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AM3871BCYEA80

Texas Instruments

AM3871BCYEA80 by Texas Instruments

AM3871BCYEA80 by Texas Instruments is a 32-bit microprocessor with integrated cache, 16-bit address bus, and max clock frequency of 30 MHz. It is used in applications requiring low power mode, such as peripheral ICs and floating point operations.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

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Digiode

USA . 1,346 parts In-Stock

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AZTECH Wire

Italy . 371 parts In-Stock

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$7.891

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Semicontronic

India . 889 parts In-Stock

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$23.000

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$22.425

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One Stop Electronics

USA . 765 parts In-Stock

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$25.000

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Ampacity Inc.

Singapore . 933 parts In-Stock

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Parana Technologies

USA . 1,403 parts In-Stock

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DigiPath Technology Company

USA . 1,212 parts In-Stock

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IDEA Electronic Components Group

UK . 2,313 parts In-Stock

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$49.219

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ChromeModa Solutions

Germany . 915 parts In-Stock

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Northwest PG Solutions

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Corphita

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Native Components

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Corohmni

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Overview

Experience the power and precision of Texas Instruments with the AM3871BCYEA80 Microprocessor. This top-of-the-line product boasts integrated cache, advanced CMOS technology, and a maximum clock frequency of 30 MHz, making it ideal for a wide range of applications. With a terminal pitch of 0.8 mm and low power mode capabilities, this microprocessor offers exceptional value and performance to customers looking to elevate their projects to the next level. Trust in Texas Instruments for quality and reliability that you can depend on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, ensuring a longer lifespan for the product.

Integrated Cache: YES

Integrated cache helps improve processing speed and efficiency, making this microprocessor a high-performance option.

Maximum Supply Voltage: 1.42 V

With a higher maximum supply voltage, this microprocessor can handle more power, allowing for better performance in demanding tasks.

Address Bus Width: 16

A wider address bus allows for more efficient communication between components, enhancing overall system speed.

Package Shape: SQUARE

The square package shape helps with heat dissipation and makes it easier to mount the microprocessor onto a motherboard.

Bit Size: 32

A larger bit size allows for more data processing capabilities, making this microprocessor suitable for complex computing tasks.

Power Supplies (V): 0.95/1.35

Having multiple power supply options gives flexibility in power consumption, making this microprocessor energy efficient.

No. of Terminals: 684

The large number of terminals enable the microprocessor to connect to various components, enhancing compatibility and functionality.

Terminal Position: BOTTOM

Bottom terminal position makes it easy to install and connect the microprocessor within a system.

Maximum Seated Height: 3.06 mm

With a relatively low seated height, this microprocessor can fit into compact devices without compromising performance.

Width: 23 mm

The compact width of the microprocessor allows for space-efficient integration into devices, making it a versatile choice for various applications.

Boundary Scan: YES

Boundary scan capability helps with testing and debugging, ensuring reliability and quality in the microprocessor's performance.

External Data Bus Width: 16

A wider data bus facilitates faster data transfer, boosting overall system efficiency and speed.

Maximum Clock Frequency: 30 MHz

With a high clock frequency, this microprocessor can process data at a rapid pace, making it suitable for tasks that require quick computations.

Length: 23 mm

The compact length of the microprocessor contributes to its overall small form factor, enabling easy integration into various devices.

Peripheral IC Type: MICROPROCESSOR

Designed specifically as a microprocessor, this product offers optimized performance for computing tasks, making it a reliable choice for processing needs.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed processing, making this microprocessor energy efficient and high performing.

Nominal Supply Voltage: 1.35 V

With a stable nominal supply voltage, this microprocessor maintains consistent performance while ensuring energy efficiency.

Terminal Pitch: 0.8 mm

A narrow terminal pitch allows for more terminals in a compact space, maximizing connectivity options and integration flexibility.

Format: FLOATING POINT

Floating-point format enables precise mathematical computations, making this microprocessor suitable for tasks requiring high accuracy in calculations.

Speed: 800 rpm

With a high speed rating, this microprocessor can quickly process data, enhancing the overall performance of devices it is integrated into.

Low Power Mode: YES

The low power mode option increases energy efficiency, making this microprocessor a suitable choice for devices that require power-saving features.

Technical Specifications

Microprocessors AM3871BCYEA80 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B684

Length:

23 mm

Low Power Mode:

YES

No. of Terminals:

684

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA684,28X28,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

0.95/1.35

Qualification:

Not Qualified

Maximum Seated Height:

3.06 mm

Speed:

800 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.42 V

Minimum Supply Voltage:

1.28 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM3871BCYEA80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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