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OSD3358-512M-IND

Octavo Systems

OSD3358-512M-IND by Octavo Systems

OSD3358-512M-IND by Octavo Systems is a microprocessor with 8-bit RAM and 28-bit address bus. It features a grid array package, operates in industrial temperature range (-40 to 85 °C), and has a supply voltage of 1.1V. Ideal for applications requiring high-speed processing in compact spaces.

Median Price

$111.688

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Nova Conductors

Japan . 400 parts In-Stock

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$111.688

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Vyrian

USA . 3,278 parts In-Stock

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Sensible Micro Corp

USA . 46 parts In-Stock

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AZTECH Wire

Italy . 262 parts In-Stock

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$10.124

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Aztec Data Supply Inc.

USA . 217 parts In-Stock

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$52.850

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Advanced Electronics

New Zealand . 54 parts In-Stock

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$81.455

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$74.939

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$70.220

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Continental Prestige Electronics

USA . 1,330 parts In-Stock

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$111.688

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Microchip USA

USA . 9,915 parts In-Stock

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Argo Parts USA

USA . 3,073 parts In-Stock

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Lucentia Tech

USA . 200 parts In-Stock

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Overview

Discover the power and efficiency of the OSD3358-512M-IND by Octavo Systems, a game-changer in the world of microprocessors. Crafted with precision and quality, this innovative product opens up a world of possibilities for various applications. Offering unparalleled value and benefits, this microprocessor boasts industrial-grade performance, reliability, and versatility. Elevate your projects to new heights with the OSD3358-512M-IND, where cutting-edge technology meets practical solutions for all your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the microprocessor.

Surface Mount: YES

Allows for easy installation on circuit boards without the need for through-holes.

On Chip Data RAM Width: 8

Provides fast data access and processing capabilities.

Address Bus Width: 28

Enables the microprocessor to access a large memory address space.

Package Shape: SQUARE

Allows for efficient use of space on the circuit board.

No. of Terminals: 400

Provides connectivity for various interfaces and peripherals.

Package Style (Meter): GRID ARRAY

Helps in efficient heat dissipation and solder joint reliability.

Maximum Operating Temperature: 85 °C

Can operate reliably in high-temperature environments.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold temperatures for reliable performance.

Terminal Position: BOTTOM

Facilitates easy mounting and connection on the PCB.

Maximum Seated Height: 2.6 mm

Low-profile design saves space in compact electronic devices.

RAM Words: 65536

Sufficient memory capacity for storing and processing data efficiently.

Width: 27 mm

Compact size allows for integration into small electronic devices.

Boundary Scan: YES

Allows for efficient testing and debugging of the microprocessor.

External Data Bus Width: 16

Enables fast data transfer between the microprocessor and external devices.

Peak Reflow Temperature °C: 245

Can withstand high-temperature reflow soldering processes during manufacturing.

Length: 27 mm

Compact form factor for easy integration into various electronic devices.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications that require reliable performance in harsh environments.

Peripheral IC Type: MICROPROCESSOR, RISC

Uses RISC architecture for efficient and streamlined data processing.

Technology: CMOS

Low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Facilitates soldering and connection to the PCB.

Maximum Supply Current: 2000 mA

Provides ample current for powering the microprocessor and connected devices.

Nominal Supply Voltage: 1.1 V

Operates efficiently at a low voltage for power savings.

Terminal Pitch: 1.27 mm

Allows for easy connection to the PCB with standard spacing.

Format: FIXED POINT

Suitable for applications that require fixed-point arithmetic operations.

Moisture Sensitivity Level (MSL): 4

Resistant to moisture and suitable for use in diverse environmental conditions.

Speed: 1000 rpm

Provides fast processing speed for handling complex tasks efficiently.

Technical Specifications

Microprocessors OSD3358-512M-IND attributes and parameters. Explore more Microprocessors devices from Octavo Systems

Specs

Additional Features:

64kbytes shared l3 ram also available

Address Bus Width:

28

Boundary Scan:

YES

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B400

Length:

27 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

4

No. of External Interrupts:

1

No. of Terminals:

400

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA400,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

RAM Words:

65536

Maximum Seated Height:

2.6 mm

Speed:

1000 rpm

Maximum Supply Current:

2000 mA

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

OSD3358-512M-IND Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Octavo Systems

Octavo Systems, LLC was founded by three former Texas Instruments senior leaders. It all started in 2013 over a discussion between two of the founders of how they could impact the semiconductor industry. They believed that Moore’s law, as it was interpreted was missing a major transition of which the semiconductor industry was in the midst. What they realized was that Moore’s Law was taking on a new interpretation, moving from the concept of integrating on silicon (SoC) to integrating with silicon (SiP). As we have grown, we have strengthened our team and built a world class organization. To improve the capability and value of our customers’ electronic systems by delivering innovative, high-quality System-in-Package solutions. Pursuit of our mission will bring new technologies and new integration paths to innovative companies around the globe. By creating SiP devices we are allowing the idea behind Moore’s law to continue as the industry transitions from System on Chip (SoC) as the system integration method to System in Package (SiP) technology as the solution of choice. Through our technology and design innovations we are making this technology more accessible to all, allowing for the continued development of smaller, more cost effective, and more innovative products. The transition to System in Package will provide system designers a host of advantages including: Quicker Time to Market Smaller Size Lower Total Cost of Ownership We want to make sure this new era of integration is available to everyone and we strive to do everything we can to make sure you achieve your mission. Everything from the design of our products, to our sales channel, to our support has been developed to make this technology accessible and to ensure your success.

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