Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The NXP Semiconductors T4080NSE7QTB is a MICROPROCESSOR with RISC technology, featuring Terminal Finish of TIN SILVER COPPER. It can withstand a Peak Reflow Temperature of 250°C for up to 30s. This high-performance chip is ideal for applications requiring advanced processing capabilities in various industries.
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The use of multiple terminal finishes provides flexibility and compatibility with various PCB designs and requirements.
With a maximum time of 30 seconds at peak reflow temperature, this microprocessor can be efficiently soldered onto the PCB during manufacturing processes.
The high peak reflow temperature of 250°C ensures strong solder joints and reliable connections for the microprocessor, increasing its durability and performance.
The use of RISC (Reduced Instruction Set Computing) architecture in this microprocessor allows for efficient and fast processing of instructions, making it suitable for a wide range of applications.
CMOS technology offers low power consumption and high speed operation, making this microprocessor energy efficient and suitable for battery-powered devices.
With a moisture sensitivity level of 3, this microprocessor can withstand moderate exposure to moisture during handling and storage, ensuring its reliability in various environments.
Microprocessors T4080NSE7QTB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
JESD-609 Code:
Moisture Sensitivity Level (MSL):
Peak Reflow Temperature (C):
Technology:
Terminal Finish:
Maximum Time At Peak Reflow Temperature (s):
Peripheral IC Type:
T4080NSE7QTB Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A002.A.1
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Design/Specification - T408x/T416x/T424x 01/Jul/2022
PCN Assembly/Origin - Mult Dev 12/Jan/2023
PCN Packaging - All Dev Label Update 15/Dec/2020 Mult Dev Pkg Seal 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
NE555D
Texas Instruments
NE555D by Texas Instruments is an 8-terminal IC with a supply voltage range of 4.5V to 16V, suitable for analog waveform generation applications. It operates at temperatures from 0°C to 70°C and has a max supply current of 15mA. The package style is small outline, making it ideal for compact electronic designs.
1N4148
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS138LT1G
Onsemi
BSS138LT1G by Onsemi is a N-CHANNEL FET with 50V DS Breakdown Voltage, 0.2A Drain Current, and 3.5 ohm On Resistance. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Operates b/w -55 to 150 °C with small outline package style for surface mount assembly.
2N2222A
Philips Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM358M
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
2N7002
Sinyork
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Operating Temperature: 85 Cel; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Operating Mode: ENHANCEMENT MODE;
Swampscott Electronics
BAV99
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20
Maxim Integrated
DS18B20 by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Commonly used in applications requiring precise temperature monitoring like HVAC systems and industrial automation.
STMicroelectronics
261
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
Lite-on Semiconductor
BSS138BKW,115
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Terminal Finish: TIN; No. of Terminals: 3; Additional Features: LOGIC LEVEL COMPATIBLE;
NDT2955
NDT2955 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 15A and EAS of 174mJ, suitable for ENHANCEMENT MODE operation. With a compact SMALL OUTLINE package and -55 to 150 °C operating range, it offers efficient power dissipation up to 3W.
LL4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SS14
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
43025-0400
Molex
The Molex 43025-0400 is a board connector with 4 contacts, 2 rows, and a mating contact pitch of 0.118". It has a body length of 0.27", insulation resistance of 1Gohm, and operates b/w -40 to 105°C. Ideal for commercial applications requiring a female connector with crimp termination and UL94V-0 flammability rating.
SMBJ18CA
Thinking Electronic Industrial
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MPC8358ECZQAGDGA
Freescale Semiconductor
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 668; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;
TMS320DM8148CCYEA0
TMS320DM8148CCYEA0 by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 30 MHz, suitable for low power mode applications. With 72 DMA channels, it offers high-speed processing in various embedded systems.
MC9328MX1CVM15R2
Motorola
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;
LS1020AXE7KQB
NXP Semiconductors
LS1020AXE7KQB by NXP Semiconductors is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 133.3 MHz. It features a 16-bit address bus width and external data bus width of 32 bits, suitable for applications requiring low power mode and boundary scan capabilities.
MIMXRT1166XVM5A
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
MCIMX6U5EVM10AB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH;
MCIMX6X1CVK08AB
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
AM3517AZCNAC
AM3517AZCNAC by Texas Instruments is a 16-bit microprocessor with integrated cache and surface mount capability. It operates at a max clock frequency of 26 MHz and has a wide temperature range, making it suitable for industrial applications.
MPC8245LVV266D
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 352; Package Code: LBGA; Package Shape: SQUARE; Boundary Scan: YES;
MCF53281CVM240
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
SPC5125YVN400R
NXP Semiconductors' SPC5125YVN400R is a 32-bit microprocessor with 324 terminals in a grid array package. Operating at temperatures from -40 to 85°C, it features power supplies of 1.4V and 3.3V, making it ideal for industrial applications requiring high-speed processing capabilities. The device is designed for surface mount assembly and has a moisture sensitivity level of MSL3, meeting AEC-Q100 standards.
MCIMX6Q4AVT10ADR
MCIMX6Q4AVT10ADR by NXP is a 32-bit microprocessor with 64-bit external data bus width. It operates at speeds up to 1000 rpm, suitable for automotive applications. Featuring integrated cache and low power mode, it has a temperature range of -40 to 125 °C and boundary scan capability.
P1011NXN2HFB
P1011NXN2HFB by NXP Semiconductors is a 32-bit RISC microprocessor with integrated cache, 16-bit address bus width, and 32-bit external data bus width. It is suitable for applications requiring high-speed processing and features like boundary scan, 4 DMA channels, and a max supply voltage of 1.05V.
MPC8270VRMIBA
MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;
MCIMX31CVMN4D
MCIMX31CVMN4D by NXP Semiconductors is a MICROPROCESSOR with 1.5V and 3.3V power supplies, suitable for I2C, SPI, UART, and USB bus compatibility. It has 9 I/O lines and can withstand peak reflow temperature of 260°C for up to 40 seconds. Ideal for applications requiring high-performance RISC-based processing in various electronic devices.
CS80C286-16
Renesas Electronics
CS80C286-16 by Renesas Electronics is a 16 rpm microprocessor with 24-bit address bus width and 16-bit external data bus width. It operates at temperatures b/w 0 to 70 °C, making it suitable for commercial applications requiring low power mode and fixed-point format processing.
MPC880CVR66
NXP Semiconductors' MPC880CVR66 microprocessor features 32-bit address and external data bus width, with integrated cache and low power mode. Ideal for RISC-based applications, it operates at a speed of 66 rpm with a max supply voltage of 1.9 V. The package style is grid array, making it suitable for various electronic devices requiring high processing power in a compact form factor.
MCF5307CAI66B
The NXP Semiconductors MCF5307CAI66B microprocessor features a 32-bit address and external data bus width, with a max clock frequency of 33.33 MHz. It is suitable for applications requiring low power mode operation, such as embedded systems and industrial control. The device comes in a square package shape with 208 terminals, supporting boundary scan testing for enhanced reliability.
AT91SAM9G45B-CU
Microchip Technology
AT91SAM9G45B-CU by Microchip Technology is a 32-bit microprocessor with 8-bit on-chip data RAM and 26-bit address bus width. It operates at a max clock frequency of 50 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. With a package style of grid array and thin profile, it offers high performance in a compact form factor.
MCF5270CVM150R2
NXP Semiconductors' MCF5270CVM150R2 microprocessor features a 32-bit architecture with integrated cache and operates at a max clock frequency of 75 MHz. Ideal for industrial applications, this CMOS technology-based chip has a low power mode and supports boundary scan testing.
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T4081NSE7TTB
The NXP Semiconductors T4081NSE7TTB microprocessor features a 64-bit external data bus width, 16-bit address bus width, and a max clock frequency of 133.3 MHz. It is ideal for applications requiring high-speed processing and low power consumption, such as embedded systems and IoT devices.
T4080NSE7PQB
MICROPROCESSOR, RISC; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; Technology: CMOS; JESD-609 Code: e1; Peak Reflow Temperature (C): 250;
T4080NSN7PQB
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 30; Technology: CMOS; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 250;
T4080NSN7QTB
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1;
T4080NXE7PQB
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 3; Technology: CMOS; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1;
T4080NXN7PQB
MICROPROCESSOR, RISC; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250; JESD-609 Code: e1; Technology: CMOS;
T4081NSE7PQB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
T4081NSE7QTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Integrated Cache: YES;
T4081NSN7PQB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Length: 45 mm;
T4081NSN7QTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
T4081NSN7TTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Speed: 1800 rpm;
T4081NXE7PQB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;
T4081NXE7QTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; External Data Bus Width: 64;
T4081NXE7TTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;
T4081NXN7PQB
T4081NXN7QTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1932;
T4081NXN7TTB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Format: FIXED POINT;
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