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AM3894CCYG135

Texas Instruments

AM3894CCYG135 by Texas Instruments

The Texas Instruments AM3894CCYG135 is a 32-bit microprocessor with integrated cache and 8-bit on-chip data RAM. It features a max clock frequency of 27 MHz, suitable for applications requiring high-speed processing. With a package style of grid array, fine pitch, it is ideal for use in devices where compact size and efficient performance are essential.

Median Price

$83.310

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 170 parts In-Stock

1+ parts

$83.310

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-

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170

$83.310

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,798 parts In-Stock

1+ parts

$79.144

100+ parts

-

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4,798

$79.144

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Nova Conductors

Japan . 27 parts In-Stock

1+ parts

$107.487

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27

$107.487

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Vyrian

USA . 6,218 parts In-Stock

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6,218

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VNN

France . 4,613 parts In-Stock

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4,613

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 551 parts In-Stock

1+ parts

$9.765

100+ parts

-

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551

$9.765

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$18.308

100+ parts

$17.393

1k+ parts

$17.393

10k+ parts

-

2,500

$18.308

$17.393

$17.393

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Parana Technologies

USA . 1,500 parts In-Stock

1+ parts

$30.224

100+ parts

-

1k+ parts

$68.540

10k+ parts

-

1,500

$30.224

-

$68.540

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DigiPath Technology Company

USA . 1,812 parts In-Stock

1+ parts

$33.281

100+ parts

$30.618

1k+ parts

-

10k+ parts

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1,812

$33.281

$30.618

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ChromeModa Solutions

Germany . 6,651 parts In-Stock

1+ parts

$33.960

100+ parts

$27.847

1k+ parts

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6,651

$33.960

$27.847

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IDEA Electronic Components Group

UK . 2,313 parts In-Stock

1+ parts

$33.960

100+ parts

$32.262

1k+ parts

$30.564

10k+ parts

-

2,313

$33.960

$32.262

$30.564

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Corohmni

South Africa . 116 parts In-Stock

1+ parts

$49.902

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116

$49.902

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Ampacity Inc.

Singapore . 170 parts In-Stock

1+ parts

$70.810

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170

$70.810

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Corphita

USA . 722 parts In-Stock

1+ parts

$74.979

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722

$74.979

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Continental Prestige Electronics

USA . 137 parts In-Stock

1+ parts

$98.530

100+ parts

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10k+ parts

$96.559

137

$98.530

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$96.559

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$107.487

100+ parts

-

1k+ parts

$102.112

10k+ parts

$99.963

1,000

$107.487

-

$102.112

$99.963

Microchip USA

USA . 2,712 parts In-Stock

1+ parts

$151.420

100+ parts

$148.790

1k+ parts

$147.470

10k+ parts

$146.160

2,712

$151.420

$148.790

$147.470

$146.160

Semicontronic

India . 170 parts In-Stock

1+ parts

$154.120

100+ parts

$150.267

1k+ parts

$149.496

10k+ parts

-

170

$154.120

$150.267

$149.496

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QUARKTWIN TECHNOLOGY LTD

USA . 10,841 parts In-Stock

1+ parts

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10,841

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Argo Parts USA

USA . 1,957 parts In-Stock

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1,957

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Overview

Experience unparalleled performance with the AM3894CCYG135 by Texas Instruments, a top-tier microprocessor that delivers exceptional quality and reliability. Crafted using cutting-edge technology, this processor is ideal for a wide range of applications in various industries. From seamless multitasking to lightning-fast data processing, this product offers unmatched value and efficiency to customers. Trust in Texas Instruments' reputation for excellence and elevate your projects with the AM3894CCYG135 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microprocessor lightweight and durable, ideal for portable electronic devices.

Integrated Cache: YES

With integrated cache, this microprocessor can access frequently used data quickly, improving overall performance and efficiency.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.05 V

Operating at a maximum supply voltage of 1.05V helps in reducing power consumption and heat generation, promoting energy efficiency.

On Chip Data RAM Width: 8

With a data RAM width of 8, this microprocessor can efficiently handle and process data in smaller chunks, enhancing its speed and performance.

Address Bus Width: 28

A wide address bus width of 28 enables this microprocessor to access a large memory space, making it suitable for handling complex tasks.

Package Shape: SQUARE

The square package shape provides stability and ease of mounting, ensuring a secure placement within electronic devices.

Bit Size: 32

With a bit size of 32, this microprocessor can process data in larger chunks, resulting in faster execution of instructions.

No. of Terminals: 1031

Having a high number of terminals allows for efficient connectivity and communication with other components, enhancing the microprocessor's functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style offers high density and precision in mounting, making it suitable for compact electronic devices.

Minimum Supply Voltage: 0.95 V

Operating at a low minimum supply voltage of 0.95V helps in reducing power consumption and extending the battery life of devices.

Maximum Operating Temperature: 95 °C

With a high maximum operating temperature of 95°C, this microprocessor can perform reliably even in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

Operating at a low minimum temperature of 0°C ensures that this microprocessor can function efficiently in various temperature settings.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: BOTTOM

With terminals positioned at the bottom, this microprocessor can be easily mounted on circuit boards for secure and stable integration.

Maximum Seated Height: 3.31 mm

The maximum seated height of 3.31mm allows for a compact design, making this microprocessor suitable for slim electronic devices.

RAM Words: 65536

With a high number of RAM words, this microprocessor can store and process a large amount of data simultaneously, enhancing its performance capabilities.

Width: 25 mm

The width of 25mm makes this microprocessor compact and space-efficient, ideal for integration into small electronic devices.

Boundary Scan: YES

Featuring boundary scan technology enables easy testing and debugging of the microprocessor's connections, ensuring reliability and quality.

External Data Bus Width: 16

With an external data bus width of 16, this microprocessor can efficiently transfer data to and from external devices, improving overall performance.

Maximum Clock Frequency: 27 MHz

Operating at a high maximum clock frequency of 27MHz allows this microprocessor to execute instructions quickly, enhancing its processing speed.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering during manufacturing, improving the reliability of the microprocessor.

Peak Reflow Temperature °C: 245

With a peak reflow temperature of 245°C, this microprocessor can withstand high-temperature soldering processes, ensuring secure connections.

Length: 25 mm

The length of 25mm makes this microprocessor compact and versatile, suitable for various electronic applications.

Peripheral IC Type: MICROPROCESSOR, RISC

This microprocessor, with a RISC architecture, is optimized for efficient and fast data processing, making it an excellent choice for high-performance devices.

Technology: CMOS

Utilizing CMOS technology, this microprocessor offers low power consumption and high-speed operation, making it energy-efficient and reliable.

Terminal Form: BALL

With terminals in a ball form, this microprocessor offers reliable connections and durability, ensuring long-term performance.

Nominal Supply Voltage: 1 V

Operating at a nominal supply voltage of 1V ensures stable and efficient power consumption, enhancing the overall performance of the microprocessor.

No. of DMA Channels: 72

Having a high number of DMA channels enables efficient data transfer and processing, making this microprocessor suitable for handling multiple tasks simultaneously.

Terminal Pitch: 0.65 mm

The terminal pitch of 0.65mm provides precise and compact connections, ensuring reliable performance and compatibility.

Format: FLOATING POINT

With a floating-point format, this microprocessor can perform complex mathematical calculations with high precision and accuracy, making it ideal for scientific and computational applications.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 indicates that this microprocessor has a robust design, ensuring reliability and performance in humid environments.

Speed: 1200 rpm

The speed of 1200 rpm enables this microprocessor to execute tasks quickly and efficiently, making it suitable for high-performance electronic devices.

Low Power Mode: YES

This microprocessor features a low power mode, enabling energy-saving operation and extended battery life in portable devices.

Technical Specifications

Microprocessors AM3894CCYG135 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1031

JESD-609 Code:

e1

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

72

No. of Terminals:

On Chip Data RAM Width:

8

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA1031,37X37,25

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

3.31 mm

Speed:

1200 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

25 mm

Peripheral IC Type:

Trade Compliance

AM3894CCYG135 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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