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DM3725CBPDR100

Texas Instruments

DM3725CBPDR100 by Texas Instruments

The Texas Instruments DM3725CBPDR100 microprocessor features a 26-bit address bus, 16-bit external data bus, and integrated cache. Ideal for industrial applications requiring a max clock frequency of 54 MHz and low power mode capability. Package style is grid array with very thin profile and fine pitch terminals.

Median Price

$39.826

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 920 parts In-Stock

1+ parts

$39.826

100+ parts

$35.401

1k+ parts

$26.030

10k+ parts

-

920

$39.826

$35.401

$26.030

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$35.932

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$35.932

-

-

-

Digiode

USA . 265 parts In-Stock

1+ parts

$37.835

100+ parts

-

1k+ parts

-

10k+ parts

-

265

$37.835

-

-

-

Vyrian

USA . 5,701 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,701

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 574 parts In-Stock

1+ parts

$18.395

100+ parts

-

1k+ parts

-

10k+ parts

-

574

$18.395

-

-

-

Parana Technologies

USA . 1,593 parts In-Stock

1+ parts

$22.646

100+ parts

-

1k+ parts

$23.304

10k+ parts

-

1,593

$22.646

-

$23.304

-

DigiPath Technology Company

USA . 943 parts In-Stock

1+ parts

$24.936

100+ parts

$22.941

1k+ parts

-

10k+ parts

-

943

$24.936

$22.941

-

-

ChromeModa Solutions

Germany . 1,865 parts In-Stock

1+ parts

$25.445

100+ parts

$20.865

1k+ parts

-

10k+ parts

-

1,865

$25.445

$20.865

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-

IDEA Electronic Components Group

UK . 448 parts In-Stock

1+ parts

$25.445

100+ parts

$24.173

1k+ parts

$22.900

10k+ parts

-

448

$25.445

$24.173

$22.900

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Corohmni

South Africa . 193 parts In-Stock

1+ parts

$31.850

100+ parts

-

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-

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193

$31.850

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-

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Ampacity Inc.

Singapore . 873 parts In-Stock

1+ parts

$33.850

100+ parts

-

1k+ parts

-

10k+ parts

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873

$33.850

-

-

-

Advanced Electronics

New Zealand . 800 parts In-Stock

1+ parts

$35.127

100+ parts

$34.775

1k+ parts

$33.370

10k+ parts

-

800

$35.127

$34.775

$33.370

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Corphita

USA . 4,634 parts In-Stock

1+ parts

$35.843

100+ parts

-

1k+ parts

-

10k+ parts

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4,634

$35.843

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-

-

Continental Prestige Electronics

USA . 3,046 parts In-Stock

1+ parts

$35.932

100+ parts

-

1k+ parts

-

10k+ parts

$35.214

3,046

$35.932

-

-

$35.214

Argo Parts USA

USA . 2,251 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,251

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Overview

Experience unparalleled performance and reliability with the Texas Instruments DM3725CBPDR100 microprocessor. As a leader in the industry, Texas Instruments delivers cutting-edge technology in a compact package suitable for a wide range of applications. From industrial automation to consumer electronics, this microprocessor offers high-speed processing, low power consumption, and seamless integration, making it the perfect choice for your next project. Trust Texas Instruments to provide you with the quality and value you need to take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the microprocessor lightweight and durable, making it easier to handle and less prone to damage during manufacturing and operation.

Integrated Cache: YES

Having integrated cache improves the overall performance of the microprocessor by providing faster access to frequently used data, resulting in enhanced speed and efficiency in processing tasks.

Maximum Supply Voltage: 1.2 V

The maximum supply voltage of 1.2 V ensures energy efficiency and helps in reducing power consumption, making it an environmentally friendly option.

Address Bus Width: 26

With a wide address bus width of 26, the microprocessor can handle large amounts of memory and data, enabling it to support complex computing tasks more effectively.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature of 90°C allows the microprocessor to withstand extreme heat conditions, ensuring reliable performance in various environments.

Technology: CMOS

Being based on CMOS technology, the microprocessor offers low power consumption, high speed, and reliability, making it suitable for a wide range of applications.

Technical Specifications

Microprocessors DM3725CBPDR100 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

26

Boundary Scan:

YES

Maximum Clock Frequency:

54 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B515

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

515

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.71 mm

Speed:

1000 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.14 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

DM3725CBPDR100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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