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LS1046ASE8Q1A

NXP Semiconductors

LS1046ASE8Q1A by NXP Semiconductors

LS1046ASE8Q1A by NXP Semiconductors is a microprocessor with a package shape of square and 780 terminals. It has a max seated height of 2.07 mm and operates at a speed of 64 rpm. This processor is commonly used in various applications requiring high-performance computing.

Median Price

$118.068

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 120 parts In-Stock

1+ parts

$131.000

100+ parts

$84.800

1k+ parts

$77.300

10k+ parts

-

120

$131.000

$84.800

$77.300

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Mouser Electronics

USA . 32 parts In-Stock

1+ parts

$150.690

100+ parts

$116.410

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-

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32

$150.690

$116.410

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-

Verical

USA . 9,960 parts In-Stock

1+ parts

-

100+ parts

$105.136

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9,960

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$105.136

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Rochester

USA . 42 parts In-Stock

1+ parts

-

100+ parts

$92.000

1k+ parts

$82.310

10k+ parts

$77.470

42

-

$92.000

$82.310

$77.470

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,885 parts In-Stock

1+ parts

$97.109

100+ parts

-

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-

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1,885

$97.109

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-

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DigiKey Marketplace

USA . 55 parts In-Stock

1+ parts

$118.120

100+ parts

-

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55

$118.120

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$122.168

100+ parts

-

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10

$122.168

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-

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Flip Electronics

USA . 5,760 parts In-Stock

1+ parts

-

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5,760

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-

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Vyrian

USA . 2,798 parts In-Stock

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2,798

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Anansix

USA . 1,669 parts In-Stock

1+ parts

-

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1,669

-

-

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Cyclops Electronics Ltd

UK . 300 parts In-Stock

1+ parts

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 679 parts In-Stock

1+ parts

$16.679

100+ parts

-

1k+ parts

-

10k+ parts

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679

$16.679

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-

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Corohmni

South Africa . 1,249 parts In-Stock

1+ parts

$77.402

100+ parts

-

1k+ parts

-

10k+ parts

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1,249

$77.402

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Aztec Data Supply Inc.

USA . 329 parts In-Stock

1+ parts

$83.680

100+ parts

-

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329

$83.680

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Ampacity Inc.

Singapore . 321 parts In-Stock

1+ parts

$86.890

100+ parts

-

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321

$86.890

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Semicontronic

India . 81 parts In-Stock

1+ parts

$86.890

100+ parts

$84.718

1k+ parts

$84.283

10k+ parts

-

81

$86.890

$84.718

$84.283

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Corphita

USA . 687 parts In-Stock

1+ parts

$91.998

100+ parts

-

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687

$91.998

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Continental Prestige Electronics

USA . 249 parts In-Stock

1+ parts

$122.168

100+ parts

-

1k+ parts

-

10k+ parts

$119.725

249

$122.168

-

-

$119.725

Bastille Electronics

Australia . 10 parts In-Stock

1+ parts

$122.200

100+ parts

$116.090

1k+ parts

-

10k+ parts

$108.758

10

$122.200

$116.090

-

$108.758

Vigor

Singapore . 3,587 parts In-Stock

1+ parts

$146.660

100+ parts

-

1k+ parts

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10k+ parts

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3,587

$146.660

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Microchip USA

USA . 2,692 parts In-Stock

1+ parts

$163.530

100+ parts

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2,692

$163.530

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UNI Independent Distributors

Spain . 5,361 parts In-Stock

1+ parts

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5,361

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Argo Parts USA

USA . 1,684 parts In-Stock

1+ parts

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100+ parts

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1,684

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Overview

Discover the LS1046ASE8Q1A by NXP Semiconductors, a high-quality microprocessor that offers unparalleled performance and reliability. With its state-of-the-art technology and advanced features, this product delivers exceptional value to customers in various applications. Whether you're designing cutting-edge consumer electronics or next-generation industrial equipment, the LS1046ASE8Q1A is your go-to solution. Benefit from its efficient design, robust functionality, and seamless integration. Experience the advantages of NXP Semiconductors' expertise and stay ahead of the competition. Upgrade your projects today with the LS1046ASE8Q1A and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, suitable for portable devices and industries where ruggedness is essential.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly processes, saving time and reducing manufacturing costs.

Package Shape: SQUARE

The square package shape makes it easy to handle, store, and integrate into circuit designs, optimizing space utilization.

No. of Terminals: 780

With a large number of terminals, this product can support complex connectivity requirements and functionalities, making it versatile for a wide range of applications.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The grid array package style with heat sink/slug ensures efficient heat dissipation, maintaining optimal performance and reliability under high processing loads.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high speed, and compatibility with a wide range of devices, making the product energy-efficient and versatile.

Technical Specifications

Microprocessors LS1046ASE8Q1A attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B780

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

780

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.07 mm

Speed:

64 rpm

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

LS1046ASE8Q1A Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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