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LS1020ASN7HNB

NXP Semiconductors

LS1020ASN7HNB by NXP Semiconductors

LS1020ASN7HNB by NXP Semiconductors is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 133.3 MHz. It features a CMOS technology, 16-bit address bus width, and low power mode, suitable for applications requiring high-speed processing in compact devices.

Median Price

$19.515

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 1 parts In-Stock

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$15.530

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Verical

USA . 186 parts In-Stock

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DigiKey

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Flip Electronics (Authorized)

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Digiode

USA . 1,661 parts In-Stock

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$30.096

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Vyrian

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Nova Conductors

Japan . 750 parts In-Stock

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Anansix

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Semicontronic

India . 122 parts In-Stock

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$23.420

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$22.834

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$22.717

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Ampacity Inc.

Singapore . 30 parts In-Stock

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Corphita

USA . 4,276 parts In-Stock

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Corohmni

South Africa . 988 parts In-Stock

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Vigor

Singapore . 6,688 parts In-Stock

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Microchip USA

USA . 1,534 parts In-Stock

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UNI Independent Distributors

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Authorized Procurement Solutions

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Netroflash

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Overview

Experience unparalleled performance and efficiency with the LS1020ASN7HNB by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-quality microprocessors that are versatile and reliable. Ideal for a wide range of applications, this product offers customers exceptional value and benefits. With integrated cache and advanced technology, the LS1020ASN7HNB ensures seamless operation and optimal functionality. Upgrade your devices with this cutting-edge solution and elevate your user experience to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body is lightweight and durable, making the product easy to handle and resistant to damage.

Integrated Cache: YES

Having integrated cache improves the processing speed and efficiency of the microprocessor by reducing the need to access external memory for frequently used data.

Maximum Clock Frequency: 133.3 MHz

The high maximum clock frequency allows for faster data processing and improved overall performance of the microprocessor.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy efficient and reliable.

Technical Specifications

Microprocessors LS1020ASN7HNB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

133.3 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B525

JESD-609 Code:

e1

Length:

19 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

525

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.07 mm

Speed:

800 rpm

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Peripheral IC Type:

Trade Compliance

LS1020ASN7HNB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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