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MC8640DTVJ1250HE

NXP Semiconductors

MC8640DTVJ1250HE by NXP Semiconductors

MC8640DTVJ1250HE by NXP Semiconductors is a 32-bit microprocessor with integrated cache, operating at a max frequency of 166.66 MHz. Ideal for industrial applications, it features a ceramic package body, boundary scan capability, and supports floating-point format computations.

Median Price

$2,464.000

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,000 parts In-Stock

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USA . 2,000 parts In-Stock

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Verical

USA . 1,680 parts In-Stock

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$2,464.000

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1,680

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$2,464.000

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Distributors (In-Stock)

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Flip Electronics

USA . 3,000 parts In-Stock

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Digiode

USA . 1,976 parts In-Stock

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Vyrian

USA . 1,817 parts In-Stock

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Anansix

USA . 679 parts In-Stock

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Chip Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 2,772 parts In-Stock

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$20.500

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Corohmni

South Africa . 483 parts In-Stock

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$77.493

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483

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Microchip USA

USA . 245 parts In-Stock

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$1,241.481

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One Stop Electronics

USA . 1,640 parts In-Stock

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$1,536.800

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Ampacity Inc.

Singapore . 1,522 parts In-Stock

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Lixinc

USA . 16,467 parts In-Stock

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UNI Independent Distributors

Spain . 8,139 parts In-Stock

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Corphita

USA . 1,416 parts In-Stock

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Argo Parts USA

USA . 885 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Continental Prestige Electronics

USA . 151 parts In-Stock

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GreenTree Electronics

Israel . 120 parts In-Stock

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Overview

Unlock unparalleled performance and efficiency with the MC8640DTVJ1250HE by NXP Semiconductors. Designed with cutting-edge technology, this microprocessor boasts integrated cache and a maximum clock frequency of 166.66 MHz, making it ideal for industrial applications where speed and reliability are paramount. With a durable ceramic package body material and advanced RISC technology, this processor delivers unmatched value and benefits to customers seeking top-notch performance and quality. Experience the next level of computing power with the MC8640DTVJ1250HE.

Feature Benefit Bullets

Package Body Material: CERAMIC

The ceramic body material provides excellent thermal conductivity and durability, making this microprocessor suitable for high-performance applications.

Integrated Cache: YES

The integrated cache allows for faster access to frequently used data, improving overall processing speed and efficiency.

Surface Mount: YES

The surface mount design simplifies the installation process and saves valuable space on the PCB, making this microprocessor ideal for compact systems.

Maximum Supply Voltage: 1.1 V

The low maximum supply voltage helps reduce power consumption and heat dissipation, contributing to energy efficiency and prolonged product lifespan.

Address Bus Width: 32

The 32-bit address bus width allows for efficient memory addressing and data retrieval, enhancing the microprocessor's performance capabilities.

Package Shape: SQUARE

The square package shape facilitates easy mounting and alignment on the PCB, ensuring a secure and stable connection for reliable operation.

Bit Size: 32

The 32-bit architecture provides enhanced processing power and compatibility with a wide range of software applications, making this microprocessor a versatile choice.

No. of Terminals: 1023

The high number of terminals allows for increased connectivity options and peripherals, expanding the functionality of the microprocessor for diverse applications.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The grid array style with a heat sink/slug option enables efficient heat dissipation and thermal management, ensuring optimal performance under high workload conditions.

Technical Specifications

Microprocessors MC8640DTVJ1250HE attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

166.66 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-CBGA-B1023

JESD-609 Code:

e2

Length:

33 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of Terminals:

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

BGA1023,32X32,40

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Maximum Seated Height:

2.77 mm

Speed:

1250 rpm

Maximum Supply Voltage:

1.1 V

Minimum Supply Voltage:

1 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

33 mm

Peripheral IC Type:

Trade Compliance

MC8640DTVJ1250HE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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