Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
LS1043ASE8PQB by NXP Semiconductors is a 64-bit microprocessor with integrated cache, 32-bit external data bus width, and low power mode. It is used in System on Chip (SoC) applications for high-speed processing at temperatures up to 105°C.
Median Price
$84.915
Lifecycle Status
Suppliers In-Stock
8
In-Stock Inventory
1k+
Rochester
1+ parts
-
100+ parts
$75.480
1k+ parts
$67.530
10k+ parts
$63.560
DigiKey
Verical
$94.350
$84.412
$79.450
Digiode
$66.386
Anansix
Vyrian
Nova Conductors
Flip Electronics
Corohmni
$17.803
Ampacity Inc.
$59.400
Corphita
$62.892
Vigor
$100.265
Microchip USA
$171.442
Argo Parts USA
UNI Independent Distributors
Authorized Procurement Solutions
Continental Prestige Electronics
Netroflash
The plastic/epoxy material used for the package body provides durability and helps in protecting the microprocessor from external damage.
The integrated cache improves the performance of the microprocessor by reducing the access time to frequently used data.
Being surface mountable makes it easy to integrate the microprocessor onto a circuit board, saving space and improving overall efficiency.
The low maximum supply voltage helps in reducing power consumption and heat generation in the system.
The wide address bus width of 14 allows for efficient memory addressing and data transfer within the system.
The square package shape provides a compact design, making it suitable for space-constrained applications.
The 64-bit size enables the microprocessor to handle large amounts of data and perform complex calculations efficiently.
With a high number of terminals, the microprocessor can support multiple connections for enhanced functionality and performance.
The grid array with fine pitch design offers better signal integrity and thermal performance, making it suitable for high-speed applications.
The low minimum supply voltage ensures stable operation and efficient power management in the system.
The high maximum operating temperature allows the microprocessor to operate reliably in harsh environments without overheating.
The low minimum operating temperature ensures that the microprocessor can function even in cold conditions without any issues.
The terminal finish of tin, silver, and copper provides good conductivity and corrosion resistance, enhancing the longevity of the microprocessor.
The bottom terminal position simplifies the installation and connectivity of the microprocessor within the system.
The low maximum seated height allows for a slim and compact form factor, ideal for applications with space constraints.
The width of 23 mm provides a balance between compact size and functionality, making it suitable for diverse applications.
The presence of boundary scan capability allows for efficient testing and debugging of the microprocessor during the manufacturing process.
The wide external data bus width of 32 facilitates fast data transfer between the microprocessor and external devices, enhancing overall performance.
The short maximum time at peak reflow temperature ensures quick and reliable soldering of the microprocessor onto the circuit board.
The high peak reflow temperature capability enables the microprocessor to withstand the soldering process without any damage.
The length of 23 mm complements the overall compact design of the microprocessor, making it suitable for various applications.
The System-on-Chip (SoC) architecture integrates multiple peripheral components onto a single chip, reducing the overall system complexity and cost.
The CMOS technology used in the microprocessor offers low power consumption, high speed, and reliable performance, making it ideal for modern electronic devices.
The ball terminal form provides reliable connections and ease of soldering during the installation process.
The nominal supply voltage of 0.9 V ensures stable and efficient operation of the microprocessor across varying load conditions.
The small terminal pitch of 0.8 mm offers high density packaging, enabling more terminals in a compact space for increased functionality.
The fixed-point format allows the microprocessor to perform arithmetic operations with fixed precision, suitable for applications requiring predictable and consistent results.
The MSL rating of 3 indicates moderate sensitivity to moisture, requiring proper handling and storage to prevent damage during reflow soldering.
The high speed of 1400 rpm enables the microprocessor to process data quickly and efficiently, enhancing overall system performance.
The low power mode feature allows the microprocessor to operate in a power-efficient state when high performance is not required, extending battery life in portable devices.
Microprocessors LS1043ASE8PQB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Additional Features:
Address Bus Width:
Bit Size:
Boundary Scan:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
LS1043ASE8PQB Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A002.A.1
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Design/Specification - LS1043A 17/Jun/2021
PCN Assembly/Origin - COO/Label 15-apr-2022
PCN Packaging - All Dev Label Update 15/Dec/2020 Mult Dev Pkg Seal 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
2N2222A
Onsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
BAV99
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Microchip Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum Operating Temperature: -65 Cel; Terminal Position: BOTTOM;
SN6505BDBVR
Texas Instruments
SN6505BDBVR by Texas Instruments is a small outline, low profile interface IC with 6 terminals. It operates b/w -55 to 125°C and supports a max output current of 1.5A at supply voltages ranging from 2.25V to 5.5V. Ideal for military-grade applications requiring compact design and high reliability.
2N7002
Itt Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Package Shape: RECTANGULAR;
BSS138
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (ID): .22 A; Package Shape: RECTANGULAR;
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
Hi-tron Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
Vicor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Pro-an Electronic
FDLL4148
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
DS18B20
Maxim Integrated
DS18B20 by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Commonly used in applications requiring precise temperature monitoring like HVAC systems and industrial automation.
SMBJ18CA
Semitron
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358MX
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
New England Semiconductor
CC0603KRX7R9BB104
Yageo
Yageo's CC0603KRX7R9BB104 is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. With X7R temperature characteristics, it operates b/w -55 to 125°C. Ideal for surface mount applications in electronics due to its compact size of 1.6mm x 0.8mm x 0.8mm and wraparound terminals.
National Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .5 A;
BAV99WT1G
Central Semiconductor
1N4148WS
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ADSP-21488KSWZ-4B1
Analog Devices
ADSP-21488KSWZ-4B1 by Analog Devices is a 40-bit microprocessor with 24-bit address bus width and 16-bit external data bus width. It operates at a max clock frequency of 25 MHz, making it suitable for applications requiring high-speed processing in commercial temperature environments. The package style includes flatpack, heat sink/slug, low profile, and fine pitch options for versatile integration.
MPC860TVR66D4
Freescale Semiconductor
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA357,19X19,50;
MPC8280CZUQLDA
NXP Semiconductors
NXP Semiconductors' MPC8280CZUQLDA is a 32-bit microprocessor with integrated cache, suitable for industrial applications. It operates at speeds up to 333 rpm and supports low power mode. With a max supply voltage of 1.6 V, it features an external data bus width of 64 bits and boundary scan capability.
N80C186XL20
Intel
MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 68; Package Code: QCCJ; Package Shape: SQUARE;
P1010NSE5HHA
The NXP Semiconductors P1010NSE5HHA microprocessor features 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for applications requiring a high-speed RISC processor with boundary scan capability. Operating temperature range from 0 to 105°C makes it suitable for various industrial environments.
STM32MP153AAB3T
STMicroelectronics
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
MCF54417CMJ250
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
21281-DB
The Intel 21281-DB microprocessor features a 32-bit address bus width, integrated cache, and operates at a max clock frequency of 3.68 MHz. It is commonly used in commercial applications requiring low power consumption and high processing speeds.
MICROPROCESSOR, RISC; No. of Terminals: 425; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: BGA425,23X23,32; Peak Reflow Temperature (C): 260; Surface Mount: YES;
MCIMX6S6AVM08AB
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE;
ADSP-21489BSWZ-4B
Analog Devices' ADSP-21489BSWZ-4B microprocessor features 40-bit architecture, 24-bit address bus width, and 16-bit external data bus. Ideal for industrial applications, it operates at up to 25 MHz clock frequency with a supply voltage range of 1.05V to 1.15V.
MIMXRT1166XVM5A
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
MCIMX6U8DVM10AB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE; External Data Bus Width: 64;
TA80960KB-16
Intel's TA80960KB-16 microprocessor features 32-bit address and external data bus width, with a max clock frequency of 32 MHz. Ideal for automotive applications, it operates b/w -40 to 125 °C, with a power supply range of 4.5-5.5 V and a max supply current of 315 mA.
I7-3770
MICROPROCESSOR; Technology: CMOS;
AM3505AZCNAC
AM3505AZCNAC by Texas Instruments is a 16-bit microprocessor with integrated cache, 8-bit RAM width, and 16-bit address bus. It operates at a max clock frequency of 26 MHz and is suitable for industrial applications requiring low power mode and floating point format.
AM3358BZCZ60
AM3358BZCZ60 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for low power applications like IoT devices due to its low supply voltage range of 0.95-1.1 V and boundary scan feature.
AM3352BZCED60
AM3352BZCED60 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 64 DMA channels, and 26 MHz clock frequency. Ideal for industrial applications requiring low power mode, it features a max operating temperature of 90°C and boundary scan capability.
FH8065301567313SR1X9
The Intel FH8065301567313SR1X9 microprocessor features 64-bit architecture, 1170 terminals in a grid array package, and operates at speeds up to 1330 rpm. Ideal for industrial applications requiring high processing power and temperature resilience.
STM32MP157AAA3T
STM32MP157AAA3T by STMicroelectronics is a 32-bit microprocessor with 64 MHz clock frequency, 448 terminals, and 1.25 V max supply voltage. Ideal for industrial applications requiring low power consumption and high-speed processing in a compact form factor.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
LS1020AXE7KQB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE; Maximum Seated Height: 2.07 mm;
LS1046ASE8Q1A
LS1046ASE8Q1A by NXP Semiconductors is a microprocessor with a package shape of square and 780 terminals. It has a max seated height of 2.07 mm and operates at a speed of 64 rpm. This processor is commonly used in various applications requiring high-performance computing.
LS1020AXN7KQB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
LS1012ASN7HKA
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 211; Package Code: VFLGA; Package Shape: SQUARE;
LS1012AXE7KKB
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 211; Package Code: VFLGA; Package Shape: SQUARE;
LS1012ASE7EKB
LS1012AXN7KKB
LS1012AXN7KKB by NXP Semiconductors is a 64-bit microprocessor with 16-bit address and data bus width, operating at up to 25 MHz. Ideal for industrial applications, it features low power mode, integrated cache, and boundary scan support for efficient performance in compact designs.
LS1012ASE7KKB
LS1020ASN7HNB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
LS1012AXE7KKA
LS1012AXE7HKB
LS1012ASN7EKB
LS1012ASE7HKB
LS1012AXN7EKA
LS1012AXN7EKB
LS1012ASE7KKA
LS1012ASN7KKA
LS1012ASN7KKB
LS1012AXE7EKA
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved