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OSD3358-512M-BSM

Octavo Systems

OSD3358-512M-BSM by Octavo Systems

OSD3358-512M-BSM by Octavo Systems is a microprocessor with 256 terminals in a square grid array package. It operates b/w 0 to 85°C, with a supply voltage of 1.1V and max current of 2000mA. Ideal for RISC applications requiring high speed and fixed-point format.

Median Price

$58.380

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 74 parts In-Stock

1+ parts

$58.380

100+ parts

$48.340

1k+ parts

$48.340

10k+ parts

$48.340

74

$58.380

$48.340

$48.340

$48.340

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IBS Electronics

USA . 47,883 parts In-Stock

1+ parts

$57.351

100+ parts

$49.097

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47,883

$57.351

$49.097

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Nova Conductors

Japan . 60 parts In-Stock

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$60.181

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60

$60.181

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Inventory MP

USA . 21,812 parts In-Stock

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Bristol Electronics

USA . 5,645 parts In-Stock

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Vyrian

USA . 616 parts In-Stock

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616

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 4,756 parts In-Stock

1+ parts

$37.303

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4,756

$37.303

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$58.977

100+ parts

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$56.618

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$58.977

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$56.618

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Continental Prestige Electronics

USA . 34 parts In-Stock

1+ parts

$60.181

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$58.977

34

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$58.977

Microchip USA

USA . 9,125 parts In-Stock

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$62.170

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9,125

$62.170

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$86.140

100+ parts

$81.833

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$81.833

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2,000

$86.140

$81.833

$81.833

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Argo Parts USA

USA . 3,810 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Overview

Discover the OSD3358-512M-BSM by Octavo Systems, a cutting-edge microprocessor that delivers top-notch performance and reliability. With Octavo Systems' renowned reputation for high-quality products, this device is perfect for a wide range of applications in the technology industry. From robotics to IoT devices, this microprocessor offers unmatched value, benefits, and advantages to customers looking for a seamless and efficient solution. Upgrade your projects with the OSD3358-512M-BSM and experience the difference Octavo Systems brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that provides reliable protection for the microprocessor.

Surface Mount: YES

Ease of installation and soldering onto circuit boards.

No. of Terminals: 256

Sufficient number of terminals for a high-performance microprocessor.

Maximum Operating Temperature: 85 °C

Can operate efficiently within a wide range of temperatures.

Technology: CMOS

Low power consumption and high noise immunity for improved performance.

Maximum Supply Current: 2000 mA

Ability to handle high current loads for demanding applications.

Nominal Supply Voltage: 1.1 V

Efficient power usage at a low voltage.

Speed: 1000 rpm

Fast processing speed for quick data handling.

Technical Specifications

Microprocessors OSD3358-512M-BSM attributes and parameters. Explore more Microprocessors devices from Octavo Systems

Specs

Additional Features:

GPMC OF 28 BIT-ADDRESS LINES AND 16 BIT-DATA LINES AVAILABLE

Boundary Scan:

YES

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B256

Length:

21 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256, 16X16,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.08 mm

Speed:

1000 rpm

Maximum Supply Current:

2000 mA

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

21 mm

Peripheral IC Type:

Trade Compliance

OSD3358-512M-BSM Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Octavo Systems

Octavo Systems, LLC was founded by three former Texas Instruments senior leaders. It all started in 2013 over a discussion between two of the founders of how they could impact the semiconductor industry. They believed that Moore’s law, as it was interpreted was missing a major transition of which the semiconductor industry was in the midst. What they realized was that Moore’s Law was taking on a new interpretation, moving from the concept of integrating on silicon (SoC) to integrating with silicon (SiP). As we have grown, we have strengthened our team and built a world class organization. To improve the capability and value of our customers’ electronic systems by delivering innovative, high-quality System-in-Package solutions. Pursuit of our mission will bring new technologies and new integration paths to innovative companies around the globe. By creating SiP devices we are allowing the idea behind Moore’s law to continue as the industry transitions from System on Chip (SoC) as the system integration method to System in Package (SiP) technology as the solution of choice. Through our technology and design innovations we are making this technology more accessible to all, allowing for the continued development of smaller, more cost effective, and more innovative products. The transition to System in Package will provide system designers a host of advantages including: Quicker Time to Market Smaller Size Lower Total Cost of Ownership We want to make sure this new era of integration is available to everyone and we strive to do everything we can to make sure you achieve your mission. Everything from the design of our products, to our sales channel, to our support has been developed to make this technology accessible and to ensure your success.

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