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STM32MP131AAF3

STMicroelectronics

STM32MP131AAF3 by STMicroelectronics

STM32MP131AAF3 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 48 MHz clock frequency. It features 172032 RAM words, 56 DMA channels, and operates b/w -40 to 125 °C. Ideal for low power applications in IoT devices due to its compact size and high-speed processing capabilities.

Median Price

$9.360

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 574 parts In-Stock

1+ parts

$9.360

100+ parts

$5.810

1k+ parts

$4.570

10k+ parts

-

574

$9.360

$5.810

$4.570

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EBV Elektronik

Germany . 160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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160

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Distributors (In-Stock)

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Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$4.610

100+ parts

-

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1,000

$4.610

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Vyrian

USA . 5,735 parts In-Stock

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5,735

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Digiode

USA . 3,257 parts In-Stock

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3,257

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Anansix

USA . 1,641 parts In-Stock

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1,641

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TME

Poland . 160 parts In-Stock

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-

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1k+ parts

$4.790

10k+ parts

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160

-

-

$4.790

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 315 parts In-Stock

1+ parts

$12.269

100+ parts

-

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-

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315

$12.269

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Ampacity Inc.

Singapore . 145 parts In-Stock

1+ parts

$15.000

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-

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145

$15.000

-

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Semicontronic

India . 267 parts In-Stock

1+ parts

$34.000

100+ parts

$33.150

1k+ parts

$32.980

10k+ parts

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267

$34.000

$33.150

$32.980

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Corphita

USA . 4,218 parts In-Stock

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Argo Parts USA

USA . 2,611 parts In-Stock

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2,611

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Continental Prestige Electronics

USA . 2,360 parts In-Stock

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2,360

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$4.518

1k+ parts

$4.380

10k+ parts

$4.287

50

-

$4.518

$4.380

$4.287

Overview

Unleash the power of innovation with the STM32MP131AAF3 by STMicroelectronics. Designed with precision and reliability in mind, this microprocessor offers seamless integration and exceptional performance for a wide range of applications. With cutting-edge technology and advanced features like integrated cache and low power mode, this product delivers unparalleled value and benefits to customers looking to elevate their projects to the next level. Trust in STMicroelectronics, a leader in the industry, and experience the difference with the STM32MP131AAF3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes this microprocessor lightweight and durable.

Integrated Cache: YES

The presence of integrated cache enhances the processing speed and efficiency of this microprocessor.

Surface Mount: YES

The surface mount feature allows for easy installation and compatibility with a variety of devices.

Maximum Supply Voltage: 1.38 V

The high maximum supply voltage ensures stable and efficient performance of the microprocessor.

On Chip Data RAM Width: 8

With an on-chip data RAM width of 8, this microprocessor can handle and process data efficiently.

Address Bus Width: 26

The wide address bus width of 26 enables the microprocessor to efficiently access and manage memory locations.

Package Shape: SQUARE

The square package shape makes it easy to mount and integrate this microprocessor into a variety of systems.

Bit Size: 32

The 32-bit size allows for faster and more precise data processing capabilities.

No. of Terminals: 320

The large number of terminals provide ample connectivity options for various peripherals and components.

Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style offers compactness and efficient thermal management.

Minimum Supply Voltage: 1.21 V

The low minimum supply voltage helps in reducing power consumption and heat generation.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in extreme conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in a wide range of environments.

Terminal Position: BOTTOM

The bottom terminal position simplifies the integration and connection of the microprocessor in a system.

Maximum Seated Height: 1.2 mm

The low maximum seated height enables compact design and easy integration into space-constrained devices.

RAM Words: 172032

The large RAM word capacity allows for efficient storage and processing of data.

Width: 11 mm

The compact width of the microprocessor facilitates easy integration into tight spaces.

Boundary Scan: YES

The boundary scan feature aids in diagnostic testing and troubleshooting of the microprocessor.

External Data Bus Width: 16

The wide external data bus width of 16 enhances data transfer speeds between the microprocessor and external components.

Maximum Clock Frequency: 48 MHz

The high maximum clock frequency enables fast and responsive processing of instructions.

Length: 11 mm

The compact length of the microprocessor makes it suitable for small form factor devices.

Peripheral IC Type: MICROPROCESSOR, RISC

The microprocessor with a RISC architecture is optimized for high performance and efficiency.

Technology: CMOS

The CMOS technology used in this microprocessor offers low power consumption and high speed operation.

Terminal Form: BALL

The ball terminal form ensures secure and reliable connections for improved performance and stability.

Maximum Supply Current: 239 mA

The moderate maximum supply current requirement helps in reducing power consumption and heat dissipation.

Nominal Supply Voltage: 1.25 V

The nominal supply voltage ensures stable and efficient operation of the microprocessor.

No. of DMA Channels: 56

The ample number of DMA channels allows for efficient data transfer and processing.

No. of Serial I/Os: 8

The multiple serial I/Os provide versatile connectivity options for external devices and peripherals.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density packaging and efficient use of space.

Format: FIXED POINT

The fixed-point format simplifies mathematical calculations and enhances processing efficiency.

Speed: 650 rpm

The high speed of 650 rpm ensures fast and responsive performance for a variety of applications.

Low Power Mode: YES

The low power mode feature helps in conserving energy and extending the battery life of devices.

Technical Specifications

Microprocessors STM32MP131AAF3 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B320

Length:

11 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

8

No. of Terminals:

320

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA320,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.2 mm

Speed:

650 rpm

Maximum Supply Current:

239 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

11 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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