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MC8641DVJ1333JE

NXP Semiconductors

MC8641DVJ1333JE by NXP Semiconductors

MC8641DVJ1333JE by NXP Semiconductors is a 32-bit RISC microprocessor with integrated cache, 64-bit external data bus width, and operates at a speed of 1333 rpm. It is designed for low power mode applications in microprocessors, featuring boundary scan capability and ceramic-metal sealed co-fired package body material.

Median Price

$722.913

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

MC8641DVJ1333JE by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 20 parts In-Stock

1+ parts

$577.400

100+ parts

$542.760

1k+ parts

$508.110

10k+ parts

-

20

$577.400

$542.760

$508.110

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Arrow

USA . 20 parts In-Stock

1+ parts

$722.913

100+ parts

$695.589

1k+ parts

$688.643

10k+ parts

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20

$722.913

$695.589

$688.643

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Flip Electronics (Authorized)

USA . 8,853 parts In-Stock

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8,853

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Verical

USA . 1,250 parts In-Stock

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$1,232.756

1,250

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$1,232.756

Distributors (In-Stock)

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Digiode

USA . 2,185 parts In-Stock

1+ parts

$636.899

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2,185

$636.899

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Vyrian

USA . 906 parts In-Stock

1+ parts

$670.420

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906

$670.420

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Flip Electronics

USA . 8,973 parts In-Stock

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Anansix

USA . 1,464 parts In-Stock

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1,464

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Sensible Micro Corp

USA . 696 parts In-Stock

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696

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Chip Stock

USA . 149 parts In-Stock

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149

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Nova Conductors

Japan . 16 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 245 parts In-Stock

1+ parts

$68.605

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245

$68.605

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Ampacity Inc.

Singapore . 2,143 parts In-Stock

1+ parts

$569.860

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2,143

$569.860

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Corphita

USA . 4,513 parts In-Stock

1+ parts

$603.378

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4,513

$603.378

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Microchip USA

USA . 1,344 parts In-Stock

1+ parts

$820.286

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$820.286

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Continental Prestige Electronics

USA . 2,388 parts In-Stock

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Argo Parts USA

USA . 2,121 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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UNI Independent Distributors

Spain . 1,695 parts In-Stock

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1,695

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Perfect Parts

USA . 81 parts In-Stock

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81

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Netroflash

USA . 50 parts In-Stock

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50

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Overview

Unleash the power of cutting-edge technology with the MC8641DVJ1333JE by NXP Semiconductors. This high-quality microprocessor offers unparalleled performance and reliability, making it ideal for a wide range of applications. With integrated cache and low power mode, this product delivers exceptional speed and efficiency. Trust in NXP Semiconductors' expertise in semiconductor manufacturing to provide you with a top-of-the-line product that exceeds your expectations. Upgrade your systems today and experience the superior value and benefits that the MC8641DVJ1333JE has to offer.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired body material provides excellent heat dissipation and durability, ensuring reliable performance even under high temperatures.

Integrated Cache: YES

Having integrated cache improves the overall performance of the microprocessor by reducing the access time to frequently used data and instructions.

Maximum Supply Voltage: 1.1 V

Operating at a low maximum supply voltage of 1.1V helps in reducing power consumption and heat generation, making it energy-efficient.

Address Bus Width: 16

With a wider address bus width of 16, the microprocessor can handle larger memory address spaces effectively, enhancing its processing capabilities.

Bit Size: 32

The 32-bit architecture allows the microprocessor to handle larger chunks of data at a time, improving efficiency in computing tasks.

No. of Terminals: 1023

Having a high number of terminals allows for more connections and data transfer channels, enhancing the overall functionality of the microprocessor.

Minimum Supply Voltage: 1 V

Operating at a low minimum supply voltage of 1V ensures power efficiency and helps in prolonging the lifespan of the microprocessor.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C allows the microprocessor to function reliably under varying environmental conditions.

Terminal Finish: TIN SILVER

The tin silver terminal finish provides good conductivity and corrosion resistance, ensuring stable connections for optimal performance.

External Data Bus Width: 64

A wider external data bus width of 64 allows for faster data transfer rates between the microprocessor and other components, improving overall system efficiency.

Technical Specifications

Microprocessors MC8641DVJ1333JE attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-CBGA-B1023

JESD-609 Code:

e2

Length:

33 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

2.77 mm

Speed:

1333 rpm

Maximum Supply Voltage:

1.1 V

Minimum Supply Voltage:

1 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

33 mm

Peripheral IC Type:

Trade Compliance

MC8641DVJ1333JE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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