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MPC8270CVVUPEA

NXP Semiconductors

MPC8270CVVUPEA by NXP Semiconductors

NXP Semiconductors' MPC8270CVVUPEA microprocessor features 32-bit address bus, 64-bit external data bus, and integrated cache. Ideal for industrial applications requiring low power mode, with a max operating temperature of 105°C and boundary scan capability.

Median Price

$181.350

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

MPC8270CVVUPEA by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2 parts In-Stock

1+ parts

$181.350

100+ parts

$170.470

1k+ parts

$154.150

10k+ parts

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2

$181.350

$170.470

$154.150

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Flip Electronics (Authorized)

USA . 3,794 parts In-Stock

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3,794

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Distributors (In-Stock)

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Digiode

USA . 2,861 parts In-Stock

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$172.282

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2,861

$172.282

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Nova Conductors

Japan . 150 parts In-Stock

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$221.079

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150

$221.079

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Chip Stock

USA . 7,200 parts In-Stock

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7,200

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Anansix

USA . 2,397 parts In-Stock

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2,397

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Flip Electronics

USA . 2,037 parts In-Stock

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Vyrian

USA . 1,820 parts In-Stock

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Touchstone Systems

USA . 600 parts In-Stock

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600

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,300 parts In-Stock

1+ parts

$51.630

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-

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3,300

$51.630

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One Stop Electronics

USA . 1,609 parts In-Stock

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$154.150

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1,609

$154.150

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Ampacity Inc.

Singapore . 1,442 parts In-Stock

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$154.150

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1,442

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Semicontronic

India . 1,413 parts In-Stock

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$154.150

100+ parts

$150.296

1k+ parts

$149.526

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1,413

$154.150

$150.296

$149.526

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Corphita

USA . 2,223 parts In-Stock

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$163.215

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Continental Prestige Electronics

USA . 2,730 parts In-Stock

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$221.079

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$216.657

2,730

$221.079

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$216.657

Corohmni

South Africa . 27 parts In-Stock

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$241.115

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27

$241.115

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Vigor

Singapore . 308 parts In-Stock

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$296.780

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308

$296.780

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Microchip USA

USA . 369 parts In-Stock

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$344.563

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369

$344.563

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QUARKTWIN TECHNOLOGY LTD

USA . 18,759 parts In-Stock

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Lixinc

USA . 9,081 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,463 parts In-Stock

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UNI Independent Distributors

Spain . 4,136 parts In-Stock

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Argo Parts USA

USA . 3,729 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$216.657

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$210.025

10k+ parts

$205.603

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$210.025

$205.603

Kepictronics

USA . 1,000 parts In-Stock

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GreenTree Electronics

Israel . 500 parts In-Stock

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500

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Perfect Parts

USA . 168 parts In-Stock

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168

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Overview

Elevate your products with the cutting-edge MPC8270CVVUPEA microprocessor from NXP Semiconductors. Designed for industrial-grade applications, this powerhouse offers seamless integration and top-notch performance. With features like integrated cache and low power mode, this processor ensures optimal efficiency while delivering unmatched speed and reliability. Trust in NXP Semiconductors' legacy of excellence and take your projects to the next level with the MPC8270CVVUPEA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection for the microprocessor, ensuring it can withstand various environmental conditions.

Integrated Cache: YES

Integrated cache improves the performance of the microprocessor by providing faster access to frequently used data and instructions, resulting in improved efficiency.

Maximum Supply Voltage: 1.6 V

A higher maximum supply voltage allows for increased performance and flexibility in power management for the microprocessor.

Address Bus Width: 32

A wider address bus width of 32 bits allows the microprocessor to access a larger memory space and handle complex computational tasks efficiently.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance of 260°C ensures reliability during the manufacturing process, making the microprocessor suitable for industrial applications.

Peripheral IC Type: MICROPROCESSOR, RISC

A microprocessor designed with RISC (Reduced Instruction Set Computing) architecture offers high performance, low power consumption, and faster execution of instructions.

Technical Specifications

Microprocessors MPC8270CVVUPEA attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B480

JESD-609 Code:

e1

Length:

37.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

480

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA480,29X29,50

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.65 mm

Speed:

450 rpm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.45 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

37.5 mm

Peripheral IC Type:

Trade Compliance

MPC8270CVVUPEA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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