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LS1012ASN7HKA

NXP Semiconductors

LS1012ASN7HKA by NXP Semiconductors

LS1012ASN7HKA by NXP Semiconductors is a 64-bit microprocessor with integrated cache, 16-bit address and external data bus width. It operates at a max clock frequency of 25 MHz, suitable for low power applications in various industries like IoT and networking due to its CMOS technology.

Median Price

$19.988

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 22 parts In-Stock

1+ parts

$15.080

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22

$15.080

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Chip1Stop

Japan . 22 parts In-Stock

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$18.300

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22

$18.300

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Mouser Electronics

USA . 38 parts In-Stock

1+ parts

$31.070

100+ parts

$21.280

1k+ parts

$19.600

10k+ parts

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38

$31.070

$21.280

$19.600

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Flip Electronics (Authorized)

USA . 2,720 parts In-Stock

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2,720

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Rochester

USA . 1,059 parts In-Stock

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$17.340

1k+ parts

$15.510

10k+ parts

$14.600

1,059

-

$17.340

$15.510

$14.600

DigiKey

USA . 1,059 parts In-Stock

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100+ parts

$22.810

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1,059

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$22.810

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Verical

USA . 542 parts In-Stock

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100+ parts

$21.675

1k+ parts

$19.387

10k+ parts

$18.250

542

-

$21.675

$19.387

$18.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,564 parts In-Stock

1+ parts

$14.326

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3,564

$14.326

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Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$25.550

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650

$25.550

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Flip Electronics

USA . 2,717 parts In-Stock

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2,717

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Anansix

USA . 2,517 parts In-Stock

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DigiKey Marketplace

USA . 736 parts In-Stock

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736

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Vyrian

USA . 542 parts In-Stock

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542

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Distributors (Availability)

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Ampacity Inc.

Singapore . 116 parts In-Stock

1+ parts

$12.820

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116

$12.820

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Corphita

USA . 4,784 parts In-Stock

1+ parts

$13.572

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4,784

$13.572

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Continental Prestige Electronics

USA . 168 parts In-Stock

1+ parts

$17.390

100+ parts

$12.930

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168

$17.390

$12.930

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Netroflash

USA . 50 parts In-Stock

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$25.550

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50

$25.550

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Microchip USA

USA . 1,315 parts In-Stock

1+ parts

$60.320

100+ parts

$59.270

1k+ parts

$58.750

10k+ parts

$58.220

1,315

$60.320

$59.270

$58.750

$58.220

UNI Independent Distributors

Spain . 7,327 parts In-Stock

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7,327

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Argo Parts USA

USA . 3,447 parts In-Stock

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3,447

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Overview

Unlock limitless possibilities with the LS1012ASN7HKA by NXP Semiconductors. This cutting-edge microprocessor offers integrated cache, superior performance, and low power consumption, making it ideal for a wide range of applications. NXP Semiconductors, known for their high-quality products, delivers exceptional value with this innovative solution. Experience seamless operation and unmatched efficiency with the LS1012ASN7HKA, setting new standards in the world of microprocessors.

Feature Benefit Bullets

Integrated Cache: YES

Having integrated cache helps improve the overall performance of the microprocessor by reducing the time it takes to access frequently used data and instructions.

Surface Mount: YES

Surface mount technology allows for compact and efficient assembly of electronic components, making it easier to integrate the microprocessor into circuit boards.

Maximum Supply Voltage: 0.93 V

Operating at a low maximum supply voltage of 0.93 V helps reduce power consumption and heat generation, making it an energy-efficient choice.

Address Bus Width: 16

Having a wide address bus width of 16 bits allows the microprocessor to access a large memory space efficiently, which is essential for handling complex tasks.

Package Shape: SQUARE

The square package shape provides a compact form factor, making it easier to design and integrate the microprocessor into various electronic devices.

Bit Size: 64

With a 64-bit architecture, the microprocessor is capable of handling large amounts of data and performing complex calculations, making it suitable for high-performance applications.

No. of Terminals: 211

Having a high number of terminals allows for efficient connectivity and communication with other components in the system, enhancing the overall functionality of the microprocessor.

Minimum Supply Voltage: 0.87 V

The low minimum supply voltage of 0.87 V further contributes to the energy efficiency of the microprocessor, helping to reduce power consumption and operating costs.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C ensures reliable performance in challenging environments with elevated temperatures.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0°C makes this microprocessor suitable for a wide range of applications, including those in cold environments.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies the assembly process and contributes to a more compact and space-efficient design of the microprocessor.

Maximum Seated Height: 0.925 mm

The low maximum seated height of 0.925 mm allows for a slimmer profile of the microprocessor, making it suitable for applications where space is limited.

Width: 9.6 mm

With a compact width of 9.6 mm, the microprocessor can be easily integrated into various electronic devices without taking up much space.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the microprocessor during production, ensuring high quality and reliability of the final product.

External Data Bus Width: 16

The wide external data bus width of 16 bits allows for fast and efficient data transfer between the microprocessor and external memory or peripherals.

Maximum Clock Frequency: 25 MHz

Operating at a maximum clock frequency of 25 MHz enables the microprocessor to perform tasks quickly and efficiently, making it suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum time of 40 seconds at peak reflow temperature, the microprocessor can withstand the reflow soldering process without any damage, ensuring reliable assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C meets industry standards for soldering processes, ensuring proper functioning and longevity of the microprocessor.

Length: 9.6 mm

With a length of 9.6 mm, the microprocessor maintains a compact form factor, allowing for easy integration into electronic devices with limited space.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computing) microprocessor allows for efficient execution of instructions, resulting in improved performance and reduced power consumption.

Technology: CMOS

Using CMOS (Complementary Metal-Oxide-Semiconductor) technology provides low power consumption, high noise immunity, and faster switching speeds, making it an ideal choice for the microprocessor.

Terminal Form: NO LEAD

The no lead terminal form simplifies assembly processes and provides better electrical performance, contributing to the overall reliability of the microprocessor.

Nominal Supply Voltage: 0.9 V

Operating at a nominal supply voltage of 0.9 V strikes a balance between performance and energy efficiency, making the microprocessor suitable for a wide range of applications.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, the microprocessor offers efficient connectivity and compatibility with standard PCB designs, facilitating easier integration into electronic systems.

Format: FIXED POINT

The fixed-point format allows for efficient arithmetic calculations and data processing, making the microprocessor suitable for applications that require precise and fast computations.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the microprocessor is suitable for reflow soldering processes and offers reliable performance in humid environments.

Speed: 800 rpm

Operating at a speed of 800 rpm ensures efficient processing of instructions and data, making the microprocessor suitable for high-performance computing applications.

Low Power Mode: YES

The availability of low power mode helps reduce power consumption during idle or low-demand periods, increasing energy efficiency and prolonging battery life in portable devices.

Technical Specifications

Microprocessors LS1012ASN7HKA attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

16

Bit Size:

64

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-XBGA-N211

Length:

9.6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

211

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.925 mm

Speed:

800 rpm

Maximum Supply Voltage:

.93 V

Minimum Supply Voltage:

.87 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9.6 mm

Peripheral IC Type:

Trade Compliance

LS1012ASN7HKA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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