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MC8610TPX1066JB

NXP Semiconductors

MC8610TPX1066JB by NXP Semiconductors

Microprocessors; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 783; Package Code: BGA; Package Shape: SQUARE;

Median Price

$500.000

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

MC8610TPX1066JB by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1 parts In-Stock

1+ parts

$500.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$500.000

-

-

-

Flip Electronics (Authorized)

USA . 1,746 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,746

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,687 parts In-Stock

1+ parts

$475.000

100+ parts

-

1k+ parts

-

10k+ parts

-

4,687

$475.000

-

-

-

Vyrian

USA . 2,649 parts In-Stock

1+ parts

$500.000

100+ parts

-

1k+ parts

-

10k+ parts

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2,649

$500.000

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-

-

Anansix

USA . 2,369 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,369

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-

-

-

Flip Electronics

USA . 1,746 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,746

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,877 parts In-Stock

1+ parts

$450.000

100+ parts

-

1k+ parts

-

10k+ parts

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2,877

$450.000

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Microchip USA

USA . 240 parts In-Stock

1+ parts

$827.416

100+ parts

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1k+ parts

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10k+ parts

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240

$827.416

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,000

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-

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UNI Independent Distributors

Spain . 2,492 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,492

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Technical Specifications

Microprocessors MC8610TPX1066JB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B783

JESD-609 Code:

e0

Length:

29 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

783

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

2.7 mm

Speed:

1066 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

29 mm

Trade Compliance

MC8610TPX1066JB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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