speed of 1800 rpm ensures fast data processing and response times, making this microprocessor suitable for real-time applications.
The low power mode feature allows for energy-efficient operation, extending battery life and reducing overall power consumption.
Microprocessors T4081NSE7TTB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Address Bus Width:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Speed:
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
T4081NSE7TTB Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A002.A.1
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Design/Specification - T408x/T416x/T424x 01/Jul/2022
PCN Assembly/Origin - Mult Dev 12/Jan/2023
PCN Packaging - All Dev Label Update 15/Dec/2020 Mult Dev Pkg Seal 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
CRG0805F10K
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10000 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
SS14
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Micro Commercial Components
Small Signal Bipolar Transistors; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-609 Code: e0;
Vishay Intertechnology
Vishay Intertechnology's SS14 is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 1A. Operating at up to 125°C, it has a repetitive peak reverse voltage of 40V. Ideal for surface mount applications, it suits various electronic circuits requiring efficient rectification and low forward voltage drop.
LM107H
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Nominal Common Mode Reject Ratio: 96 dB;
OPA2277UA/2K5E4
Texas Instruments
OPA2277UA/2K5E4 by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It has a max input offset voltage of 100uV, nominal common mode reject ratio of 140dB, and min slew rate of 0.8V/us. Ideal for industrial applications requiring precise signal amplification in compact designs.
BAV99
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138PS,115
NXP Semiconductors
NXP Semiconductors' BSS138PS,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it features a 1.6 ohm max on-resistance and operates in enhancement mode. The transistor comes in a small outline package with GULL WING terminals, making it suitable for surface mount designs.
MBRS130LT3G
Onsemi
MBRS130LT3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.445V. It operates b/w -65 to 125°C, has a reverse test voltage of 30V, and is ideal for power applications due to its small outline package style.
Daco Semiconductor
1N4148WS
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Baneasa S A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; Qualification: Not Qualified;
1N4148WT
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 7.5 ohm; Maximum Drain Current (Abs) (ID): .115 A;
INA826AIDGKR
INA826AIDGKR by Texas Instruments is an instrumentation amplifier with 150uV max input offset voltage, 0.095uA max average bias current, and 1MHz nominal bandwidth. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and high common mode rejection ratio of 120dB.
DP83848IVVX/NOPB
Texas Instruments DP83848IVVX/NOPB is a 3.3V Ethernet transceiver with 100000 Mbps data rate, suitable for industrial applications. It features CMOS technology, operates b/w -40 to 85 °C, and comes in a low profile flatpack package with matte tin finish.
1N4148
Shandong Yiguang Electronic Joint Stock
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
EU2B-YS3203C
Idec
ROTARY SWITCH;
ULN2803A
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
STMicroelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .2 A; Transistor Application: SWITCHING;
MCF54418CMJ250
The NXP Semiconductors MCF54418CMJ250 microprocessor features a 32-bit architecture, integrated cache, and operates at a max clock frequency of 100 MHz. Ideal for industrial applications requiring low power consumption, it supports multiple power supplies (1.2V, 1.8V, 3.3V) and has a temperature range of -40 to 85°C.
RTPXA270C5C520
Intel
The Intel RTPXA270C5C520 microprocessor features a 32-bit architecture with integrated cache and operates at a max clock frequency of 3.6864 MHz. It is designed for low power mode applications, with a nominal voltage of 1.45 V and boundary scan capability for efficient testing.
MCIMX6S6AVM08AB
MCIMX6S6AVM08AB by NXP Semiconductors is a 64-bit microprocessor with 16-bit address bus width, 32-bit external data bus width, and max clock frequency of 24 MHz. Ideal for automotive applications due to its low power mode, CMOS technology, and terminal finish of tin silver copper.
MC7448TVU1267ND
Freescale Semiconductor
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE; Boundary Scan: YES;
ADSP-21489BSWZ-4A
Analog Devices
Analog Devices' ADSP-21489BSWZ-4A microprocessor features 40-bit size, 24-bit address bus width, and 163840 RAM words. Ideal for industrial applications, it operates at up to 25 MHz clock frequency with a max supply voltage of 1.15 V. The package style includes flatpack and low profile options for versatile integration in various systems.
MPC8270CZUQLDA
The NXP Semiconductors MPC8270CZUQLDA microprocessor features a 32-bit address bus width, 64-bit external data bus width, and max clock frequency of 83.33 MHz. It is commonly used in applications requiring high-speed processing and integrated cache memory for improved performance.
AM3517AZCN
AM3517AZCN by Texas Instruments is a microprocessor with 16-bit address bus and 8-bit on-chip data RAM. It operates at a max clock frequency of 26 MHz, suitable for low power applications. With integrated cache and boundary scan feature, it is ideal for embedded systems requiring high-speed processing in compact form factors.
MCF5372LCVM240
NXP Semiconductors' MCF5372LCVM240 microprocessor features 32-bit architecture, 80 MHz clock frequency, and integrated cache. Ideal for industrial applications requiring low power mode, with a temperature range of -40 to 85°C. Package style is grid array with 196 terminals in a square shape.
MIMXRT1052DVL6BR
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3;
AM6412BSCGGAALV
AM6412BSCGGAALV by Texas Instruments is a 64-bit microprocessor with integrated cache and 16-bit on-chip data RAM. It operates at a max clock frequency of 25 MHz, making it suitable for high-speed computing applications. The package style is grid array, fine pitch, with a terminal pitch of 0.8 mm, ideal for compact designs requiring low power consumption.
AM3358BGCZA80EP
AM3358BGCZA80EP by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus. Operating at speeds up to 800 rpm, it is ideal for industrial applications requiring low power mode and boundary scan capability. With a temperature range of -40 to 105 °C, this CMOS technology processor offers high performance in a grid array package.
MCF54416CMJ250
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
MCF5272VM66
NXP Semiconductors' MCF5272VM66 microprocessor features 32-bit architecture, 23-bit address bus width, and integrated cache. Ideal for commercial applications, it operates at a max clock frequency of 66 MHz with low power mode support.
P2041NXN7NNC
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 245; JESD-609 Code: e1; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Maximum Time At Peak Reflow Temperature (s): 30;
ATSAMA5D34A-CU
Atmel
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;
MCF54453VP266
MICROPROCESSOR; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE;
MCIMX6QP6AVT1AB
MCIMX6QP6AVT1AB by NXP Semiconductors is a microprocessor with a max supply voltage of 1.5V and operating temperature range of -40 to 125°C. It is commonly used in automotive applications due to its CMOS technology and fine pitch grid array package style.
AT91SAM9G35-CU-999
Microchip Technology
AT91SAM9G35-CU-999 by Microchip Technology is a 32-bit microprocessor with integrated cache and 26-bit address bus width. It operates at a max clock frequency of 50 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. With a package style of grid array and terminal pitch of 0.8 mm, it offers high performance in a compact form factor.
MPC880ZP80
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 32;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
T4080NSE7PQB
MICROPROCESSOR, RISC; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; Technology: CMOS; JESD-609 Code: e1; Peak Reflow Temperature (C): 250;
T4080NSE7QTB
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1; Peak Reflow Temperature (C): 250; Terminal Finish: TIN SILVER COPPER;
T4080NSN7PQB
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 30; Technology: CMOS; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 250;
T4080NSN7QTB
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1;
T4080NXE7PQB
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 3; Technology: CMOS; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1;
T4080NXN7PQB
MICROPROCESSOR, RISC; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250; JESD-609 Code: e1; Technology: CMOS;
T4081NSE7PQB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
T4081NSE7QTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Integrated Cache: YES;
T4081NSN7PQB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Length: 45 mm;
T4081NSN7QTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
T4081NSN7TTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Speed: 1800 rpm;
T4081NXE7PQB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;
T4081NXE7QTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; External Data Bus Width: 64;
T4081NXE7TTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;
T4081NXN7PQB
T4081NXN7QTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1932;
T4081NXN7TTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Format: FIXED POINT;
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